NCV4295C
30 mA Low Dropout Voltage
Regulator with Power Fail
The NCV4295C is a monolithic integrated low dropout voltage
regulator with an output current capability of 30 mA available in the
TSOP–5 package.
The output voltage is accurate within
±4.0%
with a maximum
dropout voltage of 250 mV with an input up to 45 V. Low quiescent
current is a feature typically drawing only 160
mA
with a 1 mA load.
The Power Fail output is driven to low level in case of the output
undervoltage. This part is ideal for automotive and all battery
operated microprocessor equipment.
The regulator is protected against reverse battery, short circuit and
thermal overload conditions.
Features
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MARKING
DIAGRAM
5
5
1
TSOP−5
CASE 483
1
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
XXXAYWG
G
•
•
•
•
•
•
•
•
Output Voltage Options: 3.3 V, 5.0 V
Output Voltage Accuracy:
±4.0%
Output Current: up to 30 mA
Low Quiescent Current (typ. 160
mA
@ 1 mA)
Low Dropout Voltage (typ. 65 mV @ 20 mA)
Wide Input Voltage Operating Range: up to 45 V
Power Fail Output
Protection Features:
♦
Current Limitation
♦
Thermal Shutdown
♦
Reverse Polarity Protection and Reverse Bias Protection
•
AEC−Q100 Grade 1 Qualified and PPAP Capable
•
This is a Pb−Free Device
Typical Applications
PIN CONNECTIONS
PF
GND
V
in
1
2
3
4
(Top View)
V
out
5
GND
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 10 of this data sheet.
•
Microprocessor Systems Power Supply
Input
C
in
100 nF
V
in
NCV4295C
V
out
Output
C
out
2.2
mF
GND
PF
Power Fail
Figure 1. Applications Circuit
©
Semiconductor Components Industries, LLC, 2017
November, 2017
−
Rev. 2
1
Publication Order Number:
NCV4295C/D
NCV4295C
V
in
VOLTAGE
REFERENCE
SATURATION
PROTECTION
THERMAL
SHUTDOWN
GND
TSD
V
REF
V
out
SP
SP
POWER
FAIL
PF
TSD
V
REF
Figure 2. Simplified Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
TSOP−5
1
2
3
4
5
Pin Name
PF
GND
V
in
V
out
GND
Description
Power Fail Output. Low state for output undervoltage.
Power Supply Ground.
Unregulated Positive Power Supply Input. Connect 0.1
mF
capacitor to ground.
Regulated Positive Output Voltage. Connect 2.2
mF
capacitor with ESR < 7
W
to ground.
Power Supply Ground.
ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage DC (Note 1)
DC
Input Voltage (Note 2)
Load Dump
−
Suppressed
Output Voltage
Power Fail Output Voltage
DC
Power Fail Output Current Range
DC
Maximum Junction Temperature
Storage Temperature
Symbol
V
in
U
s
V
out
V
PF
I
PF
T
J(max)
T
STG
Min
−42
−
−6
−0.3
−0.5
−40
−50
Max
45
60
30
45
−
150
150
Unit
V
V
V
V
mA
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class A according to ISO16750−1.
ESD CAPABILITY
(Note 3)
Rating
ESD Capability, Human Body Model
Symbol
ESD
HBM
Min
−2
Max
2
Unit
kV
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes <50mm
2
due to the
inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic
defined in JEDEC JS−002−2014.
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2
NCV4295C
LEAD SOLDERING TEMPERATURE AND MSL
(Note 4)
Rating
Moisture Sensitivity Level
Symbol
MSL
Min
1
Max
Unit
−
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air (Note 5)
Symbol
R
θJA
Value
136.2
Unit
°C/W
5. Values based on copper area of 645 mm
2
(or 1 in
2
) of 1 oz copper thickness and FR4 PCB substrate.
RECOMMENDED OPERATING RANGES
Rating
Input Voltage (Note 6)
Junction Temperature
Symbol
V
in
T
J
Min
V
out, nom
+ 0.5 or 3.5
−40
Max
45
150
Unit
V
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
6. Minimum V
in
= V
out, nom
+ 0.5 or 3.5, whichever is higher.
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NCV4295C
ELECTRICAL CHARACTERISTICS
V
in
= 13.5 V, C
in
= 0.1
mF,
C
out
= 2.2
mF,
for typical values T
J
= 25°C, for min/max values T
J
=
−40°C
to 150°C; unless otherwise noted.
(Note 7)
Parameter
REGULATOR OUTPUT
Output Voltage
5.0 V V
in
= 13.5 V, I
out
= 1 mA to 30 mA
V
in
= 6 V to 40 V, I
out
= 10 mA
3.3 V V
in
= 13.5 V, I
out
= 1 mA to 30 mA
V
in
= 4.3 V to 40 V, I
out
= 10 mA
V
in
= V
in, min
to 36 V, I
out
= 5 mA, T
J
= 25°C
V
in
= V
in, min
to 36 V, I
out
= 5 mA
I
out
= 1 mA to 25 mA, T
J
= 25°C
I
out
= 1 mA to 25 mA
I
out
= 20 mA
V
out
4.80
4.80
3.17
3.17
−
−
−
−
−
5.00
5.00
3.30
3.30
5
10
3
10
65
5.20
5.20
3.43
3.43
20
30
20
30
250
V
Test Conditions
Symbol
Min
Typ
Max
Unit
Line Regulation
Load Regulation
Dropout Voltage (Note 8)
QUIESCENT CURRENT
Quiescent Current, I
q
= I
in
−
I
out
Reg
line
Reg
load
V
DO
I
q
mV
mV
mV
I
out
< 0.1 mA, T
J
< 85°C
I
out
< 1 mA
I
out
< 30 mA
V
out
= V
out, nom
– 100 mV
f = 100 Hz, 0.5 V
pp
−
−
−
150
160
0.8
170
200
4
μA
μA
mA
CURRENT LIMIT PROTECTION
Current Limit
PSRR
Power Supply Ripple Rejection
POWER FAIL
Power Fail Switching Threshold
5.0 V
3.3 V
Power Fail Headroom
5.0 V
3.3 V
I
PF
= 0.1 mA
Internally connected to V
out
V
out, PF
−
−
50
33
−
70
4.86
3.20
140
100
10
100
−
−
300
200
50
130
V
PSRR
−
60
−
dB
I
LIM
30
−
−
mA
V
out, nom
−
V
out, PF
V
PF, low
R
PF
T
SD
mV
Power Fail Low Voltage
Power Fail Pull−up
THERMAL SHUTDOWN
Thermal Shutdown Temperature
(Note 9)
mV
kW
151
175
195
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at T
A
[T
J
. Low duty cycle
pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Measured when output voltage falls 100 mV below the regulated voltage at V
in
= 13.5 V. If V
out
< 5 V, then V
DO
= V
in
−
V
out
. Maximum dropout
voltage value is limited by minimum input voltage V
in
= V
out, nom
+ 0.5 V recommended for guaranteed operation at maximum output current.
9. Values based on design and/or characterization.
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NCV4295C
TYPICAL CHARACTERISTICS
−
5.0 V VERSION
1000
Unstable Region
100
10
1
0.1
0.01
Stable Region
C
out
≥
2.2
mF
T
J
= 25°C
0
5
10
15
20
25
30
ESR (W)
I
out
, OUTPUT CURRENT (mA)
Figure 3. Output Stability with Output
Capacitor ESR
5.10
V
out
, OUTPUT VOLTAGE (V)
V
out
, OUTPUT VOLTAGE (V)
V
in
= 13.5 V
R
L
= 5 kW
5.05
6
5
4
3
2
1
0
R
L
= 166
W
T
J
= 25°C
0
1
2
3
4
5
6
7
8
9
10
5.00
4.95
4.90
−40
0
40
80
120
160
T
J
, JUNCTION TEMPERATURE (°C)
V
in
, INPUT VOLTAGE (V)
Figure 4. Output Voltage vs. Junction
Temperature
150
V
DO
, DROPOUT VOLTAGE (mV)
I
out
, OUTPUT CURRENT (mA)
T
J
= 125°C
100
70
60
50
40
30
20
10
0
0
Figure 5. Output Voltage vs. Input Voltage
T
J
= 25°C
50
T
J
=
−40°C
0
V
out
= 0 V
T
J
= 25°C
5
10
15
20
25
30
35
40
45
0
5
10
15
20
25
30
I
out
, OUTPUT CURRENT (mA)
V
in
, INPUT VOLTAGE (V)
Figure 6. Dropout Voltage vs. Output Current
Figure 7. Maximum Output Current vs. Input
Voltage
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