Freescale Semiconductor
Data Sheet: Technical Data
Document Number S9S08RN16DS
Rev 1, 02/2014
S9S08RN16 Series Data
Sheet
Key features
S9S08RN16DS
Supports: S9S08RN16 and S9S08RN8
• 8-Bit S08 central processor unit (CPU)
– Up to 20 MHz bus at 2.7 V to 5.5 V across
temperature range of -40 °C to 125 °C
– Supporting up to 40 interrupt/reset sources
– Supporting up to four-level nested interrupt
– On-chip memory
– Up to 16 KB flash read/program/erase over full
operating voltage and temperature
– Up to 256 byte EEPROM with ECC; 2-byte
erase sector; EEPROM program and erase
while executing code from flash
– Up to 2048 byte random-access memory (RAM)
– Flash and RAM access protection
• Power-saving modes
– One low-power stop mode; reduced power wait
mode
– Peripheral clock enable register can disable
clocks to unused modules, reducing currents;
allows clocks to remain enabled to specific
peripherals in stop3 mode
• Clocks
– Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator
– Internal clock source (ICS) - containing a
frequency-locked-loop (FLL) controlled by
internal or external reference; precision
trimming of internal reference allowing 1%
deviation across temperature range of 0 °C to
70 °C and -40 °C to 85 °C, 1.5% deviation
across temperature range of -40 °C to 105 °C,
and 2% deviation across temperature range of
-40 °C to 125 °C; up to 20 MHz
• System protection
– Watchdog with independent clock source
– Low-voltage detection with reset or interrupt;
selectable trip points
– Illegal opcode detection with reset
– Illegal address detection with reset
• Development support
– Single-wire background debug interface
– Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
– On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger
modes
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2014 Freescale Semiconductor, Inc.
• Peripherals
– ACMP - one analog comparator with both positive and negative inputs; separately selectable interrupt on
rising and falling comparator output; filtering
– ADC - 12-channel, 12-bit resolution for 48-, 32-pin packages; 10-channel, 10-bit resolution for 20-pin
package; 8-channel, 10-bit for 16-pin package; 2.5 µs conversion time; data buffers with optional watermark;
automatic compare function; internal bandgap reference channel; operation in stop mode; optional hardware
trigger
– CRC - programmable cyclic redundancy check module
– FTM - two flex timer modulators modules including one 6-channel and one 2-channel ones; 16-bit counter;
each channel can be configured for input capture, output compare, edge- or center-aligned PWM mode
– IIC - One inter-integrated circuit module; up to 400 kbps; multi-master operation; programmable slave
address; supporting broadcast mode and 10-bit addressing
– MTIM - One modulo timer with 8-bit prescaler and overflow interrupt
– RTC - 16-bit real time counter (RTC)
– SCI - two serial communication interface (SCI/UART) modules optional 13-bit break; full duplex non-return to
zero (NRZ); LIN extension support
– SPI - one 8-bit serial peripheral interface (SPI) modules; full-duplex or single-wire bidirectional; master or
slave mode
– TSI - supporting up to 16 external electrodes; configurable software or hardware scan trigger; fully support
freescale touch sensing software library; capability to wake MCU from stop3 mode
• Input/Output
– Up to 35 GPIOs including one output-only pin
– One 8-bit keyboard interrupt module (KBI)
– Two true open-drain output pins
– Four, ultra-high current sink pins supporting 20 mA source/sink current
• Package options
– 48-pin LQFP
– 32-pin LQFP
– 20-pin TSSOP
– 16-pin TSSOP
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
2
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Parameter Classification...........................................................5
4 Ratings......................................................................................5
4.1 Thermal handling ratings...................................................5
4.2 Moisture handling ratings..................................................6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings...............................6
5 General.....................................................................................7
5.1 Nonswitching electrical specifications...............................7
5.1.1
5.1.2
5.1.3
DC characteristics.................................................7
Supply current characteristics...............................14
EMC performance.................................................15
5.2.2
5.2.3
Debug trace timing specifications.........................16
FTM module timing...............................................17
5.3 Thermal specifications.......................................................18
5.3.1
Thermal characteristics.........................................18
6 Peripheral operating requirements and behaviors....................19
6.1 External oscillator (XOSC) and ICS characteristics...........19
6.2 NVM specifications............................................................21
6.3 Analog...............................................................................23
6.3.1
6.3.2
ADC characteristics...............................................23
Analog comparator (ACMP) electricals.................25
6.4 Communication interfaces.................................................26
6.4.1
SPI switching specifications..................................26
6.5 Human-machine interfaces (HMI)......................................29
6.5.1
TSI electrical specifications...................................29
7 Dimensions...............................................................................29
7.1 Obtaining package dimensions.........................................29
8 Pinout........................................................................................30
8.1 Signal multiplexing and pin assignments...........................30
8.2 Device pin assignment......................................................32
9 Revision history.........................................................................34
5.2 Switching specifications.....................................................15
5.2.1
Control timing........................................................15
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
freescale.com
and perform a part number search for the
following device numbers: RN16 and RN8.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
S 9 S08 RN AA F1 B CC
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
S
9
S08
RN
AA
F1
B
CC
Qualification status
Memory
Core
Device family
Approximate flash size in KB
Fab and mask set identifier
Temperature range (°C)
Package designator
Description
• 9 = flash based
• S08 = 8-bit CPU
• RN
• 16 = 16 KB
• 8 = 8 KB
• W2
• M = –40 to 125
• LF = 48-LQFP
Values
• S = fully qualified, general market flow
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
4
Freescale Semiconductor, Inc.
Parameter Classification
Field
Description
• LC = 32-LQFP
• TJ = 20-TSSOP
• TG = 16-TSSOP
Values
2.4 Example
This is an example part number:
S9S08RN16W2MLF
3 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter Classifications
P
C
T
D
Those parameters are guaranteed during production testing on each individual device.
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
4 Ratings
4.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
S9S08RN16 Series Data Sheet, Rev1, 02/2014.
Freescale Semiconductor, Inc.
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