8-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQFP44
8位, FLASH, 16 MHz, 精简指令集微控制器, PQFP44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Atmel (Microchip) |
零件包装代码 | QFP |
包装说明 | TQFP, TQFP44,.47SQ,32 |
针数 | 44 |
Reach Compliance Code | unknow |
具有ADC | YES |
地址总线宽度 | |
位大小 | 8 |
CPU系列 | AVR RISC |
最大时钟频率 | 16 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQFP-G44 |
JESD-609代码 | e0 |
长度 | 10 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 32 |
端子数量 | 44 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TQFP |
封装等效代码 | TQFP44,.47SQ,32 |
封装形状 | SQUARE |
封装形式 | FLATPACK, THIN PROFILE |
峰值回流温度(摄氏度) | 240 |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 1024 |
ROM(单词) | 8192 |
ROM可编程性 | FLASH |
座面最大高度 | 1.2 mm |
速度 | 16 MHz |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
ATmega16-16AI | ATmega16L-8MC | ATmega16L-8AI | ATmega16L-8MI | ATmega16-16PI | ATmega16-16PC | ATmega16-16MI | ATmega16-16MC | |
---|---|---|---|---|---|---|---|---|
描述 | 8-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQFP44 | 8-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDIP40 | 8-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PQFP44 | 8-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDIP40 | 8-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDIP40 | 8-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDIP40 | 8-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDIP40 | 8-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDIP40 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
零件包装代码 | QFP | QFN | QFP | QFN | DIP | DIP | QFN | QFN |
包装说明 | TQFP, TQFP44,.47SQ,32 | HVQCCN, LCC44,.28SQ,20 | TQFP, TQFP44,.47SQ,32 | HVQCCN, LCC44,.28SQ,20 | 0.600 INCH, PLASTIC, MS-011AC, DIP-40 | 0.600 INCH, PLASTIC, MS-011AC, DIP-40 | HVQCCN, LCC44,.28SQ,20 | HVQCCN, LCC44,.28SQ,20 |
针数 | 44 | 44 | 44 | 44 | 40 | 40 | 44 | 44 |
Reach Compliance Code | unknow | compli | unknow | compli | unknow | unknow | compli | compli |
具有ADC | YES | YES | YES | YES | YES | YES | YES | YES |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | AVR RISC | AVR RISC | AVR RISC | AVR RISC | AVR RISC | AVR RISC | AVR RISC | AVR RISC |
最大时钟频率 | 16 MHz | 8 MHz | 8 MHz | 8 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQFP-G44 | S-XQCC-N44 | S-PQFP-G44 | S-XQCC-N44 | R-PDIP-T40 | R-PDIP-T40 | S-XQCC-N44 | S-XQCC-N44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 10 mm | 7 mm | 10 mm | 7 mm | 52.324 mm | 52.324 mm | 7 mm | 7 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 1 | 1 | 3 | 3 |
I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 44 | 44 | 44 | 44 | 40 | 40 | 44 | 44 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
封装代码 | TQFP | HVQCCN | TQFP | HVQCCN | DIP | DIP | HVQCCN | HVQCCN |
封装等效代码 | TQFP44,.47SQ,32 | LCC44,.28SQ,20 | TQFP44,.47SQ,32 | LCC44,.28SQ,20 | DIP40,.6 | DIP40,.6 | LCC44,.28SQ,20 | LCC44,.28SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | FLATPACK, THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 225 | 225 | 240 | 240 |
电源 | 5 V | 3/5 V | 3/5 V | 3/5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
ROM(单词) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.2 mm | 1 mm | 1.2 mm | 1 mm | 4.826 mm | 4.826 mm | 1 mm | 1 mm |
速度 | 16 MHz | 8 MHz | 8 MHz | 8 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 2.7 V | 2.7 V | 2.7 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 3 V | 3 V | 3 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | NO LEAD | GULL WING | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
端子节距 | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 2.54 mm | 2.54 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 10 mm | 7 mm | 10 mm | 7 mm | 15.24 mm | 15.24 mm | 7 mm | 7 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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