Hot Swap Voltage Controllers LTC4242 - Dual Slot Hot Swap Controller for PCI Express
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | SSOP, |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G36 |
| JESD-609代码 | e0 |
| 长度 | 12.8 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 36 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 5.3 mm |
| LTC4242CG | LTC4242IUHF#TR | LTC4242CG#TR | LTC4242IG#TR | |
|---|---|---|---|---|
| 描述 | Hot Swap Voltage Controllers LTC4242 - Dual Slot Hot Swap Controller for PCI Express | Hot Swap Voltage Controllers LTC4242 - Dual Slot Hot Swap Controller for PCI Express | 热交换电压控制器 LTC4242 - Dual Slot Hot Swap Controller for PCI Express | 热交换电压控制器 LTC4242 - Dual Slot Hot Swap Controller for PCI Express |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 包装说明 | SSOP, | HVQCCN, | SSOP, | SSOP, |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G36 | R-PQCC-N38 | R-PDSO-G36 | R-PDSO-G36 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 12.8 mm | 7 mm | 12.8 mm | 12.8 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 36 | 38 | 36 | 36 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | HVQCCN | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 | 235 | 235 | 235 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 0.8 mm | 2 mm | 2 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 |
| 宽度 | 5.3 mm | 5 mm | 5.3 mm | 5.3 mm |
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