Reference Voltage Generator for VCOM Adjustment 8-TSSOP
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | SOIC |
包装说明 | TSSOP, |
针数 | 8 |
Reach Compliance Code | compli |
Factory Lead Time | 1 week |
其他特性 | ALSO REQUIRES 2V TO 5.5V DIGITAL SUPPLY |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e4 |
长度 | 4.4 mm |
湿度敏感等级 | 2 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 18 V |
最小供电电压 (Vsup) | 7 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
Base Number Matches | 1 |
BUF01900AIPWR | BUF01900AIDRCR | BUF01900AIPW | BUF01900AIDRCT | |
---|---|---|---|---|
描述 | Reference Voltage Generator for VCOM Adjustment 8-TSSOP | Reference Voltage Generator for VCOM Adjustment 10-VSON | Reference Voltage Generator for VCOM Adjustment 8-TSSOP | Reference Voltage Generator for VCOM Adjustment 10-VSON |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SOIC | SON | SOIC | SON |
包装说明 | TSSOP, | HVSON, | TSSOP, | HVSON, |
针数 | 8 | 10 | 8 | 10 |
Reach Compliance Code | compli | compli | compli | compli |
Factory Lead Time | 1 week | 1 week | 12 weeks | 1 week |
其他特性 | ALSO REQUIRES 2V TO 5.5V DIGITAL SUPPLY | ALSO REQUIRES 2V TO 5.5V DIGITAL SUPPLY | ALSO REQUIRES 2V TO 5.5V DIGITAL SUPPLY | ALSO REQUIRES 2V TO 5.5V DIGITAL SUPPLY |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
JESD-30 代码 | R-PDSO-G8 | S-PDSO-N10 | R-PDSO-G8 | S-PDSO-N10 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 4.4 mm | 3 mm | 4.4 mm | 3 mm |
湿度敏感等级 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 10 | 8 | 10 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | HVSON | TSSOP | HVSON |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1 mm | 1.2 mm | 1 mm |
最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V |
最小供电电压 (Vsup) | 7 V | 7 V | 7 V | 7 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | NO LEAD | GULL WING | NO LEAD |
端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm |
厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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