Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA -40 to 125
多核 DSP+ARM KeyStone II 片上系统 (SoC) 625-FCBGA -40 to 125
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | LFBGA, |
Reach Compliance Code | compliant |
地址总线宽度 | 16 |
边界扫描 | YES |
总线兼容性 | CAN; ETHERNET; I2C; PCI; SPI; UART; USB |
外部数据总线宽度 | 32 |
JESD-30 代码 | S-PBGA-B625 |
JESD-609代码 | e1 |
长度 | 21 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 212 |
端子数量 | 625 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
RAM(字数) | 1M |
座面最大高度 | 1.56 mm |
最大供电电压 | 1.05 V |
最小供电电压 | 0.95 V |
标称供电电压 | 1 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
宽度 | 21 mm |
66AK2G12ABYQ100 | 66AK2G12ABYA60E | 66AK2G12ABY100 | 66AK2G12ABY60 | 66AK2G12ABYA60 | 66AK2G12ABYA100 | 66AK2G12ABYA100E | |
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描述 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA -40 to 125 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA -40 to 105 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA 0 to 70 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA 0 to 70 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA -40 to 105 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA -40 to 105 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA -40 to 105 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | LFBGA, | LFBGA, BGA625,25X25,32 | LFBGA, BGA625,25X25,32 | LFBGA, BGA625,25X25,32 | LFBGA, BGA625,25X25,32 | LFBGA, BGA625,25X25,32 | LFBGA, BGA625,25X25,32 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
边界扫描 | YES | YES | YES | YES | YES | YES | YES |
总线兼容性 | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | CAN; ETHERNET; I2C; PCI; SPI; UART; USB |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
JESD-30 代码 | S-PBGA-B625 | S-PBGA-B625 | S-PBGA-B625 | S-PBGA-B625 | S-PBGA-B625 | S-PBGA-B625 | S-PBGA-B625 |
JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
长度 | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
I/O 线路数量 | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
端子数量 | 625 | 625 | 625 | 625 | 625 | 625 | 625 |
最高工作温度 | 125 °C | 105 °C | 90 °C | 90 °C | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
RAM(字数) | 1M | 1M | 1M | 1M | 1M | 1M | 1M |
座面最大高度 | 1.56 mm | 1.56 mm | 1.56 mm | 1.56 mm | 1.56 mm | 1.56 mm | 1.56 mm |
最大供电电压 | 1.05 V | 0.945 V | 1.05 V | 0.945 V | 0.945 V | 1.05 V | 1.05 V |
最小供电电压 | 0.95 V | 0.855 V | 0.95 V | 0.855 V | 0.855 V | 0.95 V | 0.95 V |
标称供电电压 | 1 V | 0.9 V | 1 V | 0.9 V | 0.9 V | 1 V | 1 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
Factory Lead Time | - | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks |
封装等效代码 | - | BGA625,25X25,32 | BGA625,25X25,32 | BGA625,25X25,32 | BGA625,25X25,32 | BGA625,25X25,32 | BGA625,25X25,32 |
uPs/uCs/外围集成电路类型 | - | MULTIFUNCTION PERIPHERAL | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MULTIFUNCTION PERIPHERAL | MULTIFUNCTION PERIPHERAL |
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