Rigado, Inc.
3950 Fairview Industrial Dr.
Salem, Oregon 97302
866-6-RIGADO
modules@rigado.com
www.rigado.com/modules
BMD-300 Series Module for Bluetooth 5 LE
The
BMD-300 Series
from Rigado is a line of powerful, highly flexible, ultra-low power
Bluetooth
Smart modules based on the nRF52832 SoC from Nordic Semiconductor. With
an
ARM® Cortex™
M4F CPU, embedded 2.4GHz transceiver, and integrated antenna, they
provide a complete RF solution with no additional RF design, allowing faster time to
market.
Providing full use of the nRF52832’s capabilities and peripherals, the
BMD-300
Series
can power the most demanding applications, all while simplifying designs and
reducing BOM costs. With an internal DC-DC converter and intelligent power control, the
BMD-300 Series
provide class-leading power efficiency, enabling ultra-low power sensitive
applications. Regulatory pre-approvals reduce the burden to enter the market, and the
included
BMD Software Suite
provides access to great features like a secure BLE & UART
bootloader, iOS & Android Bluetooth libraries, and more. Available in three variants:
internal antenna (BMD-300), U.FL connector (BMD-301), and ultra-miniature (BMD-350).
1.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Based on the Nordic nRF52832 SoC
Bluetooth 5 2M LE + Advertisement Extensions
Complete RF solution with integrated antenna
(BMD-300 &
BMD-350)
or U.FL connector (BMD-
301)
Integrated DC-DC converter
No external components required
ARM® Cortex™-M4F
32-bit processor
Serial Wire Debug (SWD)
Nordic SoftDevice ready
Over-the-Air (OTA) firmware updates
512kB embedded flash memory
64kB RAM
32 General Purpose I/O Pins
12-bit/200KSPS ADC
-40C to +85C Temperature Range
BMD Software Suite included
FCC:
2AA9B04
(BMD-300/BMD-301)
2AA9B05
(BMD-350)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Three SPI Master/Slave (8 Mbps)
Low power comparator
Temperature sensor
Random Number Generator
Two 2-wire Master/Slave (I2C compatible)
I2S audio interface
UART (w/ CTS/RTS and DMA)
20 channel CPU independent Programmable
Peripheral Interconnect (PPI)
Quadrature Demodulator (QDEC)
128-bit AES HW encryption
5 x 32bit, 3 x 24bit Real Timer Counters (RTC)
NFC-A tag interface for OOB pairing
BMD-300/301
Dimensions: 14 x 9.8 x 1.9mm
BMD-350
Dimensions: 8.7 x 6.4 x 1.5mm
IC:
12208A-04
(BMD-300/BMD-301)
12208A-05
(BMD-350)
Japan:
210-106799
(BMD-300)
210-107153
(BMD-301)
210-108944
(BMD-350)
2.
Applications
•
•
•
•
•
•
App-cessories
Beacons
–
iBeacon™, AltBeacon, Eddystone, etc.
Low-Power Sensors
Lighting Products
Fitness devices
Wearables
Page 1 of 36
BMD-300-Series-DS 1.11
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
3.
Ordering Information
Email
modules@rigado.com
for quotes and ordering or visit
www.rigado.com/BMD-300
Part Number
BMD-300-A-R
BMD-301-A-R
BMD-350-A-R
BMD-300-EVAL
BMD-301-EVAL
BMD-350-EVAL
Description
BMD-300 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-301 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-350 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-300 Evaluation Kit with Segger J-Link programmer
BMD-301 Evaluation Kit with Segger J-Link programmer w/antennas
BMD-350 Evaluation Kit with Segger J-Link programmer
Table 1
–
Ordering Part Numbers
4.
Block Diagram
BMD-300 Series Modules
nRF52832
512kB
Flash
64
kB RAM
SWD Debug &
Programming
Accel Address
Resolver
ARM Cortex-M4F
@ 64MHz
Clock
Management
AES ECB
AES CCM Mode
Encryption
2.4GHz Radio
Multi-protocol
Matching
Network
Balun
Real Time
Counter x3
Timer x5
Random Number
Gen
Watchdog
Timer
Core LDO
TWI
Master x2
TWI Slave
x2
Programmable
Peripheral
Interconnect
Temperature
Sensor
Low Power
Comparator
General
Purpose
Comparator
GPIO Task
Event Blocks
UART
I2S
Quadrature
Decoder
NFC Tag
Antenna
/ U.FL
SPI
Master x3
SPI Slave
X3
DC/DC Buck
Regulator
PWM
PDM
8-ch 12-bit
ADC
DC-DC
Inductor
Bulk
Capacitors
Decoupling
Capacitors
GPIO x32
(Analog x8)
32 MHz
Crystal
Figure 1
–
Block Diagram
BMD-300-Series-DS V1.11
Page 2 of 36
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
Table of Contents
1.
FEATURES........................................................................................................................................................................ 1
2.
APPLICATIONS ................................................................................................................................................................. 1
3.
ORDERING INFORMATION ............................................................................................................................................... 2
4.
BLOCK DIAGRAM ............................................................................................................................................................. 2
5.
QUICK SPECIFICATIONS .................................................................................................................................................... 5
6.
PIN DESCRIPTIONS ........................................................................................................................................................... 6
6.1
BMD-300 / BMD-301 ........................................................................................................................................................................6
6.2
BMD-350 ..........................................................................................................................................................................................7
6.3
R
IG
DFU P
IN
F
UNCTIONS
........................................................................................................................................................................9
6.4
BMD
WARE
P
IN
F
UNCTIONS
....................................................................................................................................................................9
7.
ELECTRICAL SPECIFICATIONS .......................................................................................................................................... 10
7.1
A
BSOLUTE
M
AXIMUM
R
ATINGS
..............................................................................................................................................................10
7.2
O
PERATING
C
ONDITIONS
.......................................................................................................................................................................10
7.3
G
ENERAL
P
URPOSE
I/O ........................................................................................................................................................................10
7.4
M
ODULE
RESET.................................................................................................................................................................................11
7.5
D
EBUG
& P
ROGRAMMING
....................................................................................................................................................................11
7.6
C
LOCKS
.............................................................................................................................................................................................11
8.
FIRMWARE .................................................................................................................................................................... 14
8.1
F
ACTORY
I
MAGE
..................................................................................................................................................................................14
8.1.1
Firmware Version ‘AA’
.................................................................................................................................................................14
8.1.2
Firmware Version ‘AB’
.................................................................................................................................................................14
8.1.3
Firmware Version ‘AC’
.................................................................................................................................................................14
8.1.4
Firmware Version ‘AD’
.................................................................................................................................................................14
8.1.5
Firmware Version ‘AE’..................................................................................................................................................................15
8.1.6 Module Programming and Read-Back Protection .......................................................................................................................15
8.2
S
OFT
D
EVICES
.....................................................................................................................................................................................16
8.2.1 S132..............................................................................................................................................................................................16
8.2.2 S212..............................................................................................................................................................................................16
8.2.3 S332..............................................................................................................................................................................................17
8.3
MAC A
DDRESS
I
NFO
...........................................................................................................................................................................17
9.
MECHANICAL DATA ....................................................................................................................................................... 18
9.1
M
ECHANICAL
D
IMENSIONS
....................................................................................................................................................................18
9.1.1 BMD-300 Dimensions ..................................................................................................................................................................18
9.1.2 BMD-301 Dimensions ..................................................................................................................................................................18
9.1.3 BMD-350 Dimensions ..................................................................................................................................................................19
9.2
R
ECOMMENDED
PCB L
AND
P
ADS
...........................................................................................................................................................19
9.2.1 BMD-300/301 ..............................................................................................................................................................................19
9.2.2 BMD-350 ......................................................................................................................................................................................20
10.
MODULE MARKING........................................................................................................................................................ 20
10.1
BMD-300 M
ODULE
M
ARKING
.............................................................................................................................................................20
10.2
BMD-301 M
ODULE
M
ARKING
.............................................................................................................................................................21
10.3
BMD-350 M
ODULE
M
ARKING
.............................................................................................................................................................21
11.
RF DESIGN NOTES .......................................................................................................................................................... 22
11.1
R
ECOMMENDED
RF L
AYOUT
& G
ROUND
P
LANE
........................................................................................................................................22
11.1.1 BMD-300 ......................................................................................................................................................................................22
11.1.2 BMD-301 ......................................................................................................................................................................................22
11.1.3 BMD-350 ......................................................................................................................................................................................22
11.2
M
ECHANICAL
E
NCLOSURE
.....................................................................................................................................................................23
11.3
A
NTENNA
P
ATTERNS
............................................................................................................................................................................24
11.3.1 BMD-300 ......................................................................................................................................................................................24
11.3.2 BMD-350 ......................................................................................................................................................................................26
12.
EVALUATION BOARDS.................................................................................................................................................... 27
13.
CUSTOM DEVELOPMENT ................................................................................................................................................ 27
14.
BLUETOOTH QUALIFICATION .......................................................................................................................................... 28
15.
REGULATORY STATEMENTS............................................................................................................................................ 28
15.1
FCC S
TATEMENT
:................................................................................................................................................................................28
15.2
FCC I
MPORTANT
N
OTES
.......................................................................................................................................................................28
15.3
IC S
TATEMENT
:...................................................................................................................................................................................30
15.4
IC I
MPORTANT
N
OTES
..........................................................................................................................................................................30
15.5
CE R
EGULATORY
.................................................................................................................................................................................31
15.6
J
APAN
(MIC) .....................................................................................................................................................................................31
BMD-300-Series-DS V1.11
Page 3 of 36
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
15.7
A
USTRALIA
/ N
EW
Z
EALAND
..................................................................................................................................................................32
15.8
A
PPROVED
E
XTERNAL
A
NTENNAS
............................................................................................................................................................32
15.9
BMD-350 M
ODULE
L
ABELING
..............................................................................................................................................................32
16.
SOLDER REFLOW TEMPERATURE-TIME PROFILE .............................................................................................................. 33
16.1
M
OISTURE
S
ENSITIVITY
L
EVEL
................................................................................................................................................................33
17.
PACKAGING AND LABELING............................................................................................................................................ 33
17.1
C
ARRIER
T
APE
D
IMENSIONS
...................................................................................................................................................................33
17.1.1 BMD-300 & BMD-301 ..................................................................................................................................................................33
17.1.2 BMD-350 ......................................................................................................................................................................................34
17.2
R
EEL
P
ACKAGING
.................................................................................................................................................................................34
17.3
P
ACKAGING
L
ABEL
...............................................................................................................................................................................35
18.
CAUTIONS ..................................................................................................................................................................... 35
19.
LIFE SUPPORT POLICY .................................................................................................................................................... 35
20.
DOCUMENT HISTORY ..................................................................................................................................................... 36
21.
RELATED DOCUMENTS ................................................................................................................................................... 36
BMD-300-Series-DS V1.11
Page 4 of 36
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
5.
Quick Specifications
Bluetooth
Version
Security
LE connections
5.0 Concurrent Central & Peripheral (S132), 2M LE + Advertisement Extensions
AES-128
Concurrent central, observer, peripheral, and broadcaster roles with up to twenty
concurrent connections along with one Observer and one Broadcaster (S132)
2.360GHz to 2.500GHz
GFSK at 1 Mbps, 2 Mbps data rates
+4 dBm
BMD-300/301: -96 dBm (BLE mode) BMD-350: -94 dBm (BLE mode)
BMD-300: Integrated
BMD-301: U.FL Connector BMD-350: Ceramic Chip
7.5 mA, 5.3 mA
16.6 mA, 11.6 mA
5.4 mA
11.7 mA
7.4 mA, 6.7 mA
3.7 mA, 3.3 mA
0.3 µA, 1.2 µA
30 nA / 4KB block
Radio
Frequency
Modulations
Transmit power
Receiver sensitivity
Antenna
Current Consumption
TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled
TX only @ +4 dBm, 0 dBm
RX only @ 1 Mbps @ 3V, DCDC enabled
RX only @ 1 Mbps
CPU @ 64MHz from flash, from RAM
CPU @ 64MHz from flash, from RAM @ 3V, DCDC
System Off, On
Additional current for RAM retention
Dimensions
BMD-300
BMD-301
BMD-350
Length
Width
Height
Length
Width
Height
14.0 mm ± 0.3mm
9.8 mm ± 0.3mm
1.9 mm ± 0.1mm
8.7 mm ± 0.2mm
6.4 mm ± 0.2mm
1.5 mm ± 0.1mm
I2S
PWM
PDM
Hardware
Interfaces
Power supply
Temperature Range
SPI Master/Slave x 3
UART
Two-Wire Master/Slave (I2C) x 2
GPIO x 32
1.7V to 3.6V
-40C to +85°C
FCC part 15 modular certification
BMD-300/BMD-301 FCC ID: 2AA9B04
BMD-350 FCC ID: 2AA9B05
Industry Canada RSS-210 modular certification
BMD-300/BMD-301 IC: 12208A-04
BMD-350 IC: 12208A-05
EN 60950-1: A2:2013
3.1 (a): Health and Safety of the User
EN 301 489-1 V2.1.1 &
3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1
3.2: Effective use of spectrum allocated
Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan
BMD-300: 210-106799
BMD-301: 210-107153
BMD-350: 210-108944
AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems
–
Short range devices
BMD-300/301 BT4.2 RF-PHY Component (Tested)
–
DID: D030629; QDID: 81876
BMD-300/301 BT5 RF-PHY Component (Tested)
–
DID: D037298; QDID: 101625
BMD-350 BT4.2 RF-PHY Component (Tested)
–
DID: D036284; QDID: 98865
BMD-350 BT5 RF-PHY Component (Tested)
–
DID: D037181; QDID: 101018
Certifications
FCC
IC
CE
Japan (MIC)
Australia / New Zealand
Bluetooth
Export
BMD-300
BMD-301
BMD-350
ECCN: 5A992.C, Exception 742.15(b)(1)
HTS: 8473.30.1180
Table 2
–
Quick Specifications
BMD-300-Series-DS V1.11
Page 5 of 36
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
