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72T1865L5BBGI

产品描述FIFO, 8KX18, 3.6ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144
产品类别存储   
文件大小499KB,共55页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

72T1865L5BBGI概述

FIFO, 8KX18, 3.6ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144

72T1865L5BBGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA144,12X12,40
针数144
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间3.6 ns
其他特性ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
备用内存宽度9
最大时钟频率 (fCLK)83 MHz
周期时间5 ns
JESD-30 代码S-PBGA-B144
JESD-609代码e1
长度13 mm
内存密度147456 bit
内存集成电路类型OTHER FIFO
内存宽度18
湿度敏感等级3
功能数量1
端子数量144
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织8KX18
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA144,12X12,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源2.5 V
认证状态Not Qualified
座面最大高度1.97 mm
最大待机电流0.05 A
最大压摆率0.06 mA
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度13 mm
Base Number Matches1

文档预览

下载PDF文档
2.5 VOLT HIGH-SPEED TeraSync™ FIFO
IDT72T1845, IDT72T1855
18-BIT/9-BIT CONFIGURATIONS
IDT72T1865, IDT72T1875
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9, 8,192 x 18/16,384 x 9,
IDT72T1885, IDT72T1895
16,384 x 18/32,768 x 9, 32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9,
IDT72T18105, IDT72T18115
131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9, 524,288 x 18/1,048,576 x 9
IDT72T18125
FEATURES:
Choose among the following memory organizations:
IDT72T1845
2,048 x 18/4,096 x 9
IDT72T1855
4,096 x 18/8,192 x 9
IDT72T1865
8,192 x 18/16,384 x 9
IDT72T1875
16,384 x 18/32,768 x 9
IDT72T1885
32,768 x 18/65,536 x 9
IDT72T1895
65,536 x 18/131,072 x 9
IDT72T18105
131,072 x 18/262,144 x 9
IDT72T18115
262,144 x 18/524,288 x 9
IDT72T18125
524,288 x 18/1,048,576 x 9
Up to 225 MHz Operation of Clocks
User selectable HSTL/LVTTL Input and/or Output
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input enables/disables Write operations
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 144-pin (13mm x 13mm) or 240-pin (19mm x 19mm)
PlasticBall Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts are available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
D
0
-D
n
(x18 or x9)
WEN
WCLK/WR
WCS
LD
SEN
SCLK
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
131,072 x 18 or 262,144 x 9
262,144 x 18 or 524,288 x 9
524,288 x 18 or 1,048,576 x 9
FLAG
LOGIC
WRITE POINTER
BE
IP
IW
OW
MRS
PRS
TCK
TRST
TMS
TDO
TDI
Vref
WHSTL
RHSTL
SHSTL
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
READ POINTER
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MARK
ASYR
JTAG CONTROL
(BOUNDARY SCAN)
RCLK/RD
REN
RCS
HSTL I/0
CONTROL
OE
EREN
5909 drw01
Q
0
-Q
n
(x18 or x9)
ERCLK
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
FEBRUARY 2009
DSC-5909/19

72T1865L5BBGI相似产品对比

72T1865L5BBGI 72T1895L5BBI8 72T1895L4-4BBI 72T1895L6-7BBI
描述 FIFO, 8KX18, 3.6ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 FIFO FIFO, 64KX18, 8ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 64KX18, 12ns, Synchronous/Asynchronous, CMOS, PBGA144
Reach Compliance Code compliant compliant not_compliant not_compliant
是否Rohs认证 符合 - 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
包装说明 BGA, BGA144,12X12,40 - BGA, BGA144,12X12,40 BGA, BGA144,12X12,40
最长访问时间 3.6 ns - 8 ns 12 ns
备用内存宽度 9 - 9 9
最大时钟频率 (fCLK) 83 MHz - 100 MHz 66 MHz
JESD-30 代码 S-PBGA-B144 - S-PBGA-B144 S-PBGA-B144
JESD-609代码 e1 - e0 e0
内存密度 147456 bit - 1179648 bit 1179648 bit
内存集成电路类型 OTHER FIFO - OTHER FIFO OTHER FIFO
内存宽度 18 - 18 18
湿度敏感等级 3 - 3 3
端子数量 144 - 144 144
字数 8192 words - 65536 words 65536 words
字数代码 8000 - 64000 64000
工作模式 SYNCHRONOUS - SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS
最高工作温度 85 °C - 85 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C
组织 8KX18 - 64KX18 64KX18
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA - BGA BGA
封装等效代码 BGA144,12X12,40 - BGA144,12X12,40 BGA144,12X12,40
封装形状 SQUARE - SQUARE SQUARE
封装形式 GRID ARRAY - GRID ARRAY GRID ARRAY
电源 2.5 V - 2.5 V 2.5 V
认证状态 Not Qualified - Not Qualified Not Qualified
最大待机电流 0.05 A - 0.05 A 0.05 A
最大压摆率 0.06 mA - 0.06 mA 0.06 mA
标称供电电压 (Vsup) 2.5 V - 2.5 V 2.5 V
表面贴装 YES - YES YES
技术 CMOS - CMOS CMOS
温度等级 INDUSTRIAL - INDUSTRIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 BALL - BALL BALL
端子节距 1 mm - 1 mm 1 mm
端子位置 BOTTOM - BOTTOM BOTTOM
Base Number Matches 1 1 1 -

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