Digital to Analog Converters - DAC 8-Bit SPI Quad DAC (2.5V ref, Reset to Mid-Scale, Ext. Ref)
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 |
| 制造商包装代码 | 05-08-1664 |
| Reach Compliance Code | compliant |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| JESD-30 代码 | R-PDSO-G10 |
| JESD-609代码 | e3 |
| 最大线性误差 (EL) | 0.19% |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 4 |
| 端子数量 | 10 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 0.9 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| LTC2634CMSE-LMX8#PBF | LTC2634IMSE-LMI8#PBF | LTC2634CMSE-HMX12#TRPBF | LTC2634HUD-HZ8#TRPBF | LTC2634CMSE-LMI12#TRPBF | LTC2634HUD-HMX8#PBF | LTC2634CUD-HZ8#TRPBF | |
|---|---|---|---|---|---|---|---|
| 描述 | Digital to Analog Converters - DAC 8-Bit SPI Quad DAC (2.5V ref, Reset to Mid-Scale, Ext. Ref) | Digital to Analog Converters - DAC 8-Bit SPI Quad DAC (2.5V ref, Reset to Mid-Scale, Int. Ref) | Digital to Analog Converters - DAC 12-Bit SPI Quad DAC (4.096V ref, reset to mid-scale, external ref) | Digital to Analog Converters - DAC 8-Bit SPI Quad DAC (4.096V ref, Reset to Zero-Scale) | Digital to Analog Converters - DAC 12-Bit SPI Quad DAC (2.5V ref, reset to mid-scale, internal ref) | Digital to Analog Converters - DAC 8-Bit SPI Quad DAC (4.096V ref, Reset to Mid-Scale, Ext. Ref) | Digital to Analog Converters - DAC 8-Bit SPI Quad DAC (4.096V ref, Reset to Zero-Scale) |
| Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | HTSSOP, | HVQCCN, | HTSSOP, | QCCN, LCC16,.12SQ,20 | HVQCCN, |
| 针数 | 10 | 10 | 10 | 16 | 10 | 16 | 16 |
| 制造商包装代码 | 05-08-1664 | 05-08-1664 | 05-08-1664 | 05-08-1691 | 05-08-1664 | 05-08-1691 | 05-08-1691 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| JESD-30 代码 | R-PDSO-G10 | R-PDSO-G10 | S-PDSO-G10 | S-PQCC-N16 | S-PDSO-G10 | S-PQCC-N16 | S-PQCC-N16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 最大线性误差 (EL) | 0.19% | 0.19% | 0.061% | 0.1953% | 0.061% | 0.19% | 0.1953% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 12 | 8 | 12 | 8 | 8 |
| 功能数量 | 4 | 4 | 1 | 1 | 1 | 4 | 1 |
| 端子数量 | 10 | 10 | 10 | 16 | 10 | 16 | 16 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | HTSSOP | HVQCCN | HTSSOP | QCCN | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | COMMERCIAL | AUTOMOTIVE | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 最大模拟输出电压 | - | - | 4.096 V | 4.096 V | 2.5 V | - | 4.096 V |
| 输入格式 | - | - | SERIAL | SERIAL | SERIAL | - | SERIAL |
| 长度 | - | - | 3 mm | 3 mm | 3 mm | - | 3 mm |
| 峰值回流温度（摄氏度） | - | - | 260 | 260 | 260 | - | 260 |
| 座面最大高度 | - | - | 1.1 mm | 0.8 mm | 1.1 mm | - | 0.8 mm |
| 标称安定时间 (tstl) | - | - | 4.8 µs | 3.8 µs | 4.2 µs | - | 3.8 µs |
| 标称供电电压 | - | - | 5 V | 5 V | 3 V | 5 V | 5 V |
| 处于峰值回流温度下的最长时间 | - | - | 30 | 30 | 30 | - | 30 |
| 宽度 | - | - | 3 mm | 3 mm | 3 mm | - | 3 mm |
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