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Datasheet> 器件分类 > 驱动程序和接口> MCP1403-E/PA
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MCP1403-E/PA

产品描述4.5 A BUF OR INV BASED MOSFET DRIVER, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8
产品类别驱动程序和接口   
文件大小887KB，共22页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准  
下载文档 详细参数 选型对比 全文预览

MCP1403-E/PA概述

4.5 A BUF OR INV BASED MOSFET DRIVER, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8

MCP1403-E/PA规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Microchip(微芯科技)
零件包装代码DIP
包装说明0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8
针数8
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
高边驱动器NO
接口集成电路类型BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码R-PDIP-T8
JESD-609代码e3
长度9.46 mm
功能数量1
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
标称输出峰值电流4.5 A
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度（摄氏度）NOT SPECIFIED
认证状态Not Qualified
座面最大高度4.32 mm
最大供电电压18 V
最小供电电压4.5 V
表面贴装NO
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
断开时间0.065 µs
接通时间0.065 µs
宽度7.62 mm
Base Number Matches1

文档预览

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MCP1403/4/5
4.5A Dual High-Speed Power MOSFET Drivers
Features
• High Peak Output Current: 4.5A (typ.)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 2200 pF in 15 ns
- 5600 pF in 34 ns
• Short Delay Times: 40 ns (typ.)
• Low Supply Current:
- With Logic ‘1’ Input – 1.0 mA (typ.)
- With Logic ‘0’ Input – 150 µA (typ.)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing
Up To 5V
• Packages: 8-Pin SOIC, PDIP, 8-Pin 6x5 DFN,
and 16-Pin SOIC
General Description
The MCP1403/4/5 are a family of dual-inverting, dual-
non-inverting, or complimentary output drivers. They
can delivery high peak currents of 4.5A typically into
capacitive loads. These devices also feature low shoot-
through current, matched rise/fall times and
propagation delays.
The MCP1403/4/5 drivers operate from a 4.5V to 18V
single power supply and can easily charge and
discharge 2200 pF gate capacitance in under 15 ns
(typ). They provide low enough impedances in both the
on and off states to ensure the MOSFETs intended
state will not be affected, even by large transients. The
input to the MCP1403/4/5 may be driven directly from
either TTL or CMOS (3V to 18V).
The MCP1403/4/5 dual-output 4.5A driver family is
offered in both surface-mount and pin-through-hole
packages with a -40
o
C to +125
o
C temperature rating.
The low thermal resistance of the thermally enhanced
DFN package allows for greater power dissipation
capability for driving heavier capacitive or resistive
loads.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin. All
terminals are fully protect against Electrostatic
Discharge (ESD) up to 4 kV.
Applications
•
•
•
•
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Motor and Solenoid Drive
Package Types
MCP1404
8-Pin
MCP1405
MCP1403
PDIP/SOIC
NC
IN A
GND
IN B
1
2
3
4
8
7
6
5
16-Pin SOIC
NC
IN A
NC
GND
GND
NC
IN B
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
MCP1404
MCP1403
MCP1405
NC
OUT A
OUT A
V
DD
V
DD
OUT B
OUT B
NC
NC
OUT A
OUT A
V
DD
V
DD
OUT B
OUT B
NC
NC
OUT A
OUT A
V
DD
V
DD
OUT B
OUT B
NC
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
8-Pin DFN
(2)
NC
1
IN A
2
GND
3
IN B
4
8
7
6
5
MCP1404
MCP1403
MCP1405
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
Note 1:
Duplicate pins must both be connected for
proper operation.
2:
Exposed pad of the DFN package is electrically
isolated.
©
2006 Microchip Technology Inc.
DS22022A-page 1

MCP1403-E/PA相似产品对比

MCP1403-E/PA MCP1403-E/OA MCP1403T-E/OA MCP1405-E/PA MCP1404T-E/OA MCP1404-E/OA MCP1404-E/PA MCP1405-E/OA MCP1405T-E/OA
描述 4.5 A BUF OR INV BASED MOSFET DRIVER, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 4.5 A BUF OR INV BASED MOSFET DRIVER, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
零件包装代码 DIP SOIC SOIC DIP SOIC SOIC DIP SOIC SOIC
包装说明 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 DIP, SOP, SOP8,.25 SOP, SOP8,.25 DIP, SOP, SOP8,.25 SOP, SOP8,.25
针数 8 8 8 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compli compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
高边驱动器 NO NO NO NO NO NO NO NO NO
接口集成电路类型 BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3 e3
长度 9.46 mm 4.9 mm 4.9 mm 9.46 mm 4.9 mm 4.9 mm 9.46 mm 4.9 mm 4.9 mm
功能数量 1 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8 8
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
标称输出峰值电流 4.5 A 4.5 A 4.5 A 4.5 A 4.5 A 4.5 A 4.5 A 4.5 A 4.5 A
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP SOP DIP SOP SOP DIP SOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度（摄氏度） NOT SPECIFIED 260 260 NOT SPECIFIED 260 260 NOT SPECIFIED 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.32 mm 1.75 mm 1.75 mm 4.32 mm 1.75 mm 1.75 mm 4.32 mm 1.75 mm 1.75 mm
最大供电电压 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
表面贴装 NO YES YES NO YES YES NO YES YES
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
端子节距 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED 40 40 NOT SPECIFIED 40 40 NOT SPECIFIED 40 40
断开时间 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs
接通时间 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs 0.065 µs
宽度 7.62 mm 3.91 mm 3.91 mm 7.62 mm 3.91 mm 3.91 mm 7.62 mm 3.91 mm 3.91 mm
湿度敏感等级 - 1 1 - 1 1 - 1 1
封装等效代码 - SOP8,.25 SOP8,.25 - SOP8,.25 SOP8,.25 - SOP8,.25 SOP8,.25
电源 - 4.5/18 V 4.5/18 V - 4.5/18 V 4.5/18 V - 4.5/18 V 4.5/18 V
技术 - CMOS CMOS - CMOS CMOS - CMOS CMOS

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