262,263-Word 】 4-Bit Field Memory
| 参数名称 | 属性值 |
| 厂商名称 | OKI |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-PDIP-T16 |
| 长度 | 19.05 mm |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX4 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| MSM51V4221C-40RA | MSM51V4221C | MSM51V4221C-30RA | MSM51V4221C-30JA | MSM51V4221C-40RD | MSM51V4221C-40JA | MSM51V4221C-30RD | |
|---|---|---|---|---|---|---|---|
| 描述 | 262,263-Word 】 4-Bit Field Memory | 262,263-Word 】 4-Bit Field Memory | 262,263-Word 】 4-Bit Field Memory | 262,263-Word 】 4-Bit Field Memory | 262,263-Word 】 4-Bit Field Memory | 262,263-Word 】 4-Bit Field Memory | 262,263-Word 】 4-Bit Field Memory |
| 厂商名称 | OKI | - | OKI | OKI | OKI | OKI | OKI |
| 零件包装代码 | DIP | - | DIP | SOJ | ZIP | SOJ | ZIP |
| 包装说明 | DIP, | - | DIP, | SOJ, | ZIP, | SOJ, | ZIP, |
| 针数 | 16 | - | 16 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow |
| JESD-30 代码 | R-PDIP-T16 | - | R-PDIP-T16 | R-PDSO-J20 | R-PZIP-T20 | R-PDSO-J20 | R-PZIP-T20 |
| 长度 | 19.05 mm | - | 19.05 mm | 17.15 mm | 25.5 mm | 17.15 mm | 25.5 mm |
| 内存密度 | 1048576 bi | - | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | MEMORY CIRCUIT | - | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 4 | - | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 20 | 20 | 20 | 20 |
| 字数 | 262144 words | - | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | - | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX4 | - | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | SOJ | ZIP | SOJ | ZIP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 3.55 mm | 10.16 mm | 3.55 mm | 10.16 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | - | NO | YES | NO | YES | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 2.8 mm | 7.62 mm | 2.8 mm |
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