IC 8-BIT, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFP |
| 包装说明 | QCCJ, |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 具有ADC | NO |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| 最大时钟频率 | 16 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-CQCC-J44 |
| 长度 | 16.4465 mm |
| I/O 线路数量 | 32 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| PWM 通道 | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.83 mm |
| 最大压摆率 | 39 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 16.4465 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| 80C32-16/BMA | 80C52-12/BMA | 80C52-16/BMA | 80C32-12/BMA | 80C32-16/BQA | 80C52/BQA | 80C32/BQA | 80C52-16/BQA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC 8-BIT, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller | IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller | IC 8-BIT, 12 MHz, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller | IC 8-BIT, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller | IC 8-BIT, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller | IC 8-BIT, MROM, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller |
| 零件包装代码 | QFP | QFP | QFP | QFP | DIP | DIP | DIP | DIP |
| 包装说明 | QCCJ, | QCCJ, | QCCJ, | QCCJ, | DIP, | DIP, | DIP, | DIP, |
| 针数 | 44 | 44 | 44 | 44 | 40 | 40 | 40 | 40 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 16 MHz | 12 MHz | 16 MHz | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 16 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-CQCC-J44 | S-CQCC-J44 | S-CQCC-J44 | S-CQCC-J44 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 |
| I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 44 | 44 | 44 | 44 | 40 | 40 | 40 | 40 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | DIP | DIP | DIP | DIP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.83 mm | 4.83 mm | 4.83 mm | 4.83 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm |
| 最大压摆率 | 39 mA | 35 mA | 39 mA | 35 mA | 39 mA | 35 mA | 35 mA | 39 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 16.4465 mm | 16.4465 mm | 16.4465 mm | 16.4465 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
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