CERAMIC CHIP / HIGH VOLTAGE
KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They
offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin
(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering
applications. An insulating coating may be required to prevent surface arcing. These components are RoHS
compliant.
APPLICATIONS
Applications
• Switch Mode Power Supply
• Input Filter
• Resonators
• Tank Circuit
• Snubber Circuit
• Output Filter
• High Voltage Coupling
• High Voltage DC Blocking
• Lighting Ballast
• Voltage Multiplier Circuits
• Coupling Capacitor/CUK
MARKETS
Markets
• Power Supply
• High Voltage Power Supply
• DC-DC Converter
• LCD Fluorescent Backlight Ballast
• HID Lighting
• Telecommunications Equipment
• Industrial Equipment/Control
• Medical Equipment/Control
• Computer (LAN/WAN Interface)
• Analog and Digital Modems
• Automotive
OUTLINE DRAWING
Outline Drawing
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
TABLE 1 - DIMENSIONS - MILLIMETERS (in.)
Metric
Code
2012
3216
3225
4520
4532
4564
5650
5664
EIA Size
Code
0805
1206
1210
1808
1812
1825
2220
2225
L - Length
2.0 (0.079)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
4.5 (0.177)
± 0.3 (0.012)
4.5 (0.177)
± 0.3 (0.012)
4.5 (0.177)
± 0.3 (0.012)
5.6 (0.224)
± 0.4 (0.016)
5.6 (0.224)
± 0.4 (0.016)
W - Width
1.2 (0.049)
± 0.2 (0.008)
1.6 (0.063)
± 0.2 (0.008)
2.5 (0.098)
± 0.2 (0.008)
2.0 (0.079
± 0.2 (0.008)
3.2 (0.126)
± 0.3 (0.012)
6.4 (0.250)
± 0.4 (0.016)
5.0 (0.197)
± 0.4 (0.016)
6.4 (0.250)
± 0.4 (0.016)
B - Bandwidth
0.5 (0.02
±0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
Band
Separation
0.75 (0.030)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
81
Ceramic Surface Mount
CONDUCTIVE
METALLIZATION
CERAMIC CHIP / HIGH VOLTAGE
C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
Series
Cap
pF
Capacitance
Tolerance
Max
Thickness
(in)
Cap Code/
Voltage
p
0805
0.050
0.050
0.065
1206
0.065
0.065
0.065
0.101
1210
0.101
0.101
0.101
0.080
0.080
1808
0.080
0.080
g
1812
0.080
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
1825
0.067
0.067
0.067
0.067
0.067
0.067
2220
0.067
0.067
0.067
0.067
0.067
0.067
2225
0.067
0.067
2000
0.080
0.067
2500
1000
1000
1500
2000
1000
1500
2000
1000
1500
2000
2500
3000
1000
1500
2000
2500
3000
1000
1500
2000
2500
3000
1000
1500
2000
2500
3000
1000
1500
1.0-2.4
2.7-5.1
5.6-9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
10,000
C,D
C,D
K,M
C,D
J,K,M
C,D
J,K,M
C,D
J,K,M
C,D
J,K,M
C,D
J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
109-249
279-519
569-919
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
3000
500
500
500
500
500
500
500
500
*
0.067
* Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability.
Note:
Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
82
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
CERAMIC CHIP / HIGH VOLTAGE
X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
Series
Cap
pF
Capacitance
Tolerance
Max
Thickness
(in)
Cap Code/
Voltage
p
0805
0.050
0.050
0.065
1206
0.065
0.065
0.065
0.080
1210
0.080
0.080
0.080
0.080
0.080
g
1808
0.080
0.080
0.080
0.067
0.067
1812
0.067
0.067
0.067
0.067
0.067
0.067
1825
0.067
0.067
0.067
0.067
0.067
0.067
2220
0.067
0.067
0.067
0.067
0.067
0.067
2225
0.067
0.067
0.067
2500
0.067
3000
1000
1000
1500
2000
1000
1500
2000
1000
1500
0.080
2000
2500
3000
1000
1500
2000
2500
3000
1000
1500
2000
2500
3000
1000
1500
2000
2500
3000
1000
1500
Note: Actual thickness dimensions may be less than stated maximum.
Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z)
THICKNESS AND REELING QUANTITIES
Chip size
EIA
0805
1206
1210
1808
1812/1813
1825
2220
2225
Metric
2012
3216
3225
4520
4532
4564
5650
5664
Max.
Thickness (in)
0.055
0.065
0.101
0.080
0.067
0.067
0.067
0.067
Max.
Thickness (mm)
1.27
1.65
2.57
2.03
1.70
1.70
1.70
1.70
Tape Width
(mm)
8
8
8
12
12
12
12
12
Qty per Reel Qty per Reel
7" Plastic
13" Plastic
2,500
10,000
2,000
8,000
2,000
8,000
1,000
4,000
1,000
4,000
1,000
4,000
1,000
4,000
1,000
4,000
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
83
Ceramic Surface Mount
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2000
2200
2700
3300
3900
4700
5600
6800
8200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
62,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
181
221
271
331
391
471
561
681
821
102
122
152
182
202
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
623
683
823
104
124
154
184
224
2000
500
500
500
500
500
500
500
500
CERAMIC CHIP / HIGH VOLTAGE
CAPACITOR ORDERING
Information
Capacitor Ordering
INFORMATION
C
Style
Style
C - Ceramic
Chip Size
Chip Size
0805
C
102
K
C
R
A
C
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
Specification
Specification
C - Standard
Capacitance Code, pF
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Capacitance Tolerance
Capacitance Tolerance
End
Metallization
Metallization
C = Standard
Failure Rate
Level
Failure
A = Not Applicable
Temperature
Characteristic
Characteristic
Designated by Capacitance
Change over Temperature Range
G – (C0G) (±30ppm/C) (-55°C +125°C)
R – X7R (±15%) (-55°C +125°C)
C = 500V
D = 1000V
F = 1500V
Voltage
G = 2000V
Z = 2500V
H = 3000V
C = ±0.25pF*
J = ±5%
D = ±0.5pF*
K = ±10%
F = ±1%*
M = ±20%
G = ±2%*
* Contact KEMET Sales for availability.
ELECTRICAL PARAMETERS
Electrical Parameters
Property
Capacitance
Cap Tolerance
DF
Voltage Ratings
Operating Temperature Range
25ºC IR @ 500V
125ºC IR @ 500V
-55ºC TCC
+125ºC TCC
Dielectric Strength
Ripple Current
Specification
C0G: 1 pF to 0.010 µF
X7R: 10 pF to 0.22 µF
pf
25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for
≤ 1000
pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M
* Contact KEMET Sales for availability.
X7R: J, K, M
C0G: 0.1% Max
X7R: 2.5% Max
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
From
-55ºC
to +125C
-55C
to +125ºC
100 GΩ or 1000 MΩ-µF, whichever is less
10 GΩ or 100 MΩ-µF, whichever is less
X7R: + 15%
C0G: + 30 ppm / ºC
150% of Rated Voltage for Rated Voltage <1000 V
120% of Rated Voltage for Rated Voltage >=1000V
Consult KEMET Sales Representative
MARKING
Marking
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 97.
Packaging
PACKAGING
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 83. Please consult factory for waffle packaging options.
SOLDERING
Process
Soldering
PROCESS
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
Recommended Solder
PAD DIMENSIONS
RECOMMENDED SOLDER
Pad Dimensions
Chip Size
0805
1206
1210
1808
1812
1825
2220
2225
T (Total Length)
mm
3.30
4.50
4.50
5.90
5.90
5.90
7.00
7.00
in.
0.130
0.177
0.177
0.232
0.232
0.232
0.276
0.276
S (Separation
mm
0.70
1.50
1.50
2.30
2.30
2.30
3.30
3.30
in.
0.028
0.059
0.059
0.091
0.091
0.091
0.130
0.130
W (Pad Width)
mm
1.60
2.00
2.90
2.40
3.70
6.90
5.50
6.80
in.
0.063
0.079
0.114
0.094
0.146
0.272
0.217
0.268
L (Pad Length)
mm
1.30
1.50
1.50
1.80
1.80
1.80
1.85
1.85
in.
0.051
0.059
0.059
0.071
0.071
0.071
0.073
0.073
84
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
®
T
ME
KE
Embossment
8mm
±.30
(.315
±.012")
or
12mm
±.30
(.472
±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Grid
Grid
placement
courtyard
Placement
Reflow Solder
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X Y(ref) C(ref)
0.74 0.93 1.21
1.08 1.05 1.73
1.60 1.30 2.00
2.00 1.50 3.00
2.90 1.50 3.00
3.70 1.80 4.10
6.90 1.80 4.10
5.50 1.85 5.15
6.80 1.85 5.15
Z
3.18
3.70
4.90
4.90
G
Wave Solder
X
0.80
1.10
1.40
2.00
Y(ref) Smin
1.25
1.50
1.70
1.70
1.93
2.20
3.20
3.20
Not Recommended
Courtyard
C
C
0.68
0.70
1.50
1.50
X
X
Not Recommended
G
G
Y
Z
Z
Y
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
Packaging
NXP MCU
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