S4A - S4M
Taiwan Semiconductor
4A, 50V - 1000V Surface Mount Rectifier
FEATURES
●
●
●
●
●
●
Glass passivated chip junction
Ideal for automated placement
Low forward voltage drop
High current capability
High surge current capability
Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
KEY PARAMETERS
PARAMETER
I
F(AV)
V
RRM
I
FSM
T
J MAX
Package
Configuration
VALUE
4
50 - 1000
100
150
UNIT
A
V
A
°C
DO-214AB (SMC)
Single die
APPLICATIONS
●
●
●
●
Switching mode power supply (SMPS)
Adapters
Lighting application
Converter
MECHANICAL DATA
●
●
●
●
Case: DO-214AB (SMC)
Molding compound meets UL 94V-0 flammability rating
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
● Moisture sensitivity level: level 1, per J-STD-020
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test
● Polarity: As marked
● Weight: 0.21 g (approximately)
DO-214AB (SMC)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Marking code on the device
Repetitive peak reverse voltage
Reverse voltage, total rms value
Maximum DC blocking voltage
Forward current
Surge peak forward current, 8.3 ms
single half sine-wave superimposed
on rated load per diode
Junction temperature
Storage temperature
V
RRM
V
R(RMS)
V
DC
I
F(AV)
I
FSM
T
J
T
STG
SYMBOL
S4A
S4A
50
35
50
S4B
S4B
100
70
100
S4D
S4D
200
140
200
S4G
S4G
400
280
400
4
100
- 55 to +150
- 55 to +150
S4J
S4J
600
420
600
S4K S4M
S4K
800
560
800
S4M
1000
700
1000
V
V
V
A
A
°C
°C
UNIT
1
Version:I1708
S4A - S4M
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
Junction-to-lead thermal resistance per diode
Junction-to-ambient thermal resistance per diode
SYMBOL
R
ӨJL
R
ӨJA
LIMIT
13
47
UNIT
°C/W
°C/W
ELECTRICAL SPECIFICATIONS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Forward voltage per diode
(1)
CONDITIONS
I
F
= 4A, T
J
= 25°C
(2)
SYMBOL
V
F
I
R
C
J
t
rr
TYP.
-
-
-
60
1500
MAX.
1.15
10
250
-
-
UNIT
V
µA
µA
pF
ns
Reverse current @ rated V
R
per diode
Junction capacitance
Reverse recovery time
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
T
J
= 25°C
T
J
= 125°C
1 MHz, V
R
=4.0V
I
F
=0.5A , I
R
=1.0A
I
RR
=0.25A
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
PACKING
CODE
R7
R6
S4A
(Note 1)
H
M6
V7
V6
Note :
1. "x" defines voltage from 50V (S4A) to 1000V (S4M)
G
PACKING CODE
SUFFIX
PACKAGE
SMC
SMC
SMC
Matrix SMC
Matrix SMC
PACKING
850 / 7" Plastic reel
3,000 / 13" Paper reel
3,000 / 13" Plastic reel
850 / 7" Plastic reel
3,000 / 13" Plastic reel
EXAMPLE
EXAMPLE P/N
S4AHR7G
PART NO.
S4A
PART NO.
SUFFIX
H
PACKING
CODE
R7
PACKING CODE
SUFFIX
G
DESCRIPTION
AEC-Q101 qualified
Green compound
2
Version:I1708
S4A - S4M
Taiwan Semiconductor
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
5
AVERAGE FORWARD CURRENT (A)
100
Fig.2 Typical Junction Capacitance
3
JUNCTION CAPACITANCE.(pF)
4
10
2
1
RESISTIVE OR
INDUCTIVE LOAD
f=1.0MHz
Vsig=50mVp-p
1
1
10
REVERSE VOLTAGE (V)
100
0
0
25
50
75
100
125
150
LEAD TEMPERATURE. (
o
C)
Fig.3 Typical Reverse Characteristics
INSTANTANEOUS REVERSE CURRENT (μA)
INSTANTANEOUS FORWARD CURRENT (A)
100
100
10
Fig.4 Typical Forward Characteristics
1
10
0.1
UF1DLW
T
J
=125°C
10
T
J
=125°C
T
J
=25°C
(A)
1
1
0.01
Pulse width
Pules width=300μs
1% duty cycle
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
T
J
=25°C
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
0.001
0.1
0.6
0.3
0.7
0.4
0.8
0.5
0.9
0.6
1
0.7
1.1
1.2
FORWARD VOLTAGE (V)
3
Version:I1708
S4A - S4M
Taiwan Semiconductor
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Fig.5 Maximum Non-repetitive Forward Surge Current
PEAK FORWARD SURGE CURRENT (A)
100
8.3ms Single Half Sine Wave
10
1
10
NUMBER OF CYCLES AT 60 Hz
100
Fig.6 Reverse Recovery Time Characteristic And Test Circuit Diagram
4
Version:I1708
S4A - S4M
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AB (SMC)
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min.
2.90
6.60
5.59
2.00
1.00
7.75
0.10
0.15
Max.
3.20
7.11
6.22
2.62
1.60
8.13
0.20
0.31
Unit (inch)
Min.
0.114
0.260
0.220
0.079
0.039
0.305
0.004
0.006
Max.
0.126
0.280
0.245
0.103
0.063
0.320
0.008
0.012
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
3.30
2.50
6.80
4.40
9.40
Unit (inch)
0.130
0.098
0.268
0.173
0.370
MARKING DIAGRAM
P/N
G
YW
F
=Marking Code
=Green Compound
=Date Code
=Factory Code
5
Version:I1708
Microchip MCU
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