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FW80200M400: 产品描述RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA241; 产品类别微控制器和处理器; 文件大小269KB，共36页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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FW80200M400概述

RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA241

FW80200M400规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Intel(英特尔)
包装说明	BGA, BGA241,17X17,50
Reach Compliance Code	unknown
Is Samacsys	N
位大小	32
JESD-30 代码	S-PBGA-B241
端子数量	241
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA241,17X17,50
封装形状	SQUARE
封装形式	GRID ARRAY
电源	1.3,3.3 V
认证状态	Not Qualified
速度	400 MHz
表面贴装	YES
技术	CMOS
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC
Base Number Matches	1

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Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

Datasheet - Commercial and Extended Temperature (80200T)

Product Features

High Performance Processor based on

Intel

XScale

™

Microarchitecture

— 7-8 stage Intel

Superpipelined

Technology

— 32-Entry Instruction Memory

Management Unit

— 32-Entry Data Memory Management

Unit

— 32 KByte, 32-way Set Associative

Instruction Cache

— 32 KByte, 32-way Set Associative Data

Cache

— 2 KByte, 2-way Set Associative

Mini-Data Cache

— 128-Entry Branch Target Buffer

— 8-Entry Write Buffer

— 4-Entry Fill and Pend Buffers

Intel

Dynamic Voltage Management

— Core Voltage Range: 0.95 V to 1.55 V

— Internal Clock Scalable by Software

— Input Clock: 33-66 MHz

ARM* Version 5TE Compliant

Application-Code Compatible with

Intel

StrongARM* SA-110

Power Management

— Core Power is ~500mW at 600MHz

— Core Voltage Operation Down to 0.95 V

— Idle and Sleep Modes

Intel

Media Processing Technology

— Multiply-Accumulate Coprocessor

High Performance External Bus

— 64- or 32-Bit Data Interface

— Optional ECC Protection

— Frequency up to 100 MHz

— Asynchronous to Processor Clock

Performance Monitoring Unit

— Two 32-Bit Event Counters

— One 32-Bit Clock Counter

— Monitors Occurrence and Duration

Events

Debug Unit

— Accessible through JTAG Port

— Hardware Breakpoints

— 256-Entry Trace Buffer

80200T can operate at an ambient

temperature range of -40C to +85C

January 2003

Reference Number: 273414-005

Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT.

Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling

1-800-548-4725 or by visiting Intel's website at http://www.intel.com.

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DM3, EtherExpress, ETOX, FlashFile, GatherRound, i386, i486, iCat, iCOMP, Insight960, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740,

IntelDX2, IntelDX4, IntelSX2, Intel ChatPad, Intel Create&Share, Intel Dot.Station, Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel

NetBurst, Intel NetStructure, Intel Play, Intel Play logo, Intel Pocket Concert, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation,

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logo, OverDrive, Paragon, PC Dads, PC Parents, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your Command, ProShare,

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TokenExpress, Trillium, Vivonic, and VTune are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and

other countries.

*Other names and brands may be claimed as the property of others.

January 2003

Datasheet - Commercial and Extended Temperature (80200T)

Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

Contents

1.0

2.0

About this Document .......................................................................................................... 5

Functional Overview........................................................................................................... 5

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

2.14

3.0

3.1

Superpipeline ........................................................................................................7

Branch Target Buffer (BTB)................................................................................... 8

Instruction Memory Management Unit (IMMU) ..................................................... 8

Data Memory Management Unit (DMMU)............................................................. 9

Instruction Cache (I-Cache) .................................................................................. 9

Data Cache (D-Cache)........................................................................................10

Mini-Data Cache..................................................................................................10

Fill Buffer (FB) and Pend Buffer (PB) ..................................................................11

Write Buffer (WB) ................................................................................................11

Multiply-Accumulate Coprocessor (CP0) ............................................................11

Clock and Power Management ...........................................................................12

Performance Monitoring Unit (PMU) ...................................................................12

Debug Unit ..........................................................................................................12

Extended Temperature (80200T) ........................................................................12

Package Introduction...........................................................................................13

3.1.1 Functional Signal Definitions ..................................................................13

3.1.1.1 Signal Pin Descriptions .............................................................13

3.1.2 241 Lead PBGA Package ......................................................................17

Package Thermal Specifications .........................................................................22

Package Thermal Resistance .............................................................................22

Absolute Maximum Ratings.................................................................................24

CCA

Pin Requirements ......................................................................................25

Targeted DC Specifications.................................................................................26

Targeted AC Specifications.................................................................................27

4.4.1 Clock Signal Timings..............................................................................27

4.4.2 Bus Signal Timings.................................................................................28

4.4.3 Boundary Scan Test Signal Timings ......................................................29

AC Timing Waveforms ........................................................................................30

Power Sequence .................................................................................................32

Reset Timing .......................................................................................................34

AC Test Conditions .............................................................................................34

Typical Power Dissipation ...................................................................................35

Package Information ........................................................................................................13

3.2

3.3

4.0

4.1

4.2

4.3

4.4

Electrical Specifications....................................................................................................24

4.5

4.6

4.7

4.8

4.9

Datasheet - Commercial and Extended Temperature (80200T)

January 2003

Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

Figures

Intel

80200 Processor Block Diagram ................................................................. 6

241-Lead PBGA Package ................................................................................... 17

Case Temperature with No Air Flow ................................................................... 23

Case Temperature at Nominal Power Dissipation .............................................. 23

CCA

Lowpass Filter............................................................................................ 25

CLK Waveform.................................................................................................... 30

MCLK Waveform................................................................................................. 30

Output Delay Waveform .............................................................................. 31

Correct Power Sequence for V

, V

CCP ............................................................................. 32

Another Correct Power Sequence for V

, V

CCP ............................................................32

Incorrect Power Sequence for V

, V

CCP........................................................................... 32

Preferred Power Sequence for VCC, VCCa ....................................................... 33

Correct Power Sequence for VCC, VCCa........................................................... 33

Pins’ State at Reset............................................................................................. 34

AC Test Load ...................................................................................................... 34

Typical Pin Power Dissipation............................................................................. 35

Typical Core Power Dissipation .......................................................................... 35

Tables

Related Documentation......................................................................................... 5

Pin Description Nomenclature............................................................................. 13

Signal Pin Description ......................................................................................... 14

Power Pins .......................................................................................................... 14

JTAG Pins ........................................................................................................... 16

241-Lead PBGA Pinout — Ballpad Number Order ............................................. 18

241-Lead PBGA Pinout — Signal Name Order .................................................. 20

Package Thermal Resistance — °C/Watt ........................................................... 22

Operating Conditions .......................................................................................... 24

Voltage Range Requirements for Intel

80200 Processor Product Options ....... 24

DC Characteristics .............................................................................................. 26

Characteristics .............................................................................................. 26

Input Clock Timings............................................................................................. 27

Output Timings.................................................................................................... 28

Input Timings....................................................................................................... 28

Boundary Scan Test Signal Timings ................................................................... 29

January 2003

Datasheet - Commercial and Extended Temperature (80200T)

FW80200M400相似产品对比

	FW80200M400	FW80200M600
描述	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA241	RISC Microprocessor, 32-Bit, 600MHz, CMOS, PBGA241
是否Rohs认证	不符合	不符合
厂商名称	Intel(英特尔)	Intel(英特尔)
包装说明	BGA, BGA241,17X17,50	BGA, BGA241,17X17,50
Reach Compliance Code	unknown	unknown
Is Samacsys	N	N
位大小	32	32
JESD-30 代码	S-PBGA-B241	S-PBGA-B241
端子数量	241	241
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA
封装等效代码	BGA241,17X17,50	BGA241,17X17,50
封装形状	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY
电源	1.3,3.3 V	1.5,3.3 V
认证状态	Not Qualified	Not Qualified
速度	400 MHz	600 MHz
表面贴装	YES	YES
技术	CMOS	CMOS
端子形式	BALL	BALL
端子节距	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1

FW80200M400

FW80200M400概述

FW80200M400规格参数

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FW80200M400相似产品对比

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