OTP ROM, 2KX4, 125ns, Bipolar, 0.25 X 1 INCH, DIP-18
| 参数名称 | 属性值 |
| 厂商名称 | Raytheon Company |
| 包装说明 | 0.25 X 1 INCH, DIP-18 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 125 ns |
| JESD-30 代码 | R-XDIP-T18 |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 2KX4 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-3820902BVX | M38510/20904BJA | M38510/20902BVX | M38510/20904BJX | 5962-3820904BJX | |
|---|---|---|---|---|---|
| 描述 | OTP ROM, 2KX4, 125ns, Bipolar, 0.25 X 1 INCH, DIP-18 | OTP ROM, 1KX8, 90ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 | OTP ROM, 2KX4, 125ns, Bipolar, 0.25 X 1 INCH, DIP-18 | OTP ROM, 1KX8, 90ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 | OTP ROM, 1KX8, 90ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 |
| 包装说明 | 0.25 X 1 INCH, DIP-18 | 0.5 X 0.75 INCH, DIP-24 | 0.25 X 1 INCH, DIP-18 | 0.5 X 0.75 INCH, DIP-24 | 0.5 X 0.75 INCH, DIP-24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Raytheon Company | Raytheon Company | Raytheon Company | - | Raytheon Company |
| 最长访问时间 | 125 ns | - | 125 ns | 90 ns | 90 ns |
| JESD-30 代码 | R-XDIP-T18 | - | R-XDIP-T18 | R-XDIP-T24 | R-XDIP-T24 |
| 内存密度 | 8192 bit | - | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | OTP ROM | - | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 4 | - | 4 | 8 | 8 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 18 | - | 18 | 24 | 24 |
| 字数 | 2048 words | - | 2048 words | 1024 words | 1024 words |
| 字数代码 | 2000 | - | 2000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C |
| 组织 | 2KX4 | - | 2KX4 | 1KX8 | 1KX8 |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIP | - | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | NO | NO |
| 技术 | BIPOLAR | - | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
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