A
Datasheet
BT860-Sx
Bluetooth v4.2 Dual-Mode UART HCI Module
Version 1.0
BT860-Sx
Datasheet
R
EVISION
H
ISTORY
Version
1.0
Date
12 Jan 2018
Notes
Initial Version
Contributor
Jacky Kuo
Raj Khatri
Approver
Jonathan Kaye
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
2
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
BT860-Sx
Datasheet
C
ONTENTS
1
2
3
4
5
6
7
8
8.1.
8.2.
8.3.
8.4.
9
10
11
11.1.
12
12.1.
12.2.
12.3.
13
13.1.
14
15
16
17
17.1.
18
19
Scope ...............................................................................................................................................................4
Operational Description ..................................................................................................................................4
Block Diagram and Descriptions .....................................................................................................................5
Specifications ..................................................................................................................................................6
Pin Definitions ................................................................................................................................................6
DC Electrical Characteristics ...........................................................................................................................8
RF Characteristics ...........................................................................................................................................9
Interface ...................................................................................................................................................... 10
Global Coexistence Interface ................................................................................................................. 10
UART Interface....................................................................................................................................... 10
PCM Interface ........................................................................................................................................ 11
I
2
S Interface ........................................................................................................................................... 18
Antenna Performance ................................................................................................................................. 20
Mechanical Dimensions and Land Pattern .................................................................................................. 22
Implementation Note .................................................................................................................................. 23
PCB Layout on Host PCB ........................................................................................................................ 23
Application Note for Surface Mount Modules ............................................................................................ 24
Introduction ........................................................................................................................................... 24
Shipping ................................................................................................................................................. 24
Reflow Parameters ................................................................................................................................ 26
Japan (MIC) Regulatory ............................................................................................................................... 27
Antenna Information ............................................................................................................................. 27
FCC Regulatory ............................................................................................................................................ 27
Industry Canada Regulatory ........................................................................................................................ 29
European Union Regulatory ........................................................................................................................ 31
Ordering Information .................................................................................................................................. 32
General Comments ................................................................................................................................ 32
Bluetooth SIG Approvals.............................................................................................................................. 32
Additional Assistance................................................................................................................................... 34
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
3
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
BT860-Sx
Datasheet
1 S
COPE
This document describes key hardware aspects of the Laird BT860-Sx Bluetooth HCI modules. This document is
intended to assist device manufacturers and related parties with the integration of this module into their host
devices. Data in this document are drawn from several sources including data sheets for the CYW20704A2.
Because the BT860-Sx is currently in development stage, this document is preliminary and the information in
this document is subject to change. Please contact Laird Technologies or visit the Laird website at
www.Lairdtech.com
to obtain the most recent version of this document.
BT860-SA module
BT860-ST module
2 O
PERATIONAL
D
ESCRIPTION
The BT860-Sx series of UART HCI modules leverage the Cypress CYW20704 A2 chipset to provide exceptionally
low power consumption with outstanding range for OEMs needing both Classic Bluetooth and Bluetooth Low
Energy support. The Bluetooth v4.2 core specification shortens your development time and provides enhanced
throughput, security and privacy.
The BT860-Sx modules are ideal when designers need both performance and minimum size. For maximum
flexibility in integration, they support a host UART interface, I
2
S and PCM audio interfaces, GPIO, and
Cypress’GCI coexistence (2-Wire).
The modules provide excellent RF performance and identical footprint options
for integrated antenna or an external antenna via a trace pin.
These modules present a Bluetooth standard HCI interface with support for Linux / Android and Embedded
Bluetooth software stacks for operating system backed devices. Additionally, Laird has partnered with
Searan
for support of their ultra small, flexible ‘dotstack’ platform for embedded Cortex M3 and M4 implementations.
Features and Benefits
▪
▪
▪
▪
▪
▪
▪
▪
▪
▪
▪
Bluetooth v4.2 - Dual mode (Classic Bluetooth and BLE)
Compact footprint
2-wire Cypress Global Coexistence Interface (GCI)
High antenna radiation gain and efficiency
Good interference rejection for multi-com system (GSM/WCDMA)
Class 1 output
–
8 dBm
UART, I
2
S, and PCM
Industrial Temperature Range
512 Kbits EEPROM support
Bluetooth Controller subsystem
FCC, IC, CE, RCM and Giteki approvals
Application Areas
▪
▪
▪
▪
▪
▪
Medical devices
ePOS terminals
Barcode scanners
Industrial Cable Replacement
IoT PlatformsAutomotive
Diagnostic Equipment
Personal Digital Assistants (PDA)
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
4
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
BT860-Sx
Datasheet
3 B
LOCK
D
IAGRAM AND
D
ESCRIPTIONS
Figure 1: BT860 Module block diagram
CYW20704A2
The BT860-Sx is based on CYW20704A2 dual mode chip. The chip is a single-chip radio with
(Main chip)
on-chip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to
3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides I
2
S/PCM and UART interfaces. There are two general purpose I/Os be configured for
proprietary of Cypress GCI used and a general purpose I/O can be configured for
scan/inquire/paging/data traffic of indicator. These three I/Os pins are controlled by
firmware.
Antenna
Band Pass
Filter
EEPROM
Crystal
BT860-SA
–
The antenna is a ceramic monopole chip antenna.
BT860-ST
–
Trace Pad provision for use with a range of certified External Antennas
The band pass filter filters the out-of-band emissions from the transmitter to meet the
specific regulations for type approvals of various countries.
There are 512 Kbits EEPROM embedded on the BT860-Sx module which can be used to store
parameters, such as BD_ADDR, maximum TX power, PCM configuration.
The embedded 40 MHz crystal is used for generating the clock for the entire module.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
5
© Copyright 2018 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
