Analog to Digital Converters - ADC 24-Bit, 1.5Msps/2Msps SAR ADC with Integrated Digital Filter
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | HVSON, |
| 针数 | 16 |
| 制造商包装代码 | 05-08-1732 |
| Reach Compliance Code | compliant |
| 最大模拟输入电压 | 5.1 V |
| 最小模拟输入电压 | -2.5 V |
| 最长转换时间 | 0.392 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-N16 |
| JESD-609代码 | e3 |
| 长度 | 4 mm |
| 最大线性误差 (EL) | 3.5% |
| 模拟输入通道数量 | 1 |
| 位数 | 24 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 采样速率 | 2 MHz |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.45 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| LTC2380IDE-24#TRPBF | LTC2380IMS-24#PBF | LTC2380CMS-24#TRPBF | LTC2380CDE-24#TRPBF | LTC2380IMS-24#TRPBF | LTC2380IDE-24#PBF | |
|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC 24-Bit, 1.5Msps/2Msps SAR ADC with Integrated Digital Filter | Analog to Digital Converters - ADC 24-Bit, 1.5Msps/2Msps SAR ADC with Integrated Digital Filter | Analog to Digital Converters - ADC 24-Bit, 1.5Msps/2Msps SAR ADC with Integrated Digital Filter | Analog to Digital Converters - ADC 24-Bit, 1.5Msps/2Msps SAR ADC with Integrated Digital Filter | Analog to Digital Converters - ADC 24-Bit, 1.5Msps/2Msps SAR ADC with Integrated Digital Filter | 模数转换器 - ADC 24-Bit, 1.5Msps/2Msps SAR ADC with Integrated Digital Filter |
| Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 包装说明 | HVSON, | MSOP-16 | TSSOP, | HVSON, | TSSOP, | HVSON, |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | 05-08-1732 | 05-08-1669 | 05-08-1669 | 05-08-1732 | 05-08-1669 | 05-08-1732 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 最大模拟输入电压 | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V |
| 最小模拟输入电压 | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V |
| 最长转换时间 | 0.392 µs | 0.392 µs | 0.392 µs | 0.392 µs | 0.392 µs | 0.392 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-N16 | R-PDSO-G16 | R-PDSO-N16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4 mm | 4.039 mm | 4.039 mm | 4 mm | 4.039 mm | 4 mm |
| 最大线性误差 (EL) | 3.5% | 3.5% | 3.5% | 3.5% | 3.5% | 3.5% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 24 | 24 | 24 | 24 | 24 | 24 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | TSSOP | HVSON | TSSOP | HVSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 采样速率 | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| 座面最大高度 | 0.8 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm |
| 标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.45 mm | 0.5 mm | 0.5 mm | 0.45 mm | 0.5 mm | 0.45 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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