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SMLC6.5C-2
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Only One Name Means ProT
ek’Tion™
SMLC12C-2
LOW CAPACIT
ANCE TVS ARRA
Y
APPLICA
TIONS
✔
T1/E1
✔
RS-422, RS-423 & RS-485
✔
SDH/SONET, ATM Equipment & Systems
✔
Industrial Controls & Monitoring
✔
Cable Modem Intra-Building Protection
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
✔
61000-4-5 (Surge): 8/20µs - 95A, L4(Line-Gnd) & 48A, L4(Line-Line) & 83A, L2(Power)
FEA
TURES
✔
3,600 Watts Peak Pulse Power per Line (tp=8/20µs)
✔
600 Watts Peak Pulse Power per Line (tp=10/1000µs)
✔
100A (2/10µs) per Bellcore GR-1089 (Intra-Building)
✔
Bidirectional Configuration
✔
High Surge Capability: 80A (10/1000µs)
✔
Available in 2 Voltages: 6.5V & 12V
✔
Protects Two (2) Bidirectional Lines
✔
LOW CAPACITANCE: < 30pF per LINE PAIR
✔
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔
✔
✔
✔
Molded JEDEC SO-16 Package
Weight 0.15 grams (Approximate)
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔
Flammability rating UL 94V-0
✔
16mm Tape and Reel Per EIA Standard 481
✔
Marking: Logo, Part Number, Date Code & Pin One Defined By Dot on Top of Package
SO-16
PIN CONFIGURA
TION
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
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SMLC6.5C-2
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SMLC12C-2
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs)
Peak Pulse Power (t
p
= 10/1000µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
P
PP
T
J
T
STG
VALUE
3,600
600
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
LEAKAGE
CURRENT
@ V
WM
I
D
µA
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
PP
= 10A
V
C
VOLTS
TYPICAL
CAPACITANCE
V
WM
VOLTS
@0V, 1MHz
C
pF
SMLC6.5C-2
SMLC12C-2
6.5
12.0
7.2
13.3
300
2
12.4
19.9
30
30
100
P
PP
- Peak Pulse Power - kW
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
I
PP
- Peak Pulse Current - % of I
PP
100
t
f
FIGURE 2
PULSE WAVE FORM
TEST
WAVEFORM
PARAMETERS
t
f
= 10µs
t
d
= 1,000µs
t
d
= t I /2
PP
10
Peak Value I
PP
600W 10/1000µs Waveform
1
50
0.1
0.1
e
-t
0
0
1
t - Time - µs
2
3
1
10
100
1,000
t
d
- Pulse Duration - µs
10,000
100,000
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SMLC12C-2
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
80
% Of Rated Power
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR SMLC6.5C-2
35
Peak Pulse Power
10/1000µs
5 Volts per Division
25
60
15
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
5
-5
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SMLC6.5C-2
V
C
- Clamping Voltage - Volts
16
12
8
4
0
0
10
20
30
I
PP
- Peak Pulse Current - Amps
40
FIGURE 6
INSERTION LOSS - SMLC6.5C-2
FIGURE 7
RETURN LOSS - SMLC6.5C-2
20 db
10 db per Division
10 db per Division
20 db
Ref 0 db
Ref 0 db
-20 db
-20 db
-50 db
100 MHz per Division
05105.R4 3/05
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-50 db
100 MHz per Division
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SMLC12C-2
APPLICA
TION NOTE
The SMLCxxC-2 Series are low capacitance, bidirectional TVS arrays that are designed to protect I/O or high speed data lines from the damaging
effects of ESD or EFT. This product series has a surge capability of 600 Watts P
PP
per line for an 10/1000µs waveform and ESD protection > 40kV
.
BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION(Figure 1)
Ideal for use multimode transceiver I/O lines, telecommunications and wireless circuits, the SMLCxxC-2 Series provides up to two (2) line pairs of
protection in a differential-mode T1/E1 application as depicted in Figure 1.
Circuit connectivity is as follows:
✔
Line 1 is connected to Pins 1,
✔
Line 2 is connected to Pins 3,
✔
Line 3 is connected to Pins 5,
✔
Line 4 is connected to Pins 7,
2,
4,
6,
8,
15 & 16.
13 & 14.
11, & 12.
9 & 10.
Figure 1. Differential-Mode Protection For T1/E1 Applications
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
✔
The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground
loops should be minimized.
The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
1
2
3
4
16
15
14
13
12
11
10
9
✔
✔
✔
5
6
7
8
✔
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
-A-
SO-16
16
9
-B- P
1
8
0.010” (0.25 MM)
M
B
M
8 PL
PACKAGE DIMENSIONS
DIM
MILLIMETERS
MIN
MAX
9.80
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
5.80
0.25
INCHES
MIN
MAX
G
C
0º - 7º
-T-
K
16 PL
0.010” (0.25 MM)
M
T B
S
M
R X 45º
D
A
S
F
J
A
B
C
D
F
G
J
K
P
R
NOTES
0.393
10.00
0.386
4.00
0.150
0.157
0.068
1.75
0.054
0.014
0.019
0.49
1.25
0.016
0.049
1.27 BSC 0.05 BSC 0.05 BSC
0.25
0.008
0.009
0.009
0.25
0.004
0.229
0.244
6.20
0.50
0.010
0.019
MOUNTING PAD
0.050” TYP
0.030”
±
0.005”
1. - T - = Seating Plane and Datum Surface.
2. Dimensions “A” and “B” are Datum.
3. Dimensions “A” and “B” do not include mold
protrusions.
4. Maximum mold protrusion is 0.015” (0.380 mm)
per side.
5. Dimensioning and tolerances per ANSI Y14.5M,
1982.
6. Dimensions are exclusive of mold flash and metal
burrs.
TAPE & REEL/BULK ORDERING NOMENCLATURE
0.160”
±
0.005”
0.245” MIN
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 16mm tape,
i.e.,
SMLC6.5C-2-T7.
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 16mm tape,
i.e.,
SMLC6.5C-2-T13.
4. Suffix- LF = Lead-Free, Pure-Tin Plating,
i.e.,
SMLC6.5C-2-LF-T7.
5. No Suffix = Product Shipped in Tubes of 37 pcs per Tube.
0.045”
±
0.005”
Outline & Dimensions: Rev 1 - 11/01, 06007
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
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