电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WCR2512-316RFA

产品描述Thick Film Resistors - SMD
产品类别无源元件   
文件大小553KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WCR2512-316RFA概述

Thick Film Resistors - SMD

WCR2512-316RFA规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Thick Film Resistors - SMD
技术
Technology
Thick Film
安装风格
Mounting Style
PCB Mount

文档预览

下载PDF文档
General Purpose Surface
Resistors
Mounted Resistors
General Purpose Surface
Mounted Resistors
General Purpose Surface
WCR Series
Mounted Resistors
Excellent reliability
WCR Series
Excellent reliability
WCR Series
Wrap around terminations
Wide range of sizes and ohmic values
Inner electrode protection
Excellent reliability
Wrap
range of sizes and ohmic values
Wide
around terminations
Inner electrode protection
Wrap around terminations
Inner electrode protection
AEC-Q200 grade available
Wide range of sizes and ohmic values
Welwyn Components
Welwyn Components
Electrical Data
Electrical
rating @ 70°C
Data
Power
0201
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
0402
0603
0805
1206
1210
2010
2512
0.1
0.125
0.25
0.5
1.0
0.05
0.25
0.063
watts
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
0603
0805
1206
2010
2512
1210
0402
0201
150
25
50
75
Limiting element votage
volts
200
0.1
0.125
0.25
0.5
1.0
0.05
0.063
Power ratingTCR*
@ 70°C
watts
100 0.25
200
250
ppm/°C
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
1
Resistance Tolerance
%
150
25
50
75
Limiting element votage
volts
200
E24 or E96
Standard values
100
200
250
TCR*
ppm/°C
-55 to 155
Ambient temperature range
°C
1
Resistance Tolerance Jumper Chip Rating %
Zero-ohm
amps
1.5
2
0.5
1
E24 or E96
Standard values
<50
Zero-ohm Jumper Chip Resistance milliohms
-55 to 155
Ambient temperature range
°C
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
Zero-ohm Jumper Chip Rating
amps
1.5
2
0.5
1
TCR for high values 3M3 to 10M: ±300ppm/º
<50
Zero-ohm Jumper Chip Resistance milliohms
Physical Data
Dimensions (mm)
Physical Data
L
Style
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
TCR for high values 3M3 to 10M: ±300ppm/º
The chips have a high alumina substrate (96% minimum) with
a ruthenium oxide resistance element and silver palladium,
Figure
Construction
and tin plated terminations. A glazed protection coat
1
nickel
The chips have a high alumina substrate (96% minimum) with
is applied to the resistive element (See Fig.1)
a ruthenium oxide resistance element and silver palladium,
Terminations
nickel and tin plated terminations. A glazed protection coat
Solderability
The terminations meet the requirements of
is applied to the resistive element (See Fig.1)
IEC 115-1, Clause 4.17.3.2.
Terminations
Strength
The terminations meet requirements of
Solderability
The terminations meet the requirements of
IEC 68.2.21.
IEC 115-1, Clause 4.17.3.2.
Strength
The terminations meet requirements of
IEC 68.2.21.
General Note
T
C
A
W
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
0.3 ± 0.03
0201
Dimensions (mm)
1.0 ± 0.1
0.35 ± 0.05
0.2 ± 0.1
0.25 ± 0.1
0.5 ± 0.05
0402
L
T
C
1.6 ± 0.15
0.5 ± 0.15
0.25 ±A
0.2
0.25 ± 0.2
W
Style
0.8 ± 0.15
0603
C
A
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
2.0 ± ± 0.03 1.25+ 0.2 -0.1 0.5 + 0.15 -0.10
0.4 ± 0.2
0.4 ± 0.2
0.3 0.2
0201
0805
1.0 ± 0.1
0.35 -0.15
0.2 ± -0.1
0.25 ± 0.1
L
3.2 +0.1±-0.25 1.6 + 0.1 ± 0.05 0.55 +0.150.1 0.5 + 0.2-0.25 0.5+ 0.2 -0.25
0.5 0.05
0402
1206
W
A T
1.6 ± 0.15 3.2 0.8 ± 0.15
0.50.15
± 0.15 0.550.25 ± 0.2
0.25 ± 0.2
+ 0.1 -0.2
+0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
0603
2.6 ±
1210
A
Wrap-around terminations
2.0 ± 0.2
0.4 0.15
0.4 ± 0.2
5.0 ± 0.15 -0.1 0.5 + 0.15 -0.10 0.56 ± ± 0.2
0.60 ± 0.25
0.60 ± 0.25
1.25+ 0.2
0805
2.5 ± 0.15
2010
(3 faces)
L
3.2 +0.1 -0.25 1.6 + 0.1 -0.15 0.55 +0.15 -0.1 0.56+ 0.2-0.25 0.60 ±0.2 -0.25 1.2 ± 0.85
0.5 ± 0.15
0.5+ 0.25
6.3 ± 0.15
1206
3.2 ± 0.15
W
2512
A
3.2 + 0.1 -0.2
0.55 +0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
2.6 ± 0.15
1210
Wrap-around terminations
5.0 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
0.60 ± 0.25
2.5 ± 0.15
2010
Figure 1
(3 faces)
Construction
± 0.15
6.3 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
1.2 ± 0.85
3.2
2512
C
T
Tin Plating
Epoxy Melamine
Protection
Nickel Barrier
Glass Dielectric
Silver
Dipped Conductor
Resistance Element
Palladium
Epoxy Melamine
Protection
Glass Dielectric
Silver
Resistance Element
Palladium
96% min Alumina Substrate
96% min Alumina Substrate
Tin Plating
Nickel Barrier
Dipped Conductor
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
General
Note
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
General
Note
Welwyn Components
the right to make changes in
changes
specification
specification without notice or liability.
Telephone: +44 (0) 1670 make
product
in product
without notice or
Email:
TT Electronics reserves
reserves the right to 822181 · Facsimile: +44 (0) 1670 829465 ·
liability.
info@welwyn-tt.com · Website: www.welwyn-tt.com
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
Iss 07.03
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
Iss 07.03
05.18
A subsidiary of
TT electronics plc
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
© TT Electronics plc
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
【世平集团 & 英特尔与您 9/24@上海见!】市场就绪AIoT解决方案研讨会
英特尔与世平集团将于9月24日举行「市场就绪AIoT解决方案」研讨会,为观众分享基于英特尔®l物联网平台的人工智能解决方案和最新MRS/RRK解决方案,促进物联网产业链精英合作伙伴间的 ......
eric_wang 综合技术交流
一个WINCE 电源管理的问题(S3C2440)
最近需要画个S3C2440的电源电路,希望系统WINCE能够支持电源管理。有个疑问,硬件上的电源电路应该怎么做??? 不应该只是几个LDO电源芯片吧? 希望各位大虾能够帮帮我。最好附图。...
eyeshot 嵌入式系统
我是来找人才的,求各位帮忙啦?
Job description – RF / Baseband Hardware Design Engineer for Mobil Phones, Senior 工作描述 – 高级手机射频/基带硬件设计工程师 Tasks: 任务 · Elaboration of RF/BB hardwa ......
fay.yu 无线连接
因特网冲击加快下一代网络进
蒋林涛   下一代网指的是下一代业务网、承载网和传送网的集合,下一代网包含下一代电信网和下一代因特网。下一代电信网和下一代因特网在技术上是共源的,它们都建立在IP技术的基础上,因 ......
bob 无线连接
MSP430程序库<二>UART异步串口
串行通信接口是处理器与其他设备进行数据通信最常用的方式之一。我的这个程序库是针对MSP430f14系列和MSP430f16系列的,我常用的单片机是这两款:msp430f149,msp430f169。这两款单片机中均有两 ......
fish001 微控制器 MCU
易电源学习心得
易于使用的封裝:全新納米模块的封裝尺寸為 2.5× 3 ×1.2 mm, 是市场上最薄的 1A 型 DC/DC 解決方案。 利用安装在屏蔽式电感器上的 IC,納米模块可节省电路板空间。只需要一个输入电容、 一个 ......
yuxiran 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2375  1568  1021  459  1596  10  8  28  33  4 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved