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MR27T802F-XXXTP

产品描述512k-Word x 16-Bit or 1M-Word x 8-Bit
产品类别存储    存储   
文件大小127KB,共10页
制造商OKI
官网地址http://www.oki.com
下载文档 详细参数 选型对比 全文预览

MR27T802F-XXXTP概述

512k-Word x 16-Bit or 1M-Word x 8-Bit

MR27T802F-XXXTP规格参数

参数名称属性值
零件包装代码TSOP2
包装说明TSOP2,
针数44
Reach Compliance Codeunknow
ECCN代码EAR99
最长访问时间80 ns
备用内存宽度8
JESD-30 代码R-PDSO-G44
长度18.41 mm
内存密度8388608 bi
内存集成电路类型MASK ROM
内存宽度16
功能数量1
端子数量44
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式GULL WING
端子节距0.8 mm
端子位置DUAL
宽度10.16 mm
Base Number Matches1

文档预览

下载PDF文档
OKI Semiconductor
MR27T802F
512k–Word
×
16–Bit or 1M–Word
×
8–Bit
FEDR27T802F-02-05
Issue Date: Dec. 28, 2004
P2ROM
PIN CONFIGURATION (TOP VIEW)
FEATURES
·512k-word
×
16-bit / 1M-word
×
8-bit electrically switchable
configuration
· +2.7 V to 3.6 V power supply
· Access time
80 ns MAX
· Operating current 18 mA MAX(5MHz)
· Standby current
5 µA MAX
· Input/Output TTL compatible
· Three-state output
PACKAGES
· MR27T802F-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
· MR27T802F-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
· MR27T802F-xxxTP
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K)
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
D0
D8
D1
D9
D2
D10
D3
D11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
SS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
V
CC
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
·
Short lead time,
since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
·
No mask charge,
since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
·
No additional programming charge,
unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the factory
with minimal effect on the production throughput. The cost
is included in the unit price.
·
Custom Marking is
available at no additional charge.
·
Pin Compatible with Mask ROM
and some FLASH
products.
44SOP,
44TSOP(Type-II)
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
NC
NC
NC
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
V
SS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
V
CC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
V
SS
CE#
A0
48TSOP(Type-I)
1/10

MR27T802F-XXXTP相似产品对比

MR27T802F-XXXTP MR27T802F-XXXMA MR27T802F MR27T802F-XXXTN
描述 512k-Word x 16-Bit or 1M-Word x 8-Bit 512k-Word x 16-Bit or 1M-Word x 8-Bit 512k-Word x 16-Bit or 1M-Word x 8-Bit 512k-Word x 16-Bit or 1M-Word x 8-Bit
零件包装代码 TSOP2 SOIC - TSOP1
包装说明 TSOP2, SOP, - TSOP1,
针数 44 44 - 48
Reach Compliance Code unknow unknow - unknow
ECCN代码 EAR99 EAR99 - EAR99
最长访问时间 80 ns 80 ns - 80 ns
备用内存宽度 8 8 - 8
JESD-30 代码 R-PDSO-G44 R-PDSO-G44 - R-PDSO-G48
长度 18.41 mm 28.15 mm - 18.4 mm
内存密度 8388608 bi 8388608 bi - 8388608 bi
内存集成电路类型 MASK ROM MASK ROM - MASK ROM
内存宽度 16 16 - 16
功能数量 1 1 - 1
端子数量 44 44 - 48
字数 524288 words 524288 words - 524288 words
字数代码 512000 512000 - 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
最高工作温度 70 °C 70 °C - 70 °C
组织 512KX16 512KX16 - 512KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 TSOP2 SOP - TSOP1
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL - PARALLEL
认证状态 Not Qualified Not Qualified - Not Qualified
座面最大高度 1.2 mm 3.1 mm - 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V - 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V - 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V - 3.3 V
表面贴装 YES YES - YES
技术 CMOS CMOS - CMOS
温度等级 COMMERCIAL COMMERCIAL - COMMERCIAL
端子形式 GULL WING GULL WING - GULL WING
端子节距 0.8 mm 1.27 mm - 0.5 mm
端子位置 DUAL DUAL - DUAL
宽度 10.16 mm 13 mm - 12 mm
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