IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,SOP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | NAND GATE |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 2/6 V |
| 施密特触发器 | NO |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MC74HC133DDS | MC74HC133ND | MC54HC133J | MC74HC133N | MC54HC133JDS | |
|---|---|---|---|---|---|
| 描述 | IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,SOP,16PIN,PLASTIC | IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,PLASTIC | IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC | IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,PLASTIC | IC,LOGIC GATE,13-INPUT NAND,HC-CMOS,DIP,16PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | - |
| 端子数量 | 16 | 16 | 16 | 16 | - |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | - |
| 封装代码 | SOP | DIP | DIP | DIP | - |
| 封装等效代码 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | - |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - |
| 施密特触发器 | NO | NO | NO | NO | - |
| 表面贴装 | YES | NO | NO | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - |
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