WIMA SMD-PEN
Metallized Polyethylene-Naphthalate (PEN)
SMD Film Capacitors with Box Encapsulation
D
Special Features
˜
Size codes 1812, 2220, 2824,
4030, 5040 and 6054 with PEN
and encapsulated
˜
Operating temperature up to 125° C
˜
Self-healing
˜
Suitable for lead-free soldering
˜
According to RoHS 2002/95/EC
Electrical Data
Capacitance range:
0.01
mF
to 4.7
mF
Rated voltages:
63 VDC, 100 VDC, 250 VDC, 400 VDC,
630 VDC, 1000 VDC
Capacitance tolerances:
±20%, ±10% (±5% available subject
to special enquiry)
Operating temperature range:
–55+ C to +125+ C
Climatic test category:
55/125/21 according to IEC
for size codes 1812 to 2824
55/125/56 according to IEC
for size codes 4030 to 6054
Insulation resistance
at +20+ C:
U
r
U
test
C
0.33
mF
3.75 x 10
3
M¸
(mean value: 1 x 10
4
M¸)
1 x 10
4
M¸
(mean value: 5 x 10
4
M¸)
63 VDC 50 V
100 VDC 100 V
250 VDC 100 V
Test voltage:
1.6 U
r
, 2 sec.
Voltage derating:
A voltage derating factor of 1.25 % per K
must be applied from +100) C for DC
voltages and from +90) C for AC
voltages
Reliability:
Operational life
300 000 hours
Failure rate
2 fit (0.5 x U
r
and 40+ C)
Typical Applications
For general DC-applications e.g.
˜
By-pass
˜
Blocking
˜
Coupling and decoupling
˜
Timing
Construction
Dielectric:
Polyethylene-Naphthalate (PEN) film
Capacitor electrodes:
Vacuum-deposited
Internal construction:
0.33
mF
< C
4.7
mF
1250 sec (M¸ x
mF)
(mean value: 3000 sec)
3000 sec (M¸ x
mF)
(mean value: 10 000 sec)
Measuring time: 1 min.
Dissipation factors
at +20) C: tan
d
at f
C
0.1
mF
8 x 10
-3
15 x 10
-3
30 x 10
-3
0.1
mF
< C
1.0
mF
8 x 10
-3
15 x 10
-3
–
C > 1.0
mF
10 x 10
-3
–
–
1 kHz
10 kHz
100 kHz
Plastic film
Vacuum-deposited
electrode
Metal contact layer
(schoopage)
Terminating plate
Maximum pulse rise time:
for pulses equal to the rated voltage
Capacitance
m
F
Pulse rise time V/
m
sec
max. operation/test
100 VDC 250 VDC 400 VDC
35/350
20/200
10/100
6/60
4/40
3/30
40/400
40/400
12/120
9/90
7/70
–
35/350
21/210
14/140
10/100
–
–
Encapsulation:
Solvent-resistant, flame-retardant plastic
case, UL 94 V-0
Terminations:
Tinned plates.
Marking:
Colour: Black.
63 VDC
30/300
20/200
10/100
8/80
3.5/35
3/30
630 VDC 1000 VDC
40/400
25/250
17/170
–
–
–
50/500
32/320
–
–
–
–
0.01
0.033
0.1
0.33
1.0
3.3
...
...
...
...
...
...
0.022
0.068
0.22
0.68
2.2
4.7
Dip Solder Test/Processing
Resistance to soldering heat:
Test Tb in accordance with DIN IEC
60068-2-58/DIN EN 60384-23.
Soldering bath temperature max. 260+ C.
Soldering duration max. 5 sec.
Change in capacitance
D
C/C
5 %.
Soldering process:
Wave soldering and re-flow soldering
(see temperature/time graphs page 14).
Packing
Available taped and reeled in 12 mm
blister pack.
Detailed taping information and graphs
at the end of the catalogue.
For further details and graphs please
refer to Technical Information.
20
11.08
D
Recommendation for Processing
and Application of SMD Capacitors
Layout Form
The components can generally be
positioned on the carrier material as
desired. In order to prevent soldering
shadows or ensure regular temperature
distribution, extreme concentration of
the components should be avoided. In
practice, it has proven best to keep a
minimum distance of the soldering
surfaces between two WIMA SMDs of
twice the height of the components.
Soldering Process
Re-flow soldering
Solder Pad Recommendation
H
d
W
b
a
L
c
d
Bonding slit
Size
code
1812
2220
2824
4030
5040
6054
L
± 0.3
4.8
5.7
7.2
10.2
12.7
15.3
W
± 0.3
3.3
5.1
6.1
7.6
10.2
13.7
d
0.5
0.5
0.5
0.5
0.7
0.7
a
b
c
min. min. max.
1.2 3.5 3.5
1.2 4
4.5
1.2 4
6.5
2.5 6
9
2.5 6 11.5
2.5 6 14
Temperature/time graph for the permissible processing temperature of the
WIMA SMD film capacitor for typical convection soldering processes.
Due to the diverse procedures and the
varying heat requirements of the different
types of components, an exact processing
temperature for re-flow soldering processes
cannot be specified. The graph shows the
upper limits of temperature and time which
must not be exceeded when establishing
the solder profile according to your actual
requirements.
A max. temperature of T = 210° C inside
the component should not be exceeded
when processing WIMA SMD capacitors.
The solder pad size recommendations
given for each individual series are to be
understood as minimum dimensions which
can at any time be adjusted to the layout
form.
SMD Handsoldering
WIMA SMD capacitors with plastic film
dielectric are generally suitable for hand-
soldering with a soldering iron where,
however, similar to automated soldering
processes, a certain duration and tempera-
ture should not be exceeded. These para-
meters are dependent on the physical size
of the components and the relevant heat
absorption involved.
Size code
1812
2220
2824
4030
5040
6054
Temperature ° C / ° F
225 / 437
225 / 437
250 / 482
260 / 500
260 / 500
260 / 500
The below data are to be regarded as
guideline values and should serve to avoid
damage to the dielectric caused by exces-
sive heat during the soldering process. The
soldering quality depends on the tool used
and on the skill and experience of the per-
son with the soldering iron in hand.
Processing
The processing of SMD components
–
–
–
–
assembling
soldering
washing
electrical final inspection/ calibrating
must be regarded as a complete process.
The soldering of the printed circuit board,
for example, can constitute considerable
stress on all the electronic components.
The manufacturer‘s instructions on the pro-
cessing of the components are mandatory.
Time duration
2 sec plate 1
3 sec plate 1
3 sec plate 1
5 sec plate 1
5 sec plate 1
5 sec plate 1
/
/
/
/
/
/
5
5
5
5
5
5
sec
sec
sec
sec
sec
sec
off
off
off
off
off
off
/
/
/
/
/
/
2
3
3
5
5
5
sec
sec
sec
sec
sec
sec
plate
plate
plate
plate
plate
plate
2
2
2
2
2
2
11.08
14
D
Solder Paste
To obtain the best soldering performance
we suggest the use of following solder
paste alloy:
Lead free solder paste
Sn - Bi
Sn - Zn (Bi)
Sn - Ag - Cu
Solder paste with lead
Sn - Pb - Ag (Sn60-Pb40-A, Sn63-Pb37-A)
Initial Operation/Calibration
Due to the stress which the components
are subjected to during processing, rever-
sible parameter changes occur in almost
all electronic components. The capaci-
tance recovery accuracy to be expected
with careful processing is within a scope of
DC/C
5 %.
For the initial operation of the device a
minimum storage time of
t
24 hours
is to be taken into account. With cali-
brated devices or when the application
is largely dependent on capacitance it is
advisable to prolong the storage time to
t
10 days
In this way ageing effects of the capacitor
structure can be anticipated. Parameter
changes due to processing are not to be
expected after this period of time
laid down by ISO 9001:2000 as well as
the guidelines for component specifications
set out by IEC quality assessment system
(IECQ-CECC) for electronic components.
Electrical Characteristics and
Fields of Application
Basically the WIMA SMD series have the
same electrical characteristics as the ana-
logous through-hole WIMA capacitors.
Compared to ceramic or tantalum
dielectrics WIMA SMD capacitors have a
number of other outstanding qualities :
”
favourable pulse rise time
”
low ESR
”
low dielectric absorption
”
available in high voltage series
”
large capacitance spectrum
”
stand up to high mechanical
stress
”
good long-term stability
As regards technical performance as well
as quality and reliability, the WIMA SMD
series offer the possibility to cover nearly
all applications of conventionally through-
hole film capacitors with SMD components.
Furthermore, the WIMA SMD series can
now be used for all the demanding
capacitor applications for which, in the
past, the use of through-hole components
was mandatory:
”
measuring techniques
”
oscillator circuits
”
differentiating and integrating
circuits
”
A/D or D/A transformers
”
sample and hold circuits
”
automotive electronics
With the WIMA SMD programme avai-
lable today, the major part of all plastic
film capacitors can be replaced by WIMA
SMD components. The field of application
ranges from standard coupling capacitors
to use in switch-mode power supplies as
filter or charging capacitors with high vol-
tage and capacitance values, as well as
in telecommunications e.g. the well-known
telephone capacitor 1
m
F/250VDC.
Washing
Basically, all plastic encapsuled compon-
ents, irrespective of the brand cannot be
considered as being hermetically sealed.
They are therefore only suitable for
industrial washing processes to a limited
extent. During the washing process,
washing agents can penetrate the interior
of the component by capillary action
through microcracks which might have
occured. This is dependent on a number of
parameters e.g
- washing agents
- viscosity of the washing solvent
- temperature/time of the washing
process
- mechanical washing aids such as
ultrasonic
water pressure
rinsing and spraying pressure
The type of washing agent to be used is
largely specific to the individual user or
is often laid down by the manufacturer of
the washing equipment. The agressiveness
of the washing agent to be used can thus
only be judged in appropriate test series
relating to each individual washing pro-
cess. By and large, the basic rule is that
the washing process should be carried out
as gently as possible.
Humidity Protection Bags
Taped WIMA SMD capacitors are
shipped in humidity protection bags
according to JEDEC standard, level 1
(EMI/static-shielding bags conforming
to MIL-B 81705, Type 1, Class 1).
Under controlled conditions the
components can be stored two years
and more in the originally sealed bag.
Opened packing units should be
consumed instantly or resealed for specific
storage under controlled conditions.
Reliability
Taking account of the manufacturer‘s
guidelines and compatible processing,
the WIMA SMD stand out for the same
high quality and reliability as the
analogous through-hole WIMA series. The
technology of metallized film capacitors
used e.g. in WIMA SMD-PET achieves
the best values for all fields of application.
The expected value is about:
Û
0
2 fit
Furthermore the production of all WIMA
components is subject to the regulations
Drying
During the washing process, aqueous
solutions can penetrate the component.
This can lead to changes in the electrical
parameters. Suitable drying measures
should ensure that no residual moisture or
traces of washing substances are left in
the component.
11.08
15
FPGA/CPLD
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