电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WCR0603-280KFA

产品描述Thick Film Resistors - SMD
产品类别无源元件   
文件大小553KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WCR0603-280KFA概述

Thick Film Resistors - SMD

WCR0603-280KFA规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Thick Film Resistors - SMD
技术
Technology
Thick Film
安装风格
Mounting Style
PCB Mount

文档预览

下载PDF文档
General Purpose Surface
Resistors
Mounted Resistors
General Purpose Surface
Mounted Resistors
General Purpose Surface
WCR Series
Mounted Resistors
Excellent reliability
WCR Series
Excellent reliability
WCR Series
Wrap around terminations
Wide range of sizes and ohmic values
Inner electrode protection
Excellent reliability
Wrap
range of sizes and ohmic values
Wide
around terminations
Inner electrode protection
Wrap around terminations
Inner electrode protection
AEC-Q200 grade available
Wide range of sizes and ohmic values
Welwyn Components
Welwyn Components
Electrical Data
Electrical
rating @ 70°C
Data
Power
0201
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
0402
0603
0805
1206
1210
2010
2512
0.1
0.125
0.25
0.5
1.0
0.05
0.25
0.063
watts
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
0603
0805
1206
2010
2512
1210
0402
0201
150
25
50
75
Limiting element votage
volts
200
0.1
0.125
0.25
0.5
1.0
0.05
0.063
Power ratingTCR*
@ 70°C
watts
100 0.25
200
250
ppm/°C
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
1
Resistance Tolerance
%
150
25
50
75
Limiting element votage
volts
200
E24 or E96
Standard values
100
200
250
TCR*
ppm/°C
-55 to 155
Ambient temperature range
°C
1
Resistance Tolerance Jumper Chip Rating %
Zero-ohm
amps
1.5
2
0.5
1
E24 or E96
Standard values
<50
Zero-ohm Jumper Chip Resistance milliohms
-55 to 155
Ambient temperature range
°C
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
Zero-ohm Jumper Chip Rating
amps
1.5
2
0.5
1
TCR for high values 3M3 to 10M: ±300ppm/º
<50
Zero-ohm Jumper Chip Resistance milliohms
Physical Data
Dimensions (mm)
Physical Data
L
Style
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
TCR for high values 3M3 to 10M: ±300ppm/º
The chips have a high alumina substrate (96% minimum) with
a ruthenium oxide resistance element and silver palladium,
Figure
Construction
and tin plated terminations. A glazed protection coat
1
nickel
The chips have a high alumina substrate (96% minimum) with
is applied to the resistive element (See Fig.1)
a ruthenium oxide resistance element and silver palladium,
Terminations
nickel and tin plated terminations. A glazed protection coat
Solderability
The terminations meet the requirements of
is applied to the resistive element (See Fig.1)
IEC 115-1, Clause 4.17.3.2.
Terminations
Strength
The terminations meet requirements of
Solderability
The terminations meet the requirements of
IEC 68.2.21.
IEC 115-1, Clause 4.17.3.2.
Strength
The terminations meet requirements of
IEC 68.2.21.
General Note
T
C
A
W
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
0.3 ± 0.03
0201
Dimensions (mm)
1.0 ± 0.1
0.35 ± 0.05
0.2 ± 0.1
0.25 ± 0.1
0.5 ± 0.05
0402
L
T
C
1.6 ± 0.15
0.5 ± 0.15
0.25 ±A
0.2
0.25 ± 0.2
W
Style
0.8 ± 0.15
0603
C
A
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
2.0 ± ± 0.03 1.25+ 0.2 -0.1 0.5 + 0.15 -0.10
0.4 ± 0.2
0.4 ± 0.2
0.3 0.2
0201
0805
1.0 ± 0.1
0.35 -0.15
0.2 ± -0.1
0.25 ± 0.1
L
3.2 +0.1±-0.25 1.6 + 0.1 ± 0.05 0.55 +0.150.1 0.5 + 0.2-0.25 0.5+ 0.2 -0.25
0.5 0.05
0402
1206
W
A T
1.6 ± 0.15 3.2 0.8 ± 0.15
0.50.15
± 0.15 0.550.25 ± 0.2
0.25 ± 0.2
+ 0.1 -0.2
+0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
0603
2.6 ±
1210
A
Wrap-around terminations
2.0 ± 0.2
0.4 0.15
0.4 ± 0.2
5.0 ± 0.15 -0.1 0.5 + 0.15 -0.10 0.56 ± ± 0.2
0.60 ± 0.25
0.60 ± 0.25
1.25+ 0.2
0805
2.5 ± 0.15
2010
(3 faces)
L
3.2 +0.1 -0.25 1.6 + 0.1 -0.15 0.55 +0.15 -0.1 0.56+ 0.2-0.25 0.60 ±0.2 -0.25 1.2 ± 0.85
0.5 ± 0.15
0.5+ 0.25
6.3 ± 0.15
1206
3.2 ± 0.15
W
2512
A
3.2 + 0.1 -0.2
0.55 +0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
2.6 ± 0.15
1210
Wrap-around terminations
5.0 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
0.60 ± 0.25
2.5 ± 0.15
2010
Figure 1
(3 faces)
Construction
± 0.15
6.3 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
1.2 ± 0.85
3.2
2512
C
T
Tin Plating
Epoxy Melamine
Protection
Nickel Barrier
Glass Dielectric
Silver
Dipped Conductor
Resistance Element
Palladium
Epoxy Melamine
Protection
Glass Dielectric
Silver
Resistance Element
Palladium
96% min Alumina Substrate
96% min Alumina Substrate
Tin Plating
Nickel Barrier
Dipped Conductor
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
General
Note
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
General
Note
Welwyn Components
the right to make changes in
changes
specification
specification without notice or liability.
Telephone: +44 (0) 1670 make
product
in product
without notice or
Email:
TT Electronics reserves
reserves the right to 822181 · Facsimile: +44 (0) 1670 829465 ·
liability.
info@welwyn-tt.com · Website: www.welwyn-tt.com
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
Iss 07.03
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
Iss 07.03
05.18
A subsidiary of
TT electronics plc
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
© TT Electronics plc
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
晒晒E金币买的书
中午一觉醒来,接到个电话,包裹来了 敢做敢当当 207471 拆开拆开 207469 c程序设计语言说是经典,可是比想象的薄,看过C primer plus不知道会不会太重复 207470 身体 ......
曾经in 聊聊、笑笑、闹闹
P1端口复用,4*5矩阵键盘的程序如何实现?
这是本人用PROTEUS中画的图。其中端口D7,D1既用于行线也用于列线。因为列线电路中是高电平,所以我想应采用行扫描法。但是程序究竟如何写呢?请高手多多指教 88530另:图中74ls32的RD端,连接 ......
yanse51 51单片机
串口的一个怪问题
请教一个问题:一块pc104的com+422转换器,然后用该com向设备发送数据,设备没有任何反应;用PC的com+该422转换器,用串口调试器向设备发送数据,设备有响应。这样看应该是软件对com的使用上的问 ......
rolim 嵌入式系统
对phy的问题
一直对几个概念很模糊。DDR,DDRC,DDR phy 是什么关系啊?尤其是这个phy(物理层)这块具体是什么啊。好像有很多这样的,比如USB phy,HDMI phy。...
eeleader FPGA/CPLD
我的ccs进不去,求救
我做的板子有个常见问题,ccs进不去,就进去过2次,而且还跟机子有关,我自己的机子怎么也进不去,换了两个机子分别进去了一次,再怎么也进不去,板子也换了几块,访真也换了,可是还是不行,我 ......
lydzyw 嵌入式系统
求David_Lee,qq交流。。。
最近在完成一个项目,期限19号。芯片很多不熟,希望多多指教。谢谢谢谢!...
citymoon 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2358  1823  1923  2613  322  23  14  55  56  35 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved