IC,LOGIC MUX,DUAL,4-INPUT,S-TTL,FP,16PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDFP-F16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 2 |
| 输入次数 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74S153FC | 74153DC | 74153FC | WBDDSS8-A-00-8872-B-F | 74S153DC | 74S153PC | |
|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC MUX,DUAL,4-INPUT,S-TTL,FP,16PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,STD-TTL,DIP,16PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,STD-TTL,FP,16PIN,CERAMIC | Array/Network Resistor, Isolated, 0.1W, 88700ohm, 100V, 0.1% +/-Tol, -300,300ppm/Cel, 1408, | IC,LOGIC MUX,DUAL,4-INPUT,S-TTL,DIP,16PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,S-TTL,DIP,16PIN,PLASTIC |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 150 °C | 70 °C | 70 °C |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | SMT | IN-LINE | IN-LINE |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 |
| JESD-30 代码 | R-XDFP-F16 | R-XDIP-T16 | R-XDFP-F16 | - | R-XDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 2 | 2 | 2 | - | 2 | 2 |
| 输入次数 | 4 | 4 | 4 | - | 4 | 4 |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | - | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DFP | DIP | DFP | - | DIP | DIP |
| 封装等效代码 | FL16,.3 | DIP16,.3 | FL16,.3 | - | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 电源 | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | - | NO | NO |
| 技术 | TTL | TTL | TTL | - | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 |
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