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70V3389S5PRFG8: 产品描述Dual-Port SRAM, 64KX18, 5ns, CMOS, PQFP128, 14 X 20 MM X 1.4 MM, GREEN, PLASTIC, TQFP-128; 产品类别存储存储; 文件大小189KB，共17页; 制造商IDT (Integrated Device Technology)

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70V3389S5PRFG8概述

Dual-Port SRAM, 64KX18, 5ns, CMOS, PQFP128, 14 X 20 MM X 1.4 MM, GREEN, PLASTIC, TQFP-128

70V3389S5PRFG8规格参数

参数名称	属性值
厂商名称	IDT (Integrated Device Technology)
包装说明	LFQFP,
Reach Compliance Code	compliant
最长访问时间	5 ns
JESD-30 代码	R-PQFP-G128
长度	20 mm
内存密度	1179648 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	18
功能数量	1
端子数量	128
字数	65536 words
字数代码	64000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	64KX18
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装形状	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL
座面最大高度	1.6 mm
最大供电电压 (Vsup)	3.45 V
最小供电电压 (Vsup)	3.15 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	14 mm
Base Number Matches	1

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HIGH-SPEED 3.3V 64K x 18

SYNCHRONOUS PIPELINED

DUAL-PORT STATIC RAM

WITH 3.3V OR 2.5V INTERFACE

Features

◆

IDT70V3389S

True Dual-Port memory cells which allow simultaneous

access of the same memory location

◆

High-speed clock to data access

– Commercial: 4.2/5/6ns (max.)

– Industrial: 5ns (max)

◆

Pipelined output mode

◆

Counter enable and reset features

◆

Dual chip enables allow for depth expansion without

additional logic

◆

Full synchronous operation on both ports

– 7.5ns cycle time, 133MHz operation (9.6 Gbps bandwidth)

– Fast 4.2ns clock to data out

– 1.8ns setup to clock and 0.7ns hold on all control, data, and

address inputs @ 133MHz

◆

– Data input, address, byte enable and control registers

– Self-timed write allows fast cycle time

Separate byte controls for multiplexed bus and bus

matching compatibility

LVTTL- compatible, single 3.3V (±150mV) power supply for

core

LVTTL- compatible, selectable 3.3V (±150mV)/2.5V (±125mV)

power supply for I/Os and control signals on each port

Industrial temperature range (-40°C to +85°C) is

available for selected speeds

Available in a 128-pin Thin Quad Plastic Flatpack (TQFP),

208-pin fine pitch Ball Grid Array, and 256-pin Ball

Grid Array

Green parts available, see ordering information

Functional Block Diagram

R/W

B B

1 0

R R

R/W

Dout0-8_L

Dout9-17_L

Dout0-8_R

Dout9-17_R

64K x 18

MEMORY

ARRAY

I/O

0 L

- I/O

1 7 L

CLK

Din_L

Din_R

I/O

- I/O

17R

CLK

15L

CNTRST

ADS

CNTEN

Counter/

Address

Reg.

15R

ADDR_L

ADDR_R

Counter/

Address

Reg.

CNTRST

ADS

CNTEN

4832 tbl 01

OCTOBER 2014

DSC 4832/13

70V3389S5PRFG8相似产品对比

	70V3389S5PRFG8	70V3389S5BCG8	70V3389S5BCGI8	70V3389S5BFGI8	70V3389S5PRFGI8	70V3389S6PRFG8
描述	Dual-Port SRAM, 64KX18, 5ns, CMOS, PQFP128, 14 X 20 MM X 1.4 MM, GREEN, PLASTIC, TQFP-128	Application Specific SRAM, 64KX18, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256	Application Specific SRAM, 64KX18, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256	Application Specific SRAM, 64KX18, 5ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208	Dual-Port SRAM, 64KX18, 5ns, CMOS, PQFP128, 14 X 20 MM X 1.40 MM, GREEN, PLASTIC, TQFP-128	Dual-Port SRAM, 64KX18, 6ns, CMOS, PQFP128, 14 X 20 MM X 1.40 MM, GREEN, PLASTIC, TQFP-128
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
包装说明	LFQFP,	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA208,17X17,32	LFQFP,	LFQFP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
最长访问时间	5 ns	5 ns	5 ns	5 ns	5 ns	6 ns
JESD-30 代码	R-PQFP-G128	S-PBGA-B256	S-PBGA-B256	S-PBGA-B208	R-PQFP-G128	R-PQFP-G128
内存密度	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit
内存集成电路类型	DUAL-PORT SRAM	APPLICATION SPECIFIC SRAM	APPLICATION SPECIFIC SRAM	APPLICATION SPECIFIC SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
内存宽度	18	18	18	18	18	18
功能数量	1	1	1	1	1	1
端子数量	128	256	256	208	128	128
字数	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
字数代码	64000	64000	64000	64000	64000	64000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C
组织	64KX18	64KX18	64KX18	64KX18	64KX18	64KX18
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	BGA	BGA	BGA	LFQFP	LFQFP
封装形状	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
最大供电电压 (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
最小供电电压 (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
端子形式	GULL WING	BALL	BALL	BALL	GULL WING	GULL WING
端子节距	0.5 mm	1 mm	1 mm	0.8 mm	0.5 mm	0.5 mm
端子位置	QUAD	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD
Base Number Matches	1	1	1	1	1	1

70V3389S5PRFG8

70V3389S5PRFG8概述

70V3389S5PRFG8规格参数

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