NUMBER
TYPE
GS-12-1111
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1 of 6
B
DATE
Mini PCI Express Connector, 52 Pin
AUTHORIZED BY
Kenny Tai
CLASSIFICATION
2015-04-24
UNRESTRICTED
1. SCOPE
1.1. Contents
When tests are performed on the subject product line, the procedures specified in Figure 1
shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
2. APPLICABLE DOCUMENT
The following documents form a part of this specification to the extent specified herein.
Unless otherwise specified, the latest edition of the document applies. In the event of conflict
between the requirements of this specification and the product drawing, the product drawing
shall take precedence. In the event of conflict between the requirements of this specification
and the referenced documents, this specification shall take precedence.
2.1. Documents
General Requirements for Test Specifications
Test Specification（EIA and IEC Test Methods）
2.2. Industry Standard
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental
Classifications.
3. REQUIREMENTS
3.1. Design and Construction
Product shall be of the design, construction and physical dimensions specified on the
applicable product drawing.
3.2. Materials
Materials used in the construction of product shall be as specified on the applicable product
drawing.
3.3. Ratings
A. Voltage: 50 VAC rms.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :B
STATUS:Released
Printed: Apr 27, 2015
NUMBER
TYPE
GS-12-1111
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
2 of 6
B
DATE
Mini PCI Express Connector, 52 Pin
AUTHORIZED BY
Kenny Tai
CLASSIFICATION
2015-04-24
UNRESTRICTED
B. Current: 0.5 A Max.
C. Operating Temperature: - 55℃ to 85℃
3.4. Performance and Test description
The product is designed to meet the electrical, mechanical and environmental performance
requirements specified in Figure 1. Unless otherwise specified, all tests shall be performed
at ambient environmental conditions per EIA-364.
3.5. Test Requirements and Procedures Summary
TEST ITEM
1
Examination of
Product
REQUIREMENT
Meets requirements of product
drawing. No physical damage.
PROCEDURE
Visual inspection. No physical damage
ELECTRICAL REQUIREMENT
2
Termination
Resistance (Low
Level)
Dielectric
withstanding
Voltage
[ 55 ] m Ohm Max (Initial)
[
∆R=20]
m Ohm Max (Final)
No creeping discharge or
flashover shall occur. Current
leakage: 0.5 mA Max.
Subject mated contacts assembled in housing
to 20mV Max open circuit at 100mA Max.
EIA-364-23.
[ 0.3 ]KVAC for 1minute
Test between adjacent circuits of unmated
connector
EIA-364-20
Impressed voltage 500 VDC.
Test between adjacent circuits of unmated
connector.
EIA-364-21.
Contact series-wired, apply test current of
loaded rating current to the circuit, and
measure the temperature rising by probing on
soldered areas of contacts, after the
temperature becomes stabilized deduct
ambient temperature from the measured value.
3
4
Insulation
Resistance
[ 500 ] M Ohm Min. (Initial)
[ 500 ] M Ohm Min. (Final)
5
Temperature Rising
30℃ Max. Under loaded rating
current.
MECHANICAL REQUIREMENT
6
Vibration
No electrical discontinuity
greater than 1μsec shall occur.
See Note 1.
Subject mated connectors to 10-55-10Hz
traversed in 1minutes at 1.52mm amplitude 2
Hours each of 3 mutually perpendicular planes.
EIA-364-28
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :B
STATUS:Released
Printed: Apr 27, 2015
NUMBER
TYPE
GS-12-1111
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
3 of 6
B
DATE
Mini PCI Express Connector, 52 Pin
AUTHORIZED BY
Kenny Tai
CLASSIFICATION
2015-04-24
UNRESTRICTED
7
Physical Shock
(Normal test)
No electrical discontinuity
greater than 1μsec. shall occur.
∆R=20
mΩ Max. (Final)
Accelerated Velocity: 490 m/s
2
(50 G)
Waveform: Half sine
Duration: 11 m sec.
Number of Drops: 3 drops each to normal and
reversed directions of X, Y and Z axes, totally
18 drops.
EIA-364-27 Condition A
Measure force necessary to mate the
connector assemblies at a rate of 25.4
mm/minute
EIA-364-13
Mated and unmated connector assemblies for
50 cycles at a maximum rate of 200
cycles/hour.
EIA-364-09
Manually unplug/plug the connector.
Perform 3 such cycles.
8
Module Board
Mating Force
22.5N (2.3kgf) Max.
9
Durability
See Note1
10
Reseating
No physical damage
ENVIRONMENTAL REQUIREMENTS
TEST ITEM
11
Solderability
REQUIREMENT
Wet Solder Coverage: 95 % Min.
PROCEDURE
Subject contacts to solderability testing
temperature of 245±5°C for 5±0.5 seconds.
MIL-STD-202 Method 208H
Pre-soak condition, 85°C/85% R.H. for 168
hours.
Pre Heat: 150 ~ 180°C, 90±30 sec.
Heat: 230°C Min., 30±10 sec.
Peak Temp.: 260+0/-5°C, 20 ~ 40 sec. Refer
to Fig.3
Duration: 3 cycles
Mated connector
-55 +0/-3℃ / 30 min., 85 +3/-0℃ / 30 min.
Making this a cycle, repeat 10 cycles.
EIA-364-32, Condition A
Subject mated connectors to 24 cycles
between 25°C at 80% R.H. and 65°C at 50%
R.H.
EIA-364-31
Subject mated connectors to temperature life
at 105°C for 120 hours.
EIA-364-17 Method A
12
Resistance to Reflow
Soldering Heat
No physical damage shall occur
13
Thermal Shock
See Note 1
14
Humidity-
Temperature Cycling
See Note 1
15
Temperature Life
(Heat Aging)
See Note 1
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :B
STATUS:Released
Printed: Apr 27, 2015
NUMBER
TYPE
GS-12-1111
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
4 of 6
B
DATE
Mini PCI Express Connector, 52 Pin
AUTHORIZED BY
Kenny Tai
CLASSIFICATION
2015-04-24
UNRESTRICTED
16
Temperature Life
(Preconditioning)
No physical damage
Subject mated connectors to temperature
life at 105°C for 72 hours.
EIA-364-17 Method A
Figure 1
Note 1：Shall meet visual requirements, show no physical damage, and meet requirement of
additional tests as specified in the test sequence in Figures 2.
Note 2：Resistance to soldering process is indicated on notes of customer drawing. Select the
appropriate test type which drawing notes are matched with.
Figure 3. Resistance to flow solder heat
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :B
STATUS:Released
Printed: Apr 27, 2015
NUMBER
TYPE
GS-12-1111
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
5 of 6
B
DATE
Mini PCI Express Connector, 52 Pin
AUTHORIZED BY
Kenny Tai
CLASSIFICATION
2015-04-24
UNRESTRICTED
3.6. Product Qualification and Requalification test
Test Group
E
F
Test Examination
A
B
C
D
G
H
I
J
Test Sequence (a)
Examination of Product
Termination Resistance
(Low Level)
Dielectric withstanding
Voltage
Insulation Resistance
Temperature Rising
Vibration (Random)
Physical Shock
Module Board Mating
Force
Durability (Repeated
Mate/Unmating)
Durability
(Preconditioning)
Reseating
Solderability
Resistance to Reflow
Soldering Heat
Temperature Humidity
Cycling
Thermal Shock
Temperature Life (Heat
Aging)
Temperature Life
(Proconditioning)
4
4
2
2
7
4
4
3
2, 6
3, 7
2
7
3
2
3
3
10
3
7
1, 5
1,3
1 ,5,
8
2, 6,
9
1, 4
2, 5
1,3
1, 4
2, 5
1,
3
1,
3
1, 5, 8,
11
2, 6, 9,
12
1, 5, 8
2, 6, 9
Figure 2
NOTE:（a）Numbers indicate sequence in which tests are performed.
（b）Discontinuities
shall not take place in this test group, during tests.
Copyright FCI.
Form E-3701 – Revision C
GS-01-029
PDS: Rev :B
STATUS:Released
Printed: Apr 27, 2015
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