LVR Series
Low-TCR Current Sense Chips
The resistors are constructed using out-
standing TCR level material, which makes
LVR resistors excellent for current sensing
application in battery charger circuit & DC-DC
converter. The composition of the resistive
material is adjusted to give the LVR series
resistors more resistive stability than the
competition in very small package sizes.
a p p L i c at i o n S
• Consumer goods
• Computer
• Telecom / Datacom
• Industrial / Power supply
• Alternative Energy
• Car electronics
• Battery
S e R i e S S p e c i f i c at i o n S
Series
LVR02A
LVR04A
Size
0201
0402
Power
Rating
0.1W
0.125W
Resistance Range
5mΩ - 10mΩ
2.5mΩ
5mΩ - 20mΩ
TCR (ppm/°C)
150ppm/°C
±350 ppm/°C
±150 ppm/°C
Tolerance
1%, 5%
1%, 5%
chaRacteRiSticS
Operating
–55°C to +125°C
Temp. Range
Power
Standard rated power at 70°C; see chart above
Rating
Rated
The DC or AC (rms) continuous working voltage cor-
Voltage
responding to the rated power is determined by the
following formula:
V =
√(PxR)
or max. working voltage whichever is less, where:
V = Cont. rated DC or AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (Ω)
Resistance range
TCR
Temperature
Size
Coeff. of
0201
5mΩ - 10mΩ
±150 ppm/°C
Resistance
0402
2.5mΩ
±350 ppm/°C
5mΩ - 20mΩ
±150 ppm/°C
Terminations
Cu, Ni, matte Tin
Derating
100
Percent Rated Power
80
60
40
20
125°
0
-60 -40 -20 0 20 40 60 80 100 120 140 160
Ambient Temperature,
°C
-55°
70°
Reflow Soldering Conditions
300
250
Temperature °C
200
150
100
50
0
0
ramp up
rate <3K/s
Preheating
50
100
150
Time (sec.)
200
250
270°
ramp up
rate <3K/s
190°
ramp down
rate <6K/s
12
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
LVR Series
Low-TCR Current Sense Chips
Test Method
Short time
IEC60115-1 4.13
overload
High
MIL-STD-202-Method
Temperature
108
Exposure
Moisture
MIL-STD-202-Method
Resistance
106
Operational
MIL-STD-202 Method
Life/
108
Endurance
IEC 60115-1 4.25.1
Solderability -
J-STD-002 test B
Wetting
Moisture
MIL-STD-202 Method
Resistance
106
Thermal
MIL-STD-202 Method
Shock
107
Board Flex/
IEC 60115-1 4.33
Bending
Resistance
MIL-STD-202 Method
to Soldering
210
Heat
IEC 60115-1 4.18
p e R f o R m a n c e d ata
Procedure
2.5 times of rated power for 5 seconds at room temperature
1,000 hours at maximum operating temperature depending on speci-
fication, unpowered. No direct impingement of forced air to the parts
Tolerances: 125±5ºC
Requirements
±(1%+0.0005Ω)
No visible damage
±(1.0%+0.0005Ω)
Each temperature / humidity cycle is defined at 8 hours (method 106F), ±(0.5%+0.0005Ω)
3 cycles / 24 hours for 10d with 25ºC / 65ºC 95% R.H, without steps 7a
& 7b, unpowered
1,000 hours at 70±2ºC applied RCWV. 1.5 hours on, 0.5 hour off, still air ±(1.0%+0.0005Ω)
required
Electrical Test not required. Magnification 50X. SMD conditions: 1st step
: method B, aging 4 hours at 155°C dry heat; 2nd step: leadfree solder
bath at 245±3°C; Dipping time: 3± 0.5 seconds
Each temperature / humidity cycle is defined at 8 hours (Method 106G),
3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a
& 7b, un-powered Parts mounted on test board, without condensation
on parts. Measurement at 24±2 hours after test conclusion.
-55/+125°C. Number of cycles required is 300. Parts mounted on test
board. Maximum transfer time is 20 seconds. Dwell time is 15 minutes.
Device mounted on PCB test board as described, only 1 board bend-
ing required. 2 mm bending. Bending time: 60±1 seconds. Ohmic value
checked during bending
Condition B, no pre-heat of samples. Leadfree solder, 260±5°C,
10±1seconds immersion time. Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
Well tinned (>95% covered)
No visible damage
±(0.5% + 0.0005Ω)
No visible damage
±(1.0% + 0.0005Ω)
±(1.0 % + 0.0005Ω)
±(0.5% + 0.0005Ω)
No visible damage
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
13
LVR Series
Low-TCR Current Sense Chips
(mm)
dimenSionS
H
l
1
Size
0201
0402
Res. Range
5mΩ - 10mΩ
2.5mΩ
5mΩ ≤ R ≤ 10mΩ
12mΩ ≤ R ≤ 20mΩ
L
0.60 ±0.03
1.00 ±0.10
1.00 ±0.10
1.00 ±0.10
Typical
sensing
traces
W
0.31 ±0.04
0.55 ±0.10
0.55 ±0.10
0.55 ±0.10
H
0.30 ±0.05
0.30 ±0.10
Max. 0.30
Max. 0.40
l1
0.15 ±0.06
0.25 ±0.10
0.25 ±0.10
0.25 ±0.10
W
Reflow Soldering footprint
Size
0402
0201
A
2.0
1.0
B
0.3
0.4
C
0.35
0.8
D
0.4
0.6
D
C
B
A
ta p e a n d R e e L
(mm)
T
D
0
P
2
P
0
E
W
2
cover
tape
F W
B
0
A
0
D
CN A
P
1
Paper/PE tape
Size
0402
0201
A0
0.59 ±0.10
0.35 ±0.10
B0
1.10 ±0.10
0.65 ±0.10
W
8.00 ±0.10
8.0 ±0.20
E
1.75 ±0.10
1.75 ±0.10
F
3.50 ±0.10
3.5 ±0.05
P0
4.00 ±0.10
4.0 ±0.10
P1
4.00 ±0.10
2.0 ±0.05
P2
2.00 ±0.10
2.0 ±0.05
ØD0
1.55 ±0.05
W
1
T
0.48 ±0.03
Qty. per reel
(178mm)
10,000
10,000
1.5 +0.1/-0 0.35 ±0.10*
Reel dimensions
Qty./reel
10,000
8mm tape
7" (Ø178mm)
A
178.0 ±1.0
N
60.0 +1/-0
C
13.50 ±0.5
D
21.0 ±0.8
W1
9.0 ±0.5
W2 max.
12.0 ±0.2
o R d e R i n G i n f o R m at i o n
RoHS Compliant
LVR02R005FER
Series
Tolerance Tape
Size
Ohms
J = 5%
& reel
02 = 0201 5% in E24
04 = 0402 values, 1% and F = 1%
lower tolerances
available in E24
and E96 values
rev 10/17-1
14
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
