1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP.
4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL
AS THE TERMINALS.
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
6. SEATING PLANE IS DEFINED BY THE TERMINALS. A1 IS DEFINED
AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
7. A VISUAL INDICATOR FOR PIN 1 MUST BE LOCATED IN THIS AREA.
4X
0.10 C
0.10 C
NOTE 4
DETAIL B
4X
M
N
4X
G
BOTTOM VIEW
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◊
ÉÉ
ÉÉ
1
2
PIN ONE
IDENTIFIER
NOTE 7
E1 E
h
c
3
4
A1
TOP VIEW
A
DETAIL A
C
DETAIL A
SEATING
PLANE
NOTE 6
SIDE VIEW
D2
D3
e
1
4
4X
L
K
DETAIL B
ALTERNATE
CONSTRUCTION
8X
SOLDERING FOOTPRINT*
4.56
2X
DIM
A
A1
b
b1
c
D
D1
D2
D3
E
E1
E2
e
G
h
K
K1
L
M
N
MILLIMETERS
MIN
MAX
MAX
0.90
1.10
−−−
−−−
−−−
0.05
0.33
0.42
0.51
0.33
0.42
0.51
0.20
−−−
0.33
5.15 BSC
4.70
4.90
5.10
3.90
4.10
4.30
1.50
1.70
1.90
6.15 BSC
5.70
5.90
6.10
3.90
4.15
4.40
1.27 BSC
0.45
0.55
0.65
−−−
−−−
12
_
0.51
−−−
−−−
0.56
−−−
−−−
0.48
0.61
0.71
3.25
3.50
3.75
1.80
2.00
2.20
2X
0.75
2.08
0.56
b1
E2
4X
4.84
8
5
8X
b
0.10
0.05
C A B
C
NOTE 3
2.30
1.40
3.70
6.59
K1
0.70
1.00
1.27
PITCH
5.55
DIMENSION: MILLIMETERS
4X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
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