Telecom Circuit, 1-Func, PDSO20, GREEN, PLASTIC, SOIC-20
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Zarlink Semiconductor (Microsemi) |
包装说明 | SOP, SOP20,.4 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e3 |
长度 | 12.8 mm |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大压摆率 | 0.0021 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
电信集成电路类型 | TELECOM CIRCUIT |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 7.5 mm |
Base Number Matches | 1 |
LE75183DDSC | LE75183DFSCT | LE75183DDSCT | LE75183DFSC | LE75183DFQCT | LE75183DFQC | |
---|---|---|---|---|---|---|
描述 | Telecom Circuit, 1-Func, PDSO20, GREEN, PLASTIC, SOIC-20 | Telecom Circuit, 1-Func, PDSO28, GREEN, PLASTIC, SOIC-28 | Telecom Circuit, 1-Func, PDSO20, GREEN, PLASTIC, SOIC-20 | Telecom Circuit, 1-Func, PDSO28, GREEN, PLASTIC, SOIC-28 | Telecom Circuit, 1-Func, GREEN, MO-220, QFN-32 | Telecom Circuit, 1-Func, GREEN, MO-220, QFN-32 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
包装说明 | SOP, SOP20,.4 | SOP, SOP28,.4 | SOP, SOP20,.4 | SOP, SOP28,.4 | HVQCCN, LCC32,.32SQ,32 | HVQCCN, LCC32,.32SQ,32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G28 | R-PDSO-G20 | R-PDSO-G28 | S-XQCC-N32 | S-XQCC-N32 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 12.8 mm | 17.9 mm | 12.8 mm | 17.9 mm | 8 mm | 8 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 28 | 20 | 28 | 32 | 32 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
封装代码 | SOP | SOP | SOP | SOP | HVQCCN | HVQCCN |
封装等效代码 | SOP20,.4 | SOP28,.4 | SOP20,.4 | SOP28,.4 | LCC32,.32SQ,32 | LCC32,.32SQ,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 1 mm | 1 mm |
最大压摆率 | 0.0021 mA | 0.0021 mA | 0.0021 mA | 0.0021 mA | 0.0021 mA | 0.0021 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 8 mm | 8 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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