Digital to Analog Converters - DAC LTC7541A - Improved Industry Standard CMOS 12-Bit Multiplying DAC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-18 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0122% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.81 mm |
| 标称安定时间 (tstl) | 0.6 µs |
| 最大压摆率 | 2 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| LTC7541AKN | LTC7541AJSW#PBF | LTC7541AJN | LTC7541ABSW#TR | LTC7541AJSW#TR | |
|---|---|---|---|---|---|
| 描述 | Digital to Analog Converters - DAC LTC7541A - Improved Industry Standard CMOS 12-Bit Multiplying DAC | Digital to Analog Converters - DAC 12-Bit Parallel, MDAC | Digital to Analog Converters - DAC LTC7541A - Improved Industry Standard CMOS 12-Bit Multiplying DAC | Digital to Analog Converters - DAC LTC7541A - Improved Industry Standard CMOS 12-Bit Multiplying DAC | 数模转换器- DAC LTC7541A - Improved Industry Standard CMOS 12-Bit Multiplying DAC |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-18 | SOP, | 0.300 INCH, PLASTIC, DIP-18 | SOP, | SOP, |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | not_compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-PDIP-T18 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 | R-PDSO-G18 |
| JESD-609代码 | e0 | e3 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0244% | 0.0122% | 0.0244% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | 235 | 235 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.81 mm | 2.65 mm | 3.81 mm | 2.65 mm | 2.65 mm |
| 标称安定时间 (tstl) | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs | 0.6 µs |
| 最大压摆率 | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | 20 | 20 |
| 宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 长度 | - | 11.55 mm | - | 11.55 mm | 11.55 mm |
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