MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
Vishay Beyschlag
Professional Thin Film Chip Resistors
FEATURES
•
Approved according to EN 140401-801
•
Excellent overall stability: Class 0.5
•
Professional tolerance of value: ± 0.5 % and ± 1 %
•
Lead (Pb)-free solder contacts
•
Compliant to RoHS directive 2002/95/EC
APPLICATIONS
•
•
•
•
MCS 0402, MCT 0603, MCU 0805 and MCA 1206
Professional Thin Film Flat Chip Resistors are the perfect
choice for most fields of modern professional electronics
where reliability and stability is of major concern. Typical
applications include telecommunication, medical equipment
and high-end computer and audio/video electronics.
Automotive
Telecommunication
Medical equipment
Industrial equipment
METRIC SIZE
INCH:
METRIC:
0402
RR 1005M
0603
RR 1608M
0805
RR 2012M
1206
RR 3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
Metric size
Resistance range
Resistance tolerance
Temperature coefficient
Operation mode
Climatic category (LCT/UCT/days)
Rated dissipation,
P
70 (1)
Operating voltage,
U
max.
AC/DC
Film temperature
Max. resistance change at
P
70
for resistance range,
|ΔR/R| max., after:
1000 h
8000 h
225 000 h
Insulation voltage:
1 min;
U
ins
Continuous
Failure rate: FIT
observed
75 V
75 V
≤
0.1 x 10
-9
/h
100 V
75 V
≤
0.1 x 10
-9
/h
200 V
75 V
≤
0.1 x 10
-9
/h
300 V
75 V
≤
0.1 x 10
-9
/h
125
°C
Standard
55/125/56
0.063 W
50 V
155
°C
125
°C
Power
55/155/56
0.1 W
Standard
55/125/56
0.1 W
MCS 0402
RR 1005M
10
Ω
to 4.99 MΩ
MCT 0603
RR 1608M
1
Ω
to 10 MΩ
MCU 0805
RR 2012M
1
Ω
to 10 MΩ
MCA 1206
RR 3216M
1
Ω
to 2 MΩ
± 1 %; ± 0.5 %
± 50 ppm/K; ± 25 ppm/K
Power
55/155/56
0.125 W
75 V
155
°C
Standard
55/125/56
0.125 W
150 V
125
°C
155
°C
Power
55/155/56
0.2 W
Standard
55/125/56
0.25 W
200 V
125
°C
155
°C
Power
55/155/56
0.4 W
10
Ω
to 4.99 MΩ
≤
0.25 %
≤
0.5 %
≤
1.5 %
≤
0.5 %
≤
1.0 %
1
Ω
to 10 MΩ
≤
0.25 %
≤
0.5 %
≤
1.5 %
≤
0.5 %
≤
1.0 %
1
Ω
to 10 MΩ
≤
0.25 %
≤
0.5 %
≤
1.5 %
≤
0.5 %
≤
1.0 %
1
Ω
to 10 MΩ
≤
0.25 %
≤
0.5 %
≤
1.5 %
≤
0.5 %
≤
1.0 %
Notes
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded.
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Document Number: 28705
Revision: 20-Nov-09
For technical questions, contact:
thinfilmchip@vishay.com
www.vishay.com
191
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
Professional Thin Film Chip Resistors
DIMENSIONS
T
1
Vishay Beyschlag
W
W
T
H
T
2
L
DIMENSIONS AND MASS
TYPE
MCS 0402
MCT 0603
MCU 0805
MCA 1206
H
(mm)
0.32 ± 0.05
0.45 + 0.1/- 0.05
0.45 + 0.1/- 0.05
0.55 ± 0.1
L
(mm)
1.0 ± 0.05
1.55 ± 0.05
2.0 ± 0.1
3.2 ± 0.1/- 0.2
W
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
W
T
(mm)
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
T
1
(mm)
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
T
2
(mm)
0.2 ± 0.1
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
MASS
(mg)
0.6
1.9
4.6
9.2
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE
G
(mm)
-
0.55
0.80
1.40
Y
(mm)
-
1.10
1.25
1.50
X
(mm)
-
1.10
1.50
1.90
Z
(mm)
-
2.75
3.30
4.40
G
(mm)
0.35
0.65
0.90
1.50
REFLOW SOLDERING
Y
(mm)
0.55
0.70
0.90
1.15
X
(mm)
0.55
0.95
1.40
1.75
Z
(mm)
1.45
2.05
2.70
3.80
MCS 0402
MCT 0603
MCU 0805
MCA 1206
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the
reliability of the assembly.
Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on board materials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.
Document Number: 28705
Revision: 20-Nov-09
For technical questions, contact:
thinfilmchip@vishay.com
www.vishay.com
193
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
Vishay Beyschlag
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
Al
2
O
3
ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly cutting a meander
groove in the resistive layer without damaging the ceramics.
For the high and low ohmic range, optimized Cermet
products provide comparable properties. The resistor
elements are covered by a protective coating designed for
electrical, mechanical and climatic protection. The
terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with
IEC 60286-3
(3)
.
Professional Thin Film Chip Resistors
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification
EN 140401-801
which refers to
EN 60115-1,
EN 140400
and the variety of environmental test procedures
of the
IEC 60068
(3)
series. The detail specification refers to
the climatic category 55/125/56, which relates to the
“standard operation mode” of this datasheet.
Conformity is attested by the use of the
CECC
Logo (
the Mark of Conformity on the package label.
) as
Vishay BEYSCHLAG has achieved
“Approval of
Manufacturer”
in accordance with
IEC QC 001002-3,
clause 2.
The release certificate for
“Technology Approval
Schedule”
in accordance with
CECC 240001
based on
IEC QC 001002-3, clause 6
is granted for the
Vishay BEYSCHLAG manufacturing process.
RELATED PRODUCTS
This product family of thin film flat chip resistors is completed
by
Zero Ohm Jumpers.
For more information about products with better TCR and
tighter tolerance please refer to the
Precision Thin Film
Chip Resistors
datasheet document no.
28700.
On request, resistors are available with
established
reliability
in accordance with
EN 140401-801
version E.
Please refer to the special datasheet document no.
28744
for
information on failure rate level, available resistance ranges
and order codes.
Precision
chip resistor arrays
may be used in voltage
divider applications or precision amplifiers where close
matching between multiple resistors is necessary.
ACAS 0612 chip arrays are specified by the following
datasheets:
•
Professional type, document no.
28754
•
Precision type, document no.
28751
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1.
The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS compliant, the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the
GADSL
(1)
and the
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
•
2000/53/EC End of Vehicle life Directive (ELV) an Annex II
(ELV II)
•
2002/95/EC Restriction of the
Substances Directive (RoHS)
use
of
Hazardous
•
2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Notes
(1)
(2)
(3)
Global Automotive Declarable Substance List, see
www.gadsl.org
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see
www.eicta.org/index.php?id=995
→
issues
→
environment policy
→
chemicals
→
chemicals for electronics
The quoted IEC standards are also released as EN standards with the same number and identical contents
For technical questions, contact:
thinfilmchip@vishay.com
Document Number: 28705
Revision: 20-Nov-09
www.vishay.com
194
Microchip MCU
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