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Technical Data Sheet
186-18 Soldering Flux
Mildly Activated Rosin Liquid Flux
Product Description
Kester 186-18, under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of
Type RA flux, the flux residue after soldering is non-corrosive and non-conductive. 186-18 rosin flux has been developed
for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of
Type RMA flux. This flux possess high thermal stability for soldering multi-layer assemblies which require a high preheat
temperature. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning sol-
vents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic
activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many
applications. The flux residue is also moisture and fungus resistant.
Performance Characteristics:
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High thermal stability
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Improves soldering performance
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Eliminates the need and expense of
cleaning
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Classified as ROL0 per
J-STD-004 & J-STD-004B
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive. Additional RoHS
information is located at
https://www.kester.com/downloads/environmental.
Physical Properties
Specific Gravity @ 25
o
C:
0.831
(typical)
Percent Solids (typical):
18%
Flash Point:
18°C (64°F)
Reliability Properties
Copper Mirror Corrosion:
Low
IPC-TM-650, Method 2.3.32
Chloride and Bromides:
0.02%
IPC-TM-650, Method 2.3.35
Surface Insulation Resistivity (SIR),
IPC (typical):
Pass
IPC-TM-650, Method 2.6.3.3
Corrosion Test:
Low
IPC-TM-650, Method 2.6.15
Surface Insulation Resistivity (SIR),
IPC:
Pass
IPC-TM-650, Method 2.6.3.7
Silver Chromate:
Pass
IPC-TM-650, Method 2.3.33
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
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Phone: +1 800.2.KESTER
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Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
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Phone: +65 6.449.1133
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Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
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Phone: +49 (0) 8142 4785 0
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Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
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Suzhou, Jiangsu Province, China 215200
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Phone: +86 512.82060807
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Fax: +86 512.8206 0808
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Website: www.kester.com
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Application Notes
Flux Application
186-18 can be applied to circuit boards by a foam or dip process. An air knife after the flux tank is recommended to re-
move excess flux from the circuit board and prevent dripping on the preheated surface.
®
Process Considerations
The optimum preheat temperature for most circuit assemblies is 90-105°C (194-221°F) as measured on the top or
component side of the printed circuit board. Dwell time in the wave is typically 2-4 seconds. The wave soldering speed
should be adjusted to accomplish proper preheating and evaporate excess solvent, which could cause spattering. For
best results, speeds of 1.1-1.8 m/min (3½-6 ft/min) are used. The surface tension has been adjusted to help the flux form
a thin film on the board surface allowing rapid solvent evaporation.
Flux Control
Specific gravity is normally the most reliable method to control the flux concentration of rosin-based fluxes. To check
concentration, a hydrometer should be used. Control of the flux in the foam flux tank during use is necessary for
assurance of consistent flux distribution on the circuit boards. The complex nature of the solvent system for the flux makes
it imperative that Kester 120 Thinner be used to replace evaporative losses. When excessive debris from circuit boards,
such as board fibers and from the air line build up in the flux tank, these particulates will redeposit on the circuit boards
which may create a build up of residues on probe test pins. It is, therefore, necessary to clean the tank and then replenish
it with fresh flux when excessive debris accumulates in the flux tank.
Cleaning
186-18 residues are non-conductive, non-corrosive and do not require removal in most applications. If residue removal
is required, it can be removed using commercially available flux residue cleaner. Contact Kester Technical Support for
additional assistance.
Storage, Handling and Shelf Life
186-18 is flammable. Store away from sources of ignition. Shelf life is 2 years from the date of manufacture when handled
properly and held at 10-25°C (50-77°F).
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
and warning label before using this product. Safety Data Sheets are available at https://www.kester.com/downloads/sds.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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