Rigado LLC
3950 Fairview Industrial Dr. SE Suite 100
Salem, Oregon 97302
866-6-RIGADO • modules@rigado.com
www.rigado.com/modules
BMD-200 Module for Bluetooth 4.2 LE
The
BMD-200
from Rigado is a powerful, highly flexible
Bluetooth
Smart module based on the nRF51822 SoC from Nordic
Semiconductor. With an ARM® Cortex™ M0 CPU, embedded
2.4GHz transceiver, and on-module chip antenna, the
BMD-200
provides a complete RF solution with no additional RF design,
allowing faster time to market. The
BMD-200
provides full use of
the nRF51822’s on-chip peripherals, allowing for a wide range of
applications without the need for an external host
microcontroller; simplifying designs and reducing BOM costs.
With an internal DC-DC converter and a voltage supply range of
1.8V to 3.6V, the
BMD-200
can be powered directly from a coin
cell or two AAA batteries with ultra-low power consumption.
1. Features
Based on the Nordic nRF51822 SoC
Complete RF solution with integrated chip
antenna
Integrated DC-DC converter
No external components required
ARM® Cortex™-M0 32-bit processor
Serial Wire Debug (SWD)
S100 series SoftDevice ready
Over-the-Air (OTA) firmware updates
256 kB embedded flash program memory
32/16 kB RAM
FCC ID: 2AA9B03
IC: 12208A-01
One 32-bit and two 16-bit timers with counter
mode
15 General Purpose I/O Pins
8/9/10 bit ADC - 8 configurable channels
SPI Master/Slave (4 Mbps/2 Mbps)
Low power comparator
Temperature sensor
Two-wire Master (I2C compatible)
UART (w/ CTS/RTS)
CPU independent Programmable Peripheral
Interconnect (PPI)
Quadrature Decoder (QDEC)
AES HW encryption
Real Timer Counter (RTC)
Dimensions: 17x17x2.9mm
2. Applications
Appcessories
Beacons – iBeacon™, AltBeacon, Eddystone, etc.
Low-Power Sensors
Connected Appliances
Lighting Products
Fitness devices
Wearables
BMD-200-DS-V1.6
Page 1 of 26
BMD-200 Module Datasheet
Bluetooth 4.2 LE
6/8/2016
3. Ordering Information
Email
modules@rigado.com
for quotes and ordering or visit
www.rigado.com/BMD-200
Part Number
BMD-200-A-CT
BMD-200-A-R
BMD-200-B-CT
BMD-200-B-R
BMD-200-EVAL-S
BMD-200-EVAL-M
Description
BMD-200 module, 16kB, Rev A, Cut Tape
BMD-200 module, 16kB, Rev A, Tape & Reel, 1000 piece multiples
BMD-200 module, 32kB, Rev B, Cut Tape
BMD-200 module, 32kB, Rev B, Tape & Reel, 1000 piece multiples
BMD-200 Evaluation Kit with Segger JLink-OB programmer
BMD-200 Evaluation Kit with mbed programmer
Table 1 - Ordering Part Numbers
4. Block Diagram
BMD-200 Bluetooth 4.2 Low Energy SoC Module
nRF51822
256kB
Flash
32kB/16kB
RAM
SWD Debug &
Programming
Core LDO
Accel Address
Resolver
ARM Cortex-M0
@ 16MHz
AES ECB
AES CCM Mode
Encryption
Bluetooth Low
Energy Radio
Balun &
Matching
Network
Clock
Management
Watchdog
Timer
Real Time
Counter x2
Timer x3
Random
Number Gen
Programmable
Peripheral
Interconnect
Temperature
Sensor
Low Power
Comparator
8-ch 10-bit
ADC
GPIO Task
Event Blocks
SPI Master
x2
SPI Slave
UART
Quadrature
Decoder
Ceramic
Chip
Antenna
DC/DC Buck
Regulator
TWI
Master x2
DC-DC
Inductor
Bulk
Capacitors
Decoupling
Capacitors
GPIO x15
(Analog x9)
16 MHz
Crystal
Figure 1 – Block Diagram
BMD-200-DS-V1.6
Page 2 of 26
BMD-200 Module Datasheet
Bluetooth 4.2 LE
6/8/2016
Table of Contents
1.
2.
3.
4.
5.
6.
FEATURES ..................................................................................................................................................................................1
APPLICATIONS ...........................................................................................................................................................................1
ORDERING INFORMATION .........................................................................................................................................................2
BLOCK DIAGRAM .......................................................................................................................................................................2
QUICK SPECIFICATIONS..............................................................................................................................................................5
PIN DESCRIPTIONS .....................................................................................................................................................................6
6.1
6.2
7.
R
IG
DFU P
IN
F
UNCTIONS
.................................................................................................................................................. 7
BMD
WARE
P
IN
F
UNCTIONS
............................................................................................................................................. 7
A
BSOLUTE
M
AXIMUM
R
ATINGS
......................................................................................................................................... 8
O
PERATING
C
ONDITIONS
.................................................................................................................................................. 8
G
ENERAL
P
URPOSE
I/O.................................................................................................................................................... 8
D
EBUG
& P
ROGRAMMING
................................................................................................................................................ 9
C
LOCKS
......................................................................................................................................................................... 9
ELECTRICAL SPECIFICATIONS......................................................................................................................................................8
7.1
7.2
7.3
7.4
7.5
8.
FIRMWARE .............................................................................................................................................................................. 10
8.1 F
ACTORY
I
MAGE
........................................................................................................................................................... 10
8.1.1
F
IRMWARE
V
ERSION
‘AA’ (D
EPRECATED
) ................................................................................................................ 10
8.1.2
F
IRMWARE
V
ERSION
‘AB’ ..................................................................................................................................... 10
8.1.3
F
IRMWARE
V
ERSION
‘AC’ ..................................................................................................................................... 10
8.1.4
F
IRMWARE
V
ERSION
‘AD’..................................................................................................................................... 10
8.1.5
M
ODULE
P
ROGRAMMING AND
R
EAD
-B
ACK
P
ROTECTION
............................................................................................ 10
8.2 S
OFT
D
EVICES
............................................................................................................................................................... 11
8.2.1
S110 ................................................................................................................................................................ 11
8.2.2
S120 ................................................................................................................................................................ 12
8.2.3
S130 ................................................................................................................................................................ 12
8.3 MAC A
DDRESS
I
NFO
..................................................................................................................................................... 13
9.
MECHANICAL DATA ................................................................................................................................................................. 14
9.1
9.2
10.
11.
M
ODULE
D
IMENSIONS
................................................................................................................................................... 14
R
ECOMMENDED
PCB L
AND
P
AD
..................................................................................................................................... 14
MODULE MARKING ................................................................................................................................................................. 15
RF DESIGN NOTES .................................................................................................................................................................... 15
11.1
R
ECOMMENDED
RF L
AYOUT
& G
ROUND
P
LANE
............................................................................................................ 15
11.2
M
ECHANICAL
E
NCLOSURE
.......................................................................................................................................... 16
11.3
A
NTENNA
P
ATTERN
.................................................................................................................................................. 16
11.3.1 S33 S
MITH
C
HART
.............................................................................................................................................. 17
11.3.2 3D R
ADIATION
P
ATTERN
...................................................................................................................................... 17
11.3.3 XY-
PLANE
.......................................................................................................................................................... 18
11.3.4 XZ-
PLANE
.......................................................................................................................................................... 18
11.3.5 YZ-
PLANE
.......................................................................................................................................................... 19
12.
13.
14.
15.
EVALUATION BOARDS ............................................................................................................................................................. 19
CUSTOM DEVELOPMENT ......................................................................................................................................................... 19
BLUETOOTH CERTIFICATION .................................................................................................................................................... 19
REGULATORY STATEMENTS ..................................................................................................................................................... 20
15.1
15.2
15.3
15.4
15.5
15.6
16.
17.
FCC S
TATEMENT
: .................................................................................................................................................... 20
FCC I
MPORTANT
N
OTES
:........................................................................................................................................... 20
IC S
TATEMENT
: ....................................................................................................................................................... 21
IC I
MPORTANT
N
OTES
: ............................................................................................................................................. 22
CE R
EGULATORY
: ..................................................................................................................................................... 22
MIC (J
APAN
): ......................................................................................................................................................... 22
C
ARRIER
T
APE
D
IMENSIONS
....................................................................................................................................... 23
R
EEL
P
ACKAGING
..................................................................................................................................................... 24
P
ACKAGING
L
ABEL
.................................................................................................................................................... 24
SOLDER REFLOW TEMPERATURE-TIME PROFILE ...................................................................................................................... 23
PACKAGING AND LABELING ..................................................................................................................................................... 23
17.1
17.2
17.3
18.
CAUTIONS ............................................................................................................................................................................... 25
BMD-200-DS-V1.6
Page 3 of 26
BMD-200 Module Datasheet
Bluetooth 4.2 LE
6/8/2016
5. Quick Specifications
Bluetooth
Version
Security
LE connections
Radio
Frequency
Modulations
Transmit power
Receiver sensitivity
Antenna
4.2 (Bluetooth Smart) Simultaneous Peripheral & Central
(SoftDevice S130) / 4.1 Peripheral (S110) / 4.1 Central (S120)
AES-128
3 Central & 1 Peripheral (S130) / 1 Peripheral (S110) / up to 8
Central (S120)
2.402GHz to 2.480GHz
GFSK at 250 kbps, 1 Mbps (BLE), 2 Mbps data rates
+4 dBm
-93 dBm (BLE mode)
Integrated ceramic chip
11.8 mA, 8.0 mA, 6.3 mA
9.7 mA
4.1 mA, 2.4 mA
0.6
µA,
0.6
µA
Current Consumption
TX only @ +4 dBm, 0 dBm, -4 dBm (w/DCDC)
RX only @ 1 Mbps (w/DCDC)
CPU @ 16MHz from flash, from RAM
System Off , additional per 8k RAM retention
Dimensions
Length
Width
Height
Hardware
Interface
Power supply
Temperature Range
Certifications
FCC
IC
CE
Japan (Telec)
Bluetooth
17.0 mm
17.0 mm
2.9 mm
SPI Master/Slave, UART, Two-Wire Master, GPIO
1.8V to 3.6V
-25 to +75°C
(-40 to +85°C with reduced specifications, 16kB only)
FCC part 15 modular qualification – FCC ID: 2AA9B03
Industry Canada RSS-210 modular qualification – IC: 12208A-01
EN 60950-1: 2011-01 3.1 (a) : Health and Safety of the User
EN 301 489-17 V2.2.1 3.1 (b) : Electromagnetic Compatibility
EN 301 489-1 V1.9.2
EN 300 328 V1.8.1
3.2 : Effective use of spectrum allocated
Type Accepted – Contact Rigado for information.
RF-PHY Component (Tested) – DID: D024097
End Product with S110 7.0.0 – DID: D024117
Table 2- Quick Specifications
BMD-200-DS-V1.6
Page 5 of 26
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