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MR27V25603L-xxxTME

产品描述16M-Word x 16-Bit or 32M-Word x 8-Bit P2ROM
产品类别存储    存储   
文件大小102KB,共9页
制造商OKI
官网地址http://www.oki.com
下载文档 详细参数 选型对比 全文预览

MR27V25603L-xxxTME概述

16M-Word x 16-Bit or 32M-Word x 8-Bit P2ROM

MR27V25603L-xxxTME规格参数

参数名称属性值
厂商名称OKI
零件包装代码TSOP2
包装说明TSOP2,
针数50
Reach Compliance Codeunknow
ECCN代码EAR99
最长访问时间120 ns
备用内存宽度8
JESD-30 代码R-PDSO-G50
长度20.95 mm
内存密度268435456 bi
内存集成电路类型MASK ROM
内存宽度16
功能数量1
端子数量50
字数16777216 words
字数代码16000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织16MX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式GULL WING
端子节距0.8 mm
端子位置DUAL
宽度10.16 mm

文档预览

下载PDF文档
OKI Semiconductor
MR27V25603L
16M–Word
×
16–Bit or 32M–Word
×
8–Bit
FEDR27V25603L-02-02
Issue Date: Jun. 8, 2004
P2ROM
PIN CONFIGURATION (TOP VIEW)
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A23
GND
BYTE#
A0
D0
D8
D1
D9
Vcc
D2
D10
D3
D11
GND
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A23
NC
NC
NC
NC
NC
GND
NC
NC
NC
NC
NC
BYTE#
A0
D0
D8
D1
D9
Vcc
D2
D10
D3
D11
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50
49
48
47
46
45
44
43
42
41
40
FEATURES
·16,777,216-word
×
16-bit/33,554,432-word
×
8-bit
electrically switchable configuration
· 3.0 V to 3.6 V power supply
· Access time
100 ns MAX (MR27V25603L-xxxTM)
120 ns MAX (MR27V25603L-xxxTME)
· Operating current
35 mA MAX(5MHz)
· Standby current
10 µA MAX
· Input/Output TTL compatible
· Three-state output
CE#
A12
A13
A14
A15
Vcc
A16
A17
A18
A19
A20
A21
GND
A22
NC
OE#
D15/A-1
D7
D14
D6
D13
D5
D12
D4
Vcc
CE#
A12
A13
A14
A15
Vcc
A16
A17
A18
A19
A20
A21
NC
NC
NC
NC
NC
GND
NC
NC
NC
NC
NC
A22
NC
OE#
D15/A-1
D7
D14
D6
D13
D5
D12
D4
Vcc
50TSOP
(Type2)
39
38
37
36
35
34
33
32
31
30
29
28
27
26
PACKAGES
· MR27V25603L-xxxTM, MR27V25603L-xxxTME
50-pin plastic TSOP (TSOP(2)50-P-400-0.80-K)
· MR27V25603L-xxxMB, MR27V25603L-xxxMBE
70-pin plastic SSOP (SSOP70-P-500-0.80-K)
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
·
Short lead time,
since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
·
No mask charge,
since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
·
No additional programming charge,
unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
·
Custom Marking is
available at no additional charge.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
70SSOP
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
1/9

MR27V25603L-xxxTME相似产品对比

MR27V25603L-xxxTME MR27V25603L MR27V25603L-xxxTM
描述 16M-Word x 16-Bit or 32M-Word x 8-Bit P2ROM 16M-Word x 16-Bit or 32M-Word x 8-Bit P2ROM 16M-Word x 16-Bit or 32M-Word x 8-Bit P2ROM
厂商名称 OKI - OKI
零件包装代码 TSOP2 - TSOP2
包装说明 TSOP2, - TSOP2,
针数 50 - 50
Reach Compliance Code unknow - unknow
ECCN代码 EAR99 - EAR99
最长访问时间 120 ns - 100 ns
备用内存宽度 8 - 8
JESD-30 代码 R-PDSO-G50 - R-PDSO-G50
长度 20.95 mm - 20.95 mm
内存密度 268435456 bi - 268435456 bi
内存集成电路类型 MASK ROM - MASK ROM
内存宽度 16 - 16
功能数量 1 - 1
端子数量 50 - 50
字数 16777216 words - 16777216 words
字数代码 16000000 - 16000000
工作模式 ASYNCHRONOUS - ASYNCHRONOUS
最高工作温度 70 °C - 70 °C
组织 16MX16 - 16MX16
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 TSOP2 - TSOP2
封装形状 RECTANGULAR - RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL - PARALLEL
认证状态 Not Qualified - Not Qualified
座面最大高度 1.2 mm - 1.2 mm
最大供电电压 (Vsup) 3.6 V - 3.6 V
最小供电电压 (Vsup) 3 V - 3 V
标称供电电压 (Vsup) 3.3 V - 3.3 V
表面贴装 YES - YES
技术 CMOS - CMOS
温度等级 COMMERCIAL - COMMERCIAL
端子形式 GULL WING - GULL WING
端子节距 0.8 mm - 0.8 mm
端子位置 DUAL - DUAL
宽度 10.16 mm - 10.16 mm

 
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