®
Technical Data Sheet
48 Flux-Cored Wire
Product Description
Activated Rosin Cored Wire for Lead-free and Leaded Alloys
Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most
common metals. 48 has performance characteristics far exceeding standard RA fluxes. 48 builds on the performance of
its predecessor Kester 44 with “instant-action” wetting to provide fast and reliable solder joints.
Performance Characteristics:
■
Unparalleled wetting performance
■
Excellent solderability and fast
wetting to a variety of surface fin-
ishes
■
Eliminates the need and expense of
cleaning
■
Low spattering
■
Low smoke and odor
■
Classified as ROM1 per J-STD-004
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead
containing products at the user level. (Applies only if this core flux is combined with a lead-free alloy)
Reliability Properties
Copper Mirror Corrosion:
Low
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Silver Chromate:
Fail
Tested to J-STD-004, IPC-TM-650, Method
2.3.33
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35.1
Surface Insulation Resistance (SIR),
(typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Chloride and Bromides:
1.05%
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Blank
Day 1
Day 4
Day 7
1.6*10
10
Ω
1.2*10
10
Ω
1.1*10
Ω
10
48
1.1*10
10
Ω
9.2*10
9
Ω
8.6*10
Ω
9
Spread Test (typical):
Tested to J-STD-004, IPC-TM-650, Method
2.4.46
Area of Spread mm
2
(in
2
)
Flux Core Solder
285 Mildly Activated Rosin
275 No-Clean
44 Activated Rosin
48 Activated Rosin
Sn96.5Ag3.0Cu0.5
213 (0.33)
219 (0.34)
220 (0.34)
245 (0.38)
Sn63Pb37
335 (0.52)
361 (0.56)
342 (0.53)
419 (0.65)
Application Notes
Availability
®
48 flux cored wire is available in a wide variety of alloys, wire diameters and flux percentages and roll sizes. The most
common alloys are Sn96.5Ag3.0Cu0.5 and K100LD. Please refer to www.kester.com for wire diameters, flux percentages
and roll sizes that are available.
Note: Core Size 50, 58 and 66 = 1.1, 2.2 and 3.3% flux core
Process Considerations
Solder iron tip temperatures are most commonly between 371-400°C (700-750°F) for lead-free alloys. Heat both the land
area and component lead to be soldered with the iron prior to apply the solder wire to the land area or component lead.
Do not apply the wire directly to the soldering iron tip. This will shorten the life of the solder tip. If needed, Kester 186 flux
may be used as a compatible liquid flux to aid in reworking soldered joints.
Cleaning
48 possesses excellent fluxing ability, the flux residue is non-corrosive and non-conductive under normal conditions of
use. When exposed to an elevated temperature and humidity environment (38°C, 94% RH) for 72 hours, there is no
evidence of corrosion caused by the flux residue. IPA will not clean the residues off the surface of the circuit board after
the soldering process. A saponifier or cleaning agent specifically designed to clean a rosin based flux is required to clean
the residues. Please contact Kester Technical Support for further information.
Storage and Warranty Period
Storage must be in a dry, non-corrosive environment between 10-40°C (50-104°F). The surface may lose its shine and
appear a dull shade of grey. This is a surface phenomenon and is not detrimental to product functionality. Flux-cored
solder wire has a limited warranty period determined by the alloy used in the wire. For alloys containing more than 70%
lead, the warranty period is 2 years from the date of manufacture. Other alloys have a warranty period of 3 years from the
date of manufacture.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
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