16X4 OTHER FIFO, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 16 MHz |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.915 mm |
| 内存密度 | 64 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 16 words |
| 字数代码 | 16 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16X4 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL/SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 0.17 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 74F403SPC | 74F403QC | 54F403FM | 74F403SC | 74F403SDC | 74F403FC | 54F403SDM | 54F403LM | 74F403LC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 16X4 OTHER FIFO, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | 16X4 OTHER FIFO, PQCC28, PLASTIC, CC-28 | 16X4 OTHER FIFO, CDFP24, CERAMIC, FP-24 | 16X4 OTHER FIFO, PDSO24, SOIC-24 | 16X4 OTHER FIFO, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | 16X4 OTHER FIFO, CDFP24, CERAMIC, FP-24 | 16X4 OTHER FIFO, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | 16X4 OTHER FIFO, CQCC28, CERAMIC, LCC-28 | 16X4 OTHER FIFO, CQCC28, CERAMIC, LCC-28 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | QFN | DFP | SOIC | DIP | DFP | DIP | QLCC | QLCC |
| 包装说明 | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DFP, FL24,.4 | SOP, SOP24,.4 | DIP, DIP24,.3 | DFP, | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, |
| 针数 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-PDIP-T24 | S-PQCC-J28 | R-GDFP-F24 | R-PDSO-G24 | R-GDIP-T24 | R-GDFP-F24 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 |
| 内存密度 | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 28 | 28 |
| 字数 | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| 字数代码 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| 组织 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCJ | DFP | SOP | DIP | DFP | DIP | QCCN | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | FLATPACK | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL | PARALLEL/SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 4.57 mm | 2.286 mm | 2.65 mm | 5.715 mm | 2.286 mm | 5.715 mm | 1.905 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | FLAT | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
| 宽度 | 7.62 mm | 11.43 mm | 9.4615 mm | 7.5 mm | 7.62 mm | 9.4615 mm | 7.62 mm | 11.43 mm | 11.43 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
| 最大时钟频率 (fCLK) | 16 MHz | 61 MHz | 16 MHz | 61 MHz | 16 MHz | - | 16 MHz | 16 MHz | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 | - |
| 长度 | 31.915 mm | 11.43 mm | 15.435 mm | 15.4 mm | - | 15.435 mm | - | 11.43 mm | 11.43 mm |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | - | OTHER FIFO | OTHER FIFO | - |
| 封装等效代码 | DIP24,.3 | LDCC28,.5SQ | FL24,.4 | SOP24,.4 | DIP24,.3 | - | DIP24,.3 | LCC28,.45SQ | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | - |
| 最大压摆率 | 0.17 mA | 0.17 mA | 0.17 mA | 0.17 mA | 0.17 mA | - | 0.17 mA | 0.17 mA | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
