
Digital to Analog Converters - DAC 16-Bit I2C Quad DAC (2.048V Reference, 4LSB INL)
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | SSOP, |
| 针数 | 16 |
| 制造商包装代码 | 05-08-1641 (GN16) |
| Reach Compliance Code | compliant |
| 最大模拟输出电压 | 4.096 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 最大线性误差 (EL) | 0.0061% |
| 湿度敏感等级 | 1 |
| 位数 | 16 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 标称安定时间 (tstl) | 9.1 µs |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |

| LTC2655BCGN-H16#TRPBF | LTC2655BCUF-H16#TRPBF | LTC2655CUF-L12#PBF | LTC2655BCUF-L16#TRPBF | LTC2655CGN-H12#TRPBF | LTC2655IUF-H12#TRPBF | LTC2655BIUF-L16#TRPBF | LTC2655BCGN-L16#TRPBF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Digital to Analog Converters - DAC 16-Bit I2C Quad DAC (2.048V Reference, 4LSB INL) | Digital to Analog Converters - DAC 16-Bit I2C Quad DAC (2.048V Reference, 4LSB INL) | Digital to Analog Converters - DAC 12-Bit I2C Quad DAC (1.25V Reference) | Quad I2C 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference | Digital to Analog Converters - DAC 12-Bit I2C Quad DAC (2.048V Reference) | Digital to Analog Converters - DAC 12-Bit I2C Quad DAC (2.048V Reference) | 数模转换器- DAC 16-Bit I2C Quad DAC (1.25V Reference, 4LSB INL) | Quad I2C 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference |
| Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | SSOP, | HVQCCN, | HVQCCN, | HVQCCN, | SSOP, | HVQCCN, | HVQCCN, | SSOP, |
| 针数 | 16 | 20 | 20 | 20 | 16 | 20 | 20 | 16 |
| 制造商包装代码 | 05-08-1641 (GN16) | 05-08-1710 | 05-08-1710 | 05-08-1710 | 05-08-1641 (GN16) | 05-08-1710 | 05-08-1710 | 05-08-1641 (GN16) |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最大模拟输出电压 | 4.096 V | 4.096 V | 2.5 V | 2.5 V | 4.096 V | 4.096 V | 2.5 V | 2.5 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输入格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| JESD-30 代码 | R-PDSO-G16 | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 | R-PDSO-G16 | S-PQCC-N20 | S-PQCC-N20 | R-PDSO-G16 |
| 长度 | 4.9 mm | 4 mm | 4 mm | 4 mm | 4.9 mm | 4 mm | 4 mm | 4.9 mm |
| 最大线性误差 (EL) | 0.0061% | 0.0061% | 0.0244% | 0.0061% | 0.0244% | 0.0244% | 0.0061% | 0.0061% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 16 | 16 | 12 | 16 | 12 | 12 | 16 | 16 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 20 | 20 | 20 | 16 | 20 | 20 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | HVQCCN | HVQCCN | HVQCCN | SSOP | HVQCCN | HVQCCN | SSOP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.75 mm | 0.8 mm | 0.8 mm | 1.75 mm |
| 标称安定时间 (tstl) | 9.1 µs | 9.1 µs | 2.4 µs | 9.1 µs | 2.4 µs | 2.4 µs | 9.1 µs | 9.1 µs |
| 标称供电电压 | 5 V | 5 V | 3 V | 3 V | 5 V | 5 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.635 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 |
| 宽度 | 3.9 mm | 4 mm | 4 mm | 4 mm | 3.9 mm | 4 mm | 4 mm | 3.9 mm |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - |
| JESD-609代码 | e3 | e3 | - | e3 | e3 | e3 | e3 | e3 |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | - | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN |
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