DC COMPONENTS CO., LTD.
R
RECTIFIER SPECIALISTS
BZQ55C2V4
THRU
BZQ55C39
TECHNICAL SPECIFICATIONS OF
GLASS SILICON ZENER DIODES
FEATURES
* Voltage Range:2.4V to 39V
* Double slug type construction
Quadro Melf
MECHANICAL DATA
* Case: Glass sealed case Quadro Melf
* Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026 guaranteed
* Polarity: Color band denotes cathode end
* Mounting position: Any
* Weight: 0.05 grams Approx.
.146(3.7)
.130(3.3)
.020(0.5)
.012(0.3)
.020(0.5)
.012(0.3)
CATHODE MARK
.063(1.6)
.055(1.4)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Dimensions in inches(millimeters)
SYMBOL
Zener Current see Table "Characterisitics"
Power Dissipation at Tamb=25
o
C
Junction Temperature
Storage Temperature Range
Ptot
Tj
Tstg
.0
67
(1
VALUE
500
(1)
175
-5 5 to + 175
.7
)
UNITS
mW
o
o
C
C
K/mW
Thermal Resistance
Junction to Ambient Air
RthA
-
-
0.3
(1)
Typ.
Min.
Max.
Volts
Forward Voltage
at IF=100mA
V
F
-
-
1
Typ.
Min.
Max.
1)Valid Provided that leads are kept at ambient temperature at a distance of 8 mm from case.
NOTE: Standard Zener Voltage Tolerance ± 5%
RATING AND CHARACTERISTIC CURVES (BZQ55C SERIES)
TYPE
Nominal
Zener
Voltage
V
Z
@I
ZT
Volts
Zener
Test
Current
I
ZT
mA
Maximum Zener
Impedance
Z
ZT
@I
ZT
Ohms
Z
ZT
@I
ZK
Ohms
mA
I
ZK
Maximum Reverse
Leakage Current
I
R
@ V
R
µA
Volts
Typical
Temperature
Coefficient
% /
o
C
Max.
Zener
Current
I
ZM
@T
A
mA
BZQ55C2V4
BZQ55C2V7
BZQ55C3V0
BZQ55C3V3
BZQ55C3V6
BZQ55C3V9
BZQ55C4V3
BZQ55C4V7
BZQ55C5V1
BZQ55C5V6
BZQ55C6V2
BZQ55C6V8
BZQ55C7V5
BZQ55C8V2
BZQ55C9V1
BZQ55C10
B Z Q 5 5 C 11
BZQ55C12
BZQ55C13
BZQ55C15
BZQ55C16
BZQ55C18
BZQ55C20
BZQ55C22
BZQ55C24
BZQ55C27
BZQ55C30
BZQ55C33
BZQ55C36
BZQ55C39
2.28
2.5
2.8
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11 . 4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
31
34
37
2.56
2.9
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11 . 6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32
35
38
41
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2.5
85
85
85
85
85
85
75
60
35
25
10
8
7
7
10
15
20
20
26
30
40
50
55
55
80
80
80
80
80
90
600
600
600
600
600
600
600
600
550
450
200
150
50
50
50
70
70
90
11 0
11 0
170
170
220
220
220
220
220
220
220
500
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
50
10
4
2
2
2
1
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1
1
1
1
1
1
1
1
1
1
2
3
5
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
-0.085
-0.080
-0.075
-0.070
-0.065
-0.060
0.055
0.030
0.030
+0.038
+0.045
+0.050
+0.058
+0.062
+0.068
+0.075
+0.076
+0.077
+0.079
+0.082
+0.083
+0.085
+0.086
+0.087
+0.088
+0.090
+0.091
+0.092
+0.093
+0.094
155
135
125
11 5
105
95
90
85
80
70
64
58
53
47
43
40
36
32
29
27
24
21
20
18
16
14
13
12
11
10
Breakdown characteristics
changes in the power dissipation
due to the ambient temperature.
Power dissipation
mA
50
BZQ55-SERIES
25V
30V
5V
10V
15V
20V
Pd(mw)
40
500
400
300
200
100
IZ
30
20
Test Current
IZ 5mA
10
50
100
150
200
o
250
0
Ta( C)
Ambient Temperature.
DC COMPONENTS CO., LTD.
R
6V8
6V2
5V6
5V1
4V7
4V3
3V9
3V3
2V4
9V1
11
12
15
VZ
20
22
24
27
NXP MCU
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