Enhanced Product 2.5V low-drift low-power series voltage reference 6-SOT-23 -55 to 125
增强型产品 2.5V 低漂移、低功耗串联电压基准 6-SOT-23 -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | HLSSOP, |
| Reach Compliance Code | compliant |
| Factory Lead Time | 6 weeks |
| 模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE |
| JESD-30 代码 | R-PDSO-G6 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最大输出电压 | 2.50125 V |
| 最小输出电压 | 2.49875 V |
| 标称输出电压 | 2.5 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HLSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH |
| 座面最大高度 | 1.45 mm |
| 最大供电电压 (Vsup) | 12 V |
| 最小供电电压 (Vsup) | 2.55 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 最大电压温度系数 | 6 ppm/°C |
| 温度等级 | MILITARY |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 微调/可调输出 | NO |
| 宽度 | 1.6 mm |
| REF3425MDBVTEP | REF3440MDBVTEP | V62/18622-01XE | V62/18622-02XE | REF3440-EP | REF3425-EP | |
|---|---|---|---|---|---|---|
| 描述 | Enhanced Product 2.5V low-drift low-power series voltage reference 6-SOT-23 -55 to 125 | Enhanced Product 4.1V low-drift low-power series voltage reference 6-SOT-23 -55 to 125 | Enhanced Product 2.5V low-drift low-power series voltage reference 6-SOT-23 -55 to 125 | Enhanced Product 4.1V low-drift low-power series voltage reference 6-SOT-23 -55 to 125 | Enhanced Product 4.1V low-drift low-power series voltage reference 6-SOT-23 -55 to 125 | Enhanced Product 2.5V low-drift low-power series voltage reference 6-SOT-23 -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
| 包装说明 | HLSSOP, | HLSSOP, | HLSSOP, | HLSSOP, | - | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | - | - |
| 模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | - | - |
| JESD-30 代码 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | - | - |
| 长度 | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | - | - |
| 湿度敏感等级 | 2 | 2 | 2 | 2 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | - | - |
| 输出次数 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 6 | 6 | 6 | 6 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 最大输出电压 | 2.50125 V | 4.098048 V | 2.50125 V | 4.098048 V | - | - |
| 最小输出电压 | 2.49875 V | 4.093952 V | 2.49875 V | 4.093952 V | - | - |
| 标称输出电压 | 2.5 V | 4.096 V | 2.5 V | 4.096 V | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | HLSSOP | HLSSOP | HLSSOP | HLSSOP | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH | - | - |
| 座面最大高度 | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | - | - |
| 最大供电电压 (Vsup) | 12 V | 12 V | 12 V | 12 V | - | - |
| 最小供电电压 (Vsup) | 2.55 V | 4.146 V | 2.55 V | 4.146 V | - | - |
| 表面贴装 | YES | YES | YES | YES | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - |
| 最大电压温度系数 | 6 ppm/°C | 6 ppm/°C | 6 ppm/°C | 6 ppm/°C | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | - | - |
| 端子节距 | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | - |
| 微调/可调输出 | NO | NO | NO | NO | - | - |
| 宽度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | - |
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