LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN
参数名称 | 属性值 |
是否无铅 | 不含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | SOIC |
包装说明 | TSSOP, |
针数 | 5 |
Reach Compliance Code | unknown |
系列 | LVC/LCX/Z |
JESD-30 代码 | R-PDSO-G5 |
JESD-609代码 | e1 |
长度 | 2 mm |
逻辑集成电路类型 | INVERTER |
湿度敏感等级 | 1 |
功能数量 | 1 |
输入次数 | 1 |
端子数量 | 5 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 11 ns |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.65 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN SILVER COPPER |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 1.25 mm |
Base Number Matches | 1 |
SN74LVC1G14DCKR | SN74LVC1G14DBVR | SN74LVC1G14DCKT | SN74LVC1G14YEPR | SN74LVC1G14YZPR | SN74LVC1G14DBVT | SN74LVC1G14YEAR | SN74LVC1G14DRLR | SN74LVC1G14YZVR | |
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描述 | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN | Inverter, | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, BGA5, DSBGA-5 | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, BGA5, GREEN, DSBGA-5 | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, BGA5, MO-211EA, DSBGA-5 | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5, GREEN, PLASTIC, SOT-553, 5 PIN | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, BGA4, GREEN, DSBGA-4 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | SOIC | SOT-23 | SOIC | BGA | BGA | SOT-23 | DSBGA | SOT | BGA |
包装说明 | TSSOP, | LSSOP, | TSSOP, | DSBGA-5 | GREEN, DSBGA-5 | LSSOP, | MO-211EA, DSBGA-5 | GREEN, PLASTIC, SOT-553, 5 PIN | GREEN, DSBGA-4 |
针数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 4 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-XBGA-B5 | R-XBGA-B5 | R-PDSO-G5 | R-XBGA-B5 | R-PDSO-F5 | S-XBGA-B4 |
长度 | 2 mm | 2.9 mm | 2 mm | 1.4 mm | 1.4 mm | 2.9 mm | 1.4 mm | 1.6 mm | 0.9 mm |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 4 |
最高工作温度 | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | TSSOP | LSSOP | TSSOP | VFBGA | VFBGA | LSSOP | VFBGA | VSOF | VFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
传播延迟(tpd) | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns |
座面最大高度 | 1.1 mm | 1.45 mm | 1.1 mm | 0.5 mm | 0.5 mm | 1.45 mm | 0.5 mm | 0.6 mm | 0.5 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
标称供电电压 (Vsup) | 3.3 V | 1.8 V | 3.3 V | 1.8 V | 3.3 V | 3.3 V | 1.8 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | BALL | BALL | GULL WING | BALL | FLAT | BALL |
端子节距 | 0.65 mm | 0.95 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.95 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | DUAL | BOTTOM | DUAL | BOTTOM |
宽度 | 1.25 mm | 1.6 mm | 1.25 mm | 0.9 mm | 0.9 mm | 1.6 mm | 0.9 mm | 1.2 mm | 0.9 mm |
JESD-609代码 | e1 | - | e4 | e0 | e1 | e4 | e0 | e4 | e1 |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
端子面层 | TIN SILVER COPPER | - | NICKEL PALLADIUM GOLD | TIN LEAD | TIN SILVER COPPER | NICKEL PALLADIUM GOLD | TIN LEAD | NICKEL PALLADIUM GOLD | TIN SILVER COPPER |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
是否Rohs认证 | - | - | - | 不符合 | 符合 | 符合 | 不符合 | 符合 | 符合 |
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