*** Resistance value measured with ≤10 % rated current at 25 °C ambient.
**** Melting I
2
t calculated at 1000 % of current rating.
Reliability Testing
E
No.
1
2
3
4
5
6
7
8
Test
Solderability
Soldering heat
resistance
Moisture resistance
Salt spray
Mechanical vibration
Mechanical shock
Thermal Shock
Life
Agency Recognition
SF-1206HIxxxM Series - High Inrush Multilayer Surface Mount Fuses
Fusing Time
Open within 60
sec. at 200 %
rated current
Resistance
(Ω) Typ.***
0.340
0.150
0.090
0.065
0.035
0.029
0.023
0.021
0.017
0.013
0.010
0.009
Rated
Voltage
DC 63 V
Interrupting
Rating
DC 63 V 50 A
DC 32 V
DC 32 V 50 A
DC 24 V
DC 24 V 80 A
Typical
I t (A
2
s) ****
0.11
0.33
0.80
1.19
1.35
1.84
2.74
3.20
5.50
12.50
30.00
60.00
2
Requirement
Minimum 95 % coverage
DCR change ≤ 10 %
No mechanical damage
Test Condition
One dip at 245 °C for 5 seconds
One dip at 260 °C for 60 seconds
10 cycles
48 hour exposure, 5 % salt solution
0.4 inch D.A. or 30 G between
5-3000 Hz
1500 G, 0.5 ms, half-sine shocks
100 cycles between -65 °C and +125 °C
Test Reference
MIL-STD-202
Method 208
MIL-STD-202
Method 210
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
MIL-STD-202
Method 107
DCR change ≤ ±15 %
No excessive corrosion
DCR change ≤ ±10 %
No excessive corrosion
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
No electrical “opens” during testing
Voltage drop change shall be less
than ±20 % of initial value
80 % rated current (75 % for < 1 A fuses)
Refer to STP
for 2000 hours at ambient temperature
document
between +20 °C and +30 °C
UL File Number .................................................... E198545
http://www.ul.com/ Follow link to Online Certificates Directory,
then enter UL File No. E198545, or
click here
Asia-Pacific:
Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA:
Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SinglFuse
™
SF-1206HIxxxM Series Applications
n
Portable memory
n
LCD monitors
n
Disk drives
n
PDAs
n
Digital cameras
n
MP3 players
n
Cell phones
n
Rechargeable battery packs
n
Battery chargers
n
Set-top boxes
n
Industrial controllers
n
Battery Management Systems (BMS)
n
LED lighting
n
Power tools
SF-1206HIxxxM Series - High Inrush Multilayer Surface Mount Fuses
Environmental Characteristics
Operating Temperature................................................................................................................................................................ -55 °C to +150 °C
Storage Conditions
Temperature .............................................................................................................................................................................. +5 °C to +35 °C
Humidity.........................................................................................................................................................................................40 % to 75 %
Shelf Life..........................................................................................................................................................2 years from manufacturing date
ESD Classification (HBM)............................................................................................................................................................................ Class 6
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SinglFuse™
Product Designator
SF - 1206 HI 100 M - 2
Construction
MASKING LAYER
MARKING
FUSE ELEMENT
CERAMIC
BODY
TERMINATION
R
RATED CURRENT (A)
M = 4.00
E = 1.00
T = 4.50
G = 1.50
N = 5.00
I = 2.00
O = 6.00
J = 2.50
P = 7.00
K = 3.00
R = 8.00
L = 3.50
SMD Footprint
1206 = 3216 (EIA 1206) size
Fuse Blow Type
HI = High Inrush Capability
Rated Current
100 ~ 800 (1.0 A ~ 8.0 A)
Structure Type
M = Multilayer
MARKING
MASKING LAYER
Packaging Type
- 2 = Tape & Reel
Packaging Quantity
3,000 pieces per 7-inch reel
Product Dimensions
3.20 ± 0.20
(.126 ± .008)
1.60 ± 0.20
(.063 ± .008)
1.60 ± 0.20
(.063 ± .008)
0.97 ± 0.20
(.038 ± .008)
Recommended Pad Layout
MM
DIMENSIONS:
(INCHES)
1.50
(.059)
1.80
(.071)
0.51 ± 0.25
(.020 ± .010)
4.40
(.173)
Current Rating Thermal Derating Curve
110
105
100
95
90
85
80
75
70
65
60
55
50
-55
DERATING (%)
-35
-15
5
25
45
65
85
105
125
145
165
MAXIMUM OPERATING TEMPERATURE (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-1206HIxxxM Series - High Inrush Multilayer Surface Mount Fuses
Solder Reflow Recommendations
Profile Feature
Preheat / Soak:
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Ramp Up Rate (T
L
to T
p
)
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Pb-Free Assembly
150 °C
200 °C
60~120 seconds
3 °C / second max.
217 °C
60~150 seconds
260 °C
Tp
TP
T
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
L
Tsmax
PREHEAT AREA
UP RATE = 3 °C/s
MAX. RAMP
tp
tL
tp
Tc -5 °C
TC -5 °C
TEMPERATURE (°C)
MAX. RAMP DOWN RATE = 6 °C/s
PREHEAT AREA
ts
TL
Tsmin
Tsmax
tL
TEMPERATURE (°C)
Tsmin
25
Ts
TIME 25 °C TO PEAK
Time (t
p
)* within 5 °C of the
specified classification temperature 30 seconds*
(T
c
)
Ramp Down Rate (T
p
to T
L
)
Time 25 °C to Peak Temperature
25
TIME
TIME 25 °C TO PEAK
6 °C / second max.
8 minutes max.
TIME
260
Recommended Temperature Profile for Wave Soldering
10 sec. max.
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.
TEMPERATURE (°C)
260
150
PREHEATING
10 sec. max.
Wave soldering is suitable for 1206 size models.
TEMPERATURE (°C)
150
PREHEATING
120 seconds
TIME
120 seconds
TIME
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-1206HIxxxM Series - High Inrush Multilayer Surface Mount Fuses
3312 - 2 mm SMD Trimming Potentiometer
Average Pre-Arcing Time vs. Current Curves
3.50
3.50 A
A
3.00
3.00 A
A
2.50
2.50 A
A
2.00
2.00 A
A
1.50
1.50 A
A
1.00
1.00 A
A
4.00 A
4.00 A
4.50 A
4.50 A
5.00 A
5.00 A
6.00 A
6.00 A
7.00 A
7.00 A
8.00 A
8.00 A
Average I
2
t vs. t Curves
1000
1000
100000
100000
10000
10000
100
100
8.00 A
8.00 A
7.00 A
7.00 A
6.00 A
6.00 A
5.00 A
5.00 A
4.50 A
4.50 A
4.00 A
4.00 A
3.50 A
3.50 A
3.00 A
3.00 A
2.50 A
2.50 A
2.00 A
2.00 A
1.50 A
1.50 A
1.00 A
1.00 A
1000
1000
10
10
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)
100
100
I
2
t (A
2
s)
I
2
t (A
2
s)
10
1
1
1
10
1
0.1
0.1
0.1
0.1
0.01
0.01
0.01
0.01
0.001
0.001
1
1
10
10
100
100
0.001
0.001
0.001
0.001
0.01
0.01
0.1
0.1
1
1
10
10
100
100
1000
1000
CURRENT (A)
(A)
CURRENT
TIME (SECONDS)
TIME (SECONDS)
REV. A 04/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-1206HIxxxM Series Tape and Reel Packaging Specifications
3312 - 2 mm SMD Trimming Potentiometer
Tape Dimensions
W
P0
P1
P2
A0
B0
F
E1
D0
K0
T
PACKAGING: Plastic tape, 3,000 pcs. per reel
0.8
0.6
0.4
0.2
SF-1206HIxxxM Series
per EIA 481-2
8.00 ± 0.10
(.315 ± .004)
4.0 ± 0.10
(.157 ± .004)
4.0 ± 0.10
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
1.80 ± 0.10
(.071 ± .004)
3.50 ± 0.10
(.138 ± .004)
3.50 ± 0.05
(.138 ± .002)
1.75 ± 0.10
(.069 ± .004)
1.50 + 0.10
(.059 + .004)
1.10 + 0.10
(.043 + .004)
0.23 ± 0.02
(.009 ± .001)
13.40 ± 0.50
(.539 ± .020)
60.20 ± 0.50
(2.370 ± .020)
DIA.
2.20 ± 0.30
(.087 ± .012)
178.00 ± 1.00
(7.008 ± .039)
DIA.
13.20 +0.3/-0.2
(.520 +.012/-.008)
DIA.
E
F
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[详细]
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
