1,048,576-Word x 16-Bit or 2,097,152-Word x 8-bit 8Word X 16-Bit or 16Word X 8-Bit/Page Mode MASK ROM
| 参数名称 | 属性值 |
| 厂商名称 | OKI |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 44 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 100 ns |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PDSO-G44 |
| 长度 | 28.15 mm |
| 内存密度 | 16777216 bi |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 13 mm |

| MR53V1652J-XXMA | MR53V1652J | MR53V1652J-XXRA | MR53V1652J-XXTP | |
|---|---|---|---|---|
| 描述 | 1,048,576-Word x 16-Bit or 2,097,152-Word x 8-bit 8Word X 16-Bit or 16Word X 8-Bit/Page Mode MASK ROM | 1,048,576-Word x 16-Bit or 2,097,152-Word x 8-bit 8Word X 16-Bit or 16Word X 8-Bit/Page Mode MASK ROM | 1,048,576-Word x 16-Bit or 2,097,152-Word x 8-bit 8Word X 16-Bit or 16Word X 8-Bit/Page Mode MASK ROM | 1,048,576-Word x 16-Bit or 2,097,152-Word x 8-bit 8Word X 16-Bit or 16Word X 8-Bit/Page Mode MASK ROM |
| 厂商名称 | OKI | - | OKI | OKI |
| 零件包装代码 | SOIC | - | DIP | TSOP2 |
| 包装说明 | SOP, | - | DIP, | TSOP2, |
| 针数 | 44 | - | 42 | 44 |
| Reach Compliance Code | unknow | - | unknow | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | - | 100 ns | 100 ns |
| 备用内存宽度 | 8 | - | 8 | 8 |
| JESD-30 代码 | R-PDSO-G44 | - | R-PDIP-T42 | R-PDSO-G44 |
| 长度 | 28.15 mm | - | 52 mm | 18.41 mm |
| 内存密度 | 16777216 bi | - | 16777216 bi | 16777216 bi |
| 内存集成电路类型 | MASK ROM | - | MASK ROM | MASK ROM |
| 内存宽度 | 16 | - | 16 | 16 |
| 功能数量 | 1 | - | 1 | 1 |
| 端子数量 | 44 | - | 42 | 44 |
| 字数 | 1048576 words | - | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | - | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C |
| 组织 | 1MX16 | - | 1MX16 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | DIP | TSOP2 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 3.1 mm | - | 5.15 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | NO | YES |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | - | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | - | 2.54 mm | 0.8 mm |
| 端子位置 | DUAL | - | DUAL | DUAL |
| 宽度 | 13 mm | - | 15.24 mm | 10.16 mm |
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