IRLML2402PbF-1
HEXFET
®
Power MOSFET
V
DS
R
DS(on) max
(@V
GS
= 4.5V)
20
0.25
2.6
1.2
V
Ω
nC
A
S
2
G 1
3 D
Q
g (typical)
I
D
(@T
A
= 25°C)
Micro3™(SOT-23)
Features
Industry-standard pinout SOT-23 Package
Compatible with Existing Surface Mount Techniques
RoHS Compliant, Halogen-Free
MSL1, Industrial qualification
⇒
Benefits
Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
Base Part Number
IRLML2402TRPbF-1
Package Type
Micro3
™
(SOT-23)
Standard Pack
Form
Quantity
Tape and Reel
3000
Orderable Part Number
IRLML2402TRPbF-1
Absolute Maximum Ratings
Parameter
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
V
GS
dv/dt
T
J,
T
STG
Continuous Drain Current, V
GS
@ 4.5V
Continuous Drain Current, V
GS
@ 4.5V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Max.
1.2
0.95
7.4
540
4.3
± 12
5.0
-55 to + 150
Units
A
mW
mW/°C
V
V/ns
°C
Thermal Resistance
R
θJA
Maximum Junction-to-Ambient
Parameter
Typ.
Max.
230
Units
°C/W
1
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2014 International Rectifier
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IRLML2402PbF-1
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
V
(BR)DSS
ΔV
(BR)DSS
/ΔT
J
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Min.
20
0.70
1.3
Typ.
0.024
2.6
0.41
1.1
2.5
9.5
9.7
4.8
110
51
25
Max. Units
Conditions
V
V
GS
= 0V, I
D
= 250µA
V/°C Reference to 25°C, I
D
= 1mA
0.25
V
GS
= 4.5V, I
D
= 0.93A
Ω
0.35
V
GS
= 2.7V, I
D
= 0.47A
V
V
DS
= V
GS
, I
D
= 250µA
S
V
DS
= 10V, I
D
= 0.47A
1.0
V
DS
= 16V, V
GS
= 0V
µA
25
V
DS
= 16V, V
GS
= 0V, T
J
= 125°C
-100
V
GS
= -12V
nA
100
V
GS
= 12V
3.9
I
D
= 0.93A
0.62
nC V
DS
= 16V
1.7
V
GS
= 4.5V, See Fig. 6 and 9
V
DD
= 10V
I
D
= 0.93A
ns
R
G
= 6.2Ω
R
D
= 11Ω, See Fig. 10
V
GS
= 0V
pF
V
DS
= 15V
= 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Min. Typ. Max. Units
25
16
0.54
7.4
1.2
38
24
V
ns
nC
A
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
J
= 25°C, I
S
= 0.93A, V
GS
= 0V
T
J
= 25°C, I
F
= 0.93A
di/dt = 100A/µs
D
G
S
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Pulse width
≤
300µs; duty cycle
≤
2%.
Surface mounted on FR-4 board, t
≤
5sec.
I
SD
≤
0.93A, di/dt
≤
90A/µs, V
DD
≤
V
(BR)DSS
,
T
J
≤
150°C
2
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October 28, 2014
IRLML2402PbF-1
100
I , Drain-to-Source Current (A)
D
10
I , Drain-to-Source Current (A)
D
VGS
7.5V
5.0V
4.0V
3.5V
3.0V
2.5V
2.0V
BOTTOM 1.5V
TOP
100
10
VGS
7.5V
5.0V
4.0V
3.5V
3.0V
2.5V
2.0V
BOTTOM 1.5V
TOP
1
1
1.5V
0.1
0.1
1.5V
20μs PULSE WIDTH
T
J
= 25°C
A
1
10
0.01
0.1
VDS , Drain-to-Source Voltage (V)
0.01
0.1
20μs PULSE WIDTH
T
J
= 150°C
A
1
10
VDS , Drain-to-Source Voltage (V)
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
10
2.0
T
J
= 25°C
T
J
= 150°C
1
R
DS(on)
, Drain-to-Source On Resistance
(Normalized)
I
D
= 0.93A
I
D
, Drain-to-Source Current (A)
1.5
1.0
0.1
0.5
0.01
1.5
2.0
2.5
V
DS
= 10V
20μs PULSE WIDTH
3.0
3.5
4.0
A
0.0
-60 -40 -20
V
GS
= 4.5V
0
20
40
60
80 100 120 140 160
A
V
GS
, Gate-to-Source Voltage (V)
T
J
, Junction Temperature (°C)
Fig 3.
Typical Transfer Characteristics
3
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2014 International Rectifier
Fig 4.
Normalized On-Resistance
Vs. Temperature
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October 28, 2014
IRLML2402PbF-1
200
V
GS
, Gate-to-Source Voltage (V)
160
V
GS
= 0V,
f = 1MHz
C
iss
= C
gs
+ C
gd
, C
ds
SHORTED
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
10
I
D
= 0.93A
V
DS
= 16V
8
C, Capacitance (pF)
C
iss
120
C
oss
6
80
4
C
rss
40
2
0
1
10
100
A
0
0.0
FOR TEST CIRCUIT
SEE FIGURE 9
1.0
2.0
3.0
4.0
A
V
DS
, Drain-to-Source Voltage (V)
Q
G
, Total Gate Charge (nC)
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
10
100
I
SD
, Reverse Drain Current (A)
OPERATION IN THIS AREA LIMITED
BY R
DS(on)
T
J
= 150°C
1
I
D
, Drain Current (A)
10
T
J
= 25°C
100μs
1
0.1
1ms
0.01
0.2
0.4
0.6
0.8
1.0
V
GS
= 0V
1.2
A
1.4
0.1
1
T
A
= 25°C
T
J
= 150°C
Single Pulse
10
10ms
100
A
V
SD
, Source-to-Drain Voltage (V)
V
DS
, Drain-to-Source Voltage (V)
Fig 7.
Typical Source-Drain Diode
Forward Voltage
4
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2014 International Rectifier
Fig 8.
Maximum Safe Operating Area
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October 28, 2014
IRLML2402PbF-1
R
D
Q
G
V
DS
V
GS
R
G
4.5V
4.5V
V
G
Q
GS
Q
GD
D.U.T.
+
-
V
DD
Charge
Pulse Width
≤ 1
µs
Duty Factor
≤ 0.1 %
Fig 9a.
Basic Gate Charge Waveform
Current Regulator
Same Type as D.U.T.
Fig 10a.
Switching Time Test Circuit
V
DS
50KΩ
12V
.2μF
.3μF
90%
+
V
-
DS
D.U.T.
V
GS
3mA
10%
V
GS
t
d(on)
I
G
I
D
t
r
t
d(off)
t
f
Current Sampling Resistors
Fig 9b.
Gate Charge Test Circuit
1000
Fig 10b.
Switching Time Waveforms
Thermal Response (Z
thJA
)
100
D = 0.50
0.20
0.10
10
0.05
0.02
0.01
P
DM
SINGLE PULSE
(THERMAL RESPONSE)
t
1
t
2
Notes:
1. Duty factor D = t
1
/ t
2
2. Peak T
J
= P
DM
x Z
thJA
+ T
A
0.0001
0.001
0.01
0.1
1
10
100
1
0.1
0.00001
t
1
, Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
5
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2014 International Rectifier
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October 28, 2014
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