IHLM-2525CZ-01
Vishay Dale
Molded, Low Profile, High Current Inductor
FEATURES
•
•
•
•
•
•
•
•
Lowest molded height (3.0mm) in this package footprint.
Shielded construction.
Frequency range up to 5.0MHz.
Lowest DCR/µH, in this package size.
Handles high transient current spikes without saturation.
Ultra low buzz noise, due to composite construction.
100% lead (Pb)-free.
Encapsulated body offers improved environmental
protection and moisture resistance
• Higher dielectric withstanding voltage vs IHLP
• Flame retardant encapsulant (UL 94V-0)
• Corrosion resistant package
Manufactured under one or more of the following:
US Patents; 6,198,375 / 6,204,744 / 6,449,829 / 6,460,244.
Several foreign patents, and other patents pending.
STANDARD ELECTRICAL SPECIFICATIONS
Lo
DCR m
Ω
DCR m
Ω
HEAT RATING
INDUCTANCE TYPICAL MAX
CURRENT
µ
H
±
20%
25
°
C
25
°
C
DC AMPS
3
@100KHz, .25V, 0A
TYPICAL
0.10
1.5
1.7
32.5
0.15
1.9
2.5
26
0.20
2.4
3.0
24
0.22
2.5
2.8
23
0.33
3.5
3.9
20
0.47
4
4.2
17.5
0.68
5
5.5
15.5
0.82
6.7
8
13
1.0
9
10
11
1.5
14
15
9
2.2
18
20
8
3.3
28
30
6
4.7
37
40
5.5
6.8
54
60
4.5
8.2
64
68
4
10
102
105
3
SATURATION
CURRENT
DC AMPS
4
TYPICAL
60
52
41
40
30
26
25
24
22
18
14
13.5
10
8
7.5
7.0
APPLICATIONS
•
•
•
•
•
•
•
PDA/Notebook/Desktop/Server applications.
High current POL converters.
Low profile, high current power supplies.
Battery powered devices.
DC/DC converters in distributed power systems.
DC/DC converter for Field Programmable Gate Array (FPGA).
Harsh environments including moisture, chemicals and
salt spray.
DIMENSIONS
in inches [millimeters]
Typical Pad Layout (Min.)
0.255
±
0.010
[6.47
±
0.254]
0.125
[3.18]
0.146
[3.71]
0.290
[7.37]
0.270
±
0.015
[6.86
±
0.381]
0.135
[3.43]
NOTES:
1. All test data is referenced to 25°C ambient.
2. Operating Temperature Range - 55°C to + 125°C
3. DC current (A) that will cause an approximate
∆T
of 40°C.
4. DC current (A) that will cause Lo to drop approximately 20%
5. The part temperature (ambient + temp rise) should not exceed
125°C under worst case operating conditions. Circuit design,
component placement, PWB trace size and thickness, airflow
and other cooling provisions all affect the part temperature. Part
temperature should be verified in the end application.
0.118 [3.0] Max.
DESCRIPTION
IHLM-2525CZ-01
MODEL
1.0
µ
H
INDUCTANCE VALUE
0.050
±
0.012
[1.27
±
0.30]
±
20%
INDUCTANCE
TOLERANCE
SAP PART NUMBERING GUIDELINES (INTERNAL)
I
H
L
M
2
5
2
SIZE
5
C
Z
E
R
1
R
0
M
TOL.
0
1
PRODUCT FAMILY
See the end of this data book for conversion tables
PACKAGE
CODE
INDUCTANCE
VALUE
SERIES
www.vishay.com
12
For technical questions, contact Magnetics@vishay.com
Document Number 34172
Revision 22-Oct-04
FPGA/CPLD
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