CERAMIC OPEN MODE CAPACITORS
FEATURES
KEMET’s Open Mode Ceramic Surface Mount Capacitor is designed to significantly minimize the probability
of a low IR or Short Circuit Condition when forced to failure in a board flex situation. This reduces the poten-
tial for causing catastrophic failures. This product is RoHS Compliant.
Applications:
• Input side filtering (power plane/bus)
• High current applications (battery line)
• Circuits that cannot be fused to open when
short circuits occur due to flex cracks
Markets:
• Automotive
- All applications connected directly to the battery
- Conversion to 42V power system
• Power Conversion
- Raw power input side filtering
OUTLINE DRAWING
W
T
S
L
B
NICKEL PLATE
ELECTRODES
CONDUCTIVE
METALLIZATION
TIN PLATE
TABLE 1 - DIMENSIONS - MILLIMETERS (INCHES)
Metric
EIA
EIA Size
Size
Metric
L - Length
W - Width
Size Code
Code
Size Code Code
L - Length
W - Width
2012
0805
2.00
2.0 (.079) ± .20 (.008)
1.25 (.049) ±
± 0.2
(.008)
1.25 (.049)
.20
(.008)
2012
0805
(.079) ± .20 (.008)
3216
1206
3.2 (.126) ± .20 (.008)
1.6 (.063) ± 0.2
3216
1206
3.20 (.126) ± .20 (.008) 1.60 (.063) ± .20
(.008)
(.008)
3225
1210
3.2 (.126) ± .20 (.008)
2.5 (.098) ± 0.2 (.008)
3225
1210
3.20
4.5 (.177) ± 0.3 (.012)
2.50 (.098) ± .20
(.012)
(.126) ± .20 (.008)
(.008)
4532
1812
3.2 (.126) ± 0.3
B - Bandwidth
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ±
± .35
(.010)
.25
(.014)
0.60 (.024)
B - Bandwidth
Separation
0.75 (.030)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
Separation
Note: For thickness dimensions, see Table 2.
C
Style
C - Ceramic
Size Code
0805, 1206, 1210, 1812
1812
F
105
K
1
R
A
C
End Metallization
C = Standard
Failure Rate Level
A = Not Applicable
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
2 = 200V
1 = 100V
Voltage
5 = 50V
3 = 25V
4 = 16V
Specification
F - Open-Mode
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Capacitance Tolerance
K = ±10%
M = ±20%
OPEN-MODE INTERNAL DESIGN
The open-mode dimension (OM)
exceeds the termination bandwidth
dimensions: OM >BW
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
79
Ceramic Surface Mount
CAPACITOR ORDERING INFORMATION
CERAMIC OPEN MODE CAPACITORS
TABLE 2
X7R DIELECTRIC CAPACITANCE RANGE AND THICKNESS TARGETS (mm)
Cap
Cap
Code
Code
102
102
122
122
152
152
182
182
222
222
272
272
332
332
392
472
392
562
472
682
562
822
682
103
822
123
103
153
123
183
153
223
183
273
223
333
393
273
473
333
563
393
683
473
823
563
104
683
124
823
154
104
184
124
224
154
274
184
334
394
224
474
274
564
334
684
394
824
474
105
564
125
684
155
824
185
105
225
125
475
685
155
185
225
475
16V 25V
16V 25V
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
DD
DD
DG
DG
DD
DG
DD
DG
DG
DG
DG
DG
DG
DG
DG
DD
DG
DG
DG
DG
DG
DD
DE
DG
DG
DE
DG
DG
0805
0805
50V 100V 200V
50V 100V 200V
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DD
DD
DD
DD
DD
DG
DD
DD
DG
DD
DD
DD
DG
DD
DD
DG
DD
DD
DD
DG
DD
DD
DG
DG
DD
DG
DG
DD
DD
DG
DE
DD
DD
DG
DD
DG
DE
DG
DD
DG
DD
DG
DG
DG
DG
DG
DG
DG
1206
1206
16V 25V 50V 100V 200V 16V
16V 25V 50V 100V 200V 16V
25V
25V
1210
1812
1210
1812
50V 100V 200V 25V 50V 100V 200V
50V 100V 200V 25V 50V 100V 200V
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EC EC
EG EG
EG EG
EC EC
EG EG
EC EC
EG
EG EG
EG
EG EG
EG
EG EG
EG EC
EG
EG
EG
EG EC
EC EH
EH
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EC
EC
EC
EC
EH
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EC
EG
EC
ED
EG
EG
EG
ED
EC
EC
EC
EC
EC
EC
EC
EC
EG
EC
EG
EC
EG
EG
EG
EG
EG
EG
EG
EG
EH
EC
EH
EH
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FD
FH
FD
FH
FD
FJ
FG
FG
FH
FH
FJ
FG
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FD
FG
FD
FH
FD
FG
FG
FH
FM
FQ
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FD
FG
FD
FG
FD
FH
FG
FJ
FG
FJ
FG
FH
FJ
FJ
FM
FD
FD
FD
FD
FD
FD
FG
FD
FG
FD
FH
FH
FG
FJ
FG
FR
FH
FR
FH
FJ
FQ
FR
FR
FQ
FD
FD
FG
FD
FG
FD
FH
FG
FH
FG
FJ
FH
FH
FJ
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GB
GD
GB
GN
GB
GD
GD
GN
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GB
GD
GB
GN
GB
GD
GD
GN
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GB
GD
GB
GF
GB
GK
GC
GM
GD
GF
GK
GM
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GB
GF
GB
GK
GL
GC
GF
GK
GL
FM
FM
Thickness
Code
DD
DE
DG
EC
EG
EH
FD
FG
FH
FJ
FM
FR
FQ
GB
GC
GD
GF
GK
GL
GM
GN
Series
0805
0805
0805
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
Dimension
.90 ± .10
1.00 ± .10
1.25 ± .15
.90 ± .10
1.60 ± .15
1.60 ± .20
.95 ± .10
1.25 ± .15
1.55 ± .15
1.85 ± .20
1.70 ± .20
2.25 ± .20
2.5 ± .20
1.0 ± .10
1.1 ± .10
1.25 ± .15
1.50 ± .15
1.60 ± .20
1.90 ± .20
2.00 ± .20
1.70 ± .20
7" Reel Qty.
4000
2500
2500
4000
2000
2000
4000
2500
2000
2000
2000
2000
1500
1000
1000
1000
1000
1000
1000
1000
1000
13" Reel Qty.
10000
10000
10000
10000
8000
8000
10000
10000
8000
8000
8000
8000
8000
4000
4000
4000
4000
4000
4000
4000
4000
80
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
THICKNESS AND PACKAGING INFORMATION
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
®
T
ME
KE
Embossment
8mm
±.30
(.315
±.012")
or
12mm
±.30
(.472
±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Grid
Grid
placement
courtyard
Placement
Reflow Solder
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X Y(ref) C(ref)
0.74 0.93 1.21
1.08 1.05 1.73
1.60 1.30 2.00
2.00 1.50 3.00
2.90 1.50 3.00
3.70 1.80 4.10
6.90 1.80 4.10
5.50 1.85 5.15
6.80 1.85 5.15
Z
3.18
3.70
4.90
4.90
G
Wave Solder
X
0.80
1.10
1.40
2.00
Y(ref) Smin
1.25
1.50
1.70
1.70
1.93
2.20
3.20
3.20
Not Recommended
Courtyard
C
C
0.68
0.70
1.50
1.50
X
X
Not Recommended
G
G
Y
Z
Z
Y
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
Packaging
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force:
1.0 Kg Minimum.
2. Cover Tape Peel Strength:
The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes:
Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling:
Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration:
Figure 1
Table 1 — EMBOSSED TAPE DIMENSIONS
(Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
and
12 mm
D
0
E
P
0
4.0 ±0.10
(0.157 ±0.004)
P
2
2.0 ±0.05
(0.079 ±0.002)
T Max
0.600
(0.024)
T
1
Max
0.100
(0.004)
1.5
1.75 ±0.10
+0.10 -0.0
(0.059
(0.069 ±0.004)
+0.004, -0.0)
Pitch
Single
(4 mm)
B
1
Max.
Note 1
4.4
(0.173)
12 mm
Double
(8 mm)
8.2
(0.323)
D
1
Min.
Note 2
1.0
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
F
3.5 ±0.05
P
1
4.0 ±0.10
R Min.
Note 3
25.0
T
2
Max
2.5
(0.098)
W
8.0 ±0.30
(.315 ±0.012)
A
0
B
0
K
0
Note 4
(0.039) (0.138 ±0.002)
1.5
5.5 ±0.05
(0.059) (0.217 ±0.002)
(0.157 ±0.004) (0.984)
8.0 ±0.10
30.0
(0.315 ±0.004) (1.181)
4.6
12.0 ±0.30
(0.181) (0.472 ±0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A
0
,
B
0
,
and K
0
shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
94
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Embossed Carrier Tape Configuration (cont.)
20°
Sketch D:
Tape Camber (Top View)
1mm (0.039) Max.
250mm (9.843)
Allowable camber to be 1 mm/250 mm.
1mm (0.039) Max.
400mm (15.75) Min.
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
Figure 3:
Reel Dimensions (Metric Dimensions will govern)
Table 2 – REEL DIMENSIONS (Metric will govern)
Tape Size
8 mm
A Max
330.0
(12.992)
B* Min
1.5
(0.059)
C
13.0 ± 0.20
(0.512 ± 0.008)
D* Min
20.2
(0.795)
N Min
50.0
(1.969)
See
Note 3
Table 1
W
1
8.4
+1.5, -0.0
(0.331
+0.059, -0.0)
12.4
+2.0, -0.0
(0.488
+0.078, -0.0)
W
2
Max
14.4
(0.567)
W
3
7.9 Min
(0.311)
10.9 Max
(0.429)
11.9 Min
(0.469)
15.4 Max
(0.606)
12 mm
330.0
(12.992)
1.5
(0.059)
13.0 ± 0.20
(0.512 ± 0.008)
20.2
(0.795)
18.4
(0.724)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
95
Packaging
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