*** Resistance value measured with ≤10 % rated current at 25 °C ambient.
**** Melting I
2
t calculated at 0.001 second pre-arcing time.
Reliability Testing
I
No.
1
2
3
4
5
6
7
8
9
Test
Reflow and bend
Solderability
Soldering heat
resistance
Moisture resistance
Salt spray
Mechanical vibration
Mechanical shock
Thermal Shock
Life
Agency Recognition
n
Surface mount packaging for automated assembly
SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses
Fusing Time
Resistance
(Ω) Typ.***
0.050
0.043
0.032
0.028
0.022
0.020
0.018
0.016
0.013
0.010
0.0092
0.0084
0.0050
0.0041
0.0035
Rated
Voltage
Interrupting
Rating
DC 65 V
DC 65 V
50 A
DC 32 V
DC 32 V
50 A
Typical
I t (A
2
s) ****
0.37
0.52
0.88
1.10
1.90
2.20
2.60
3.30
5.40
8.90
10.40
13.50
11.20
15.00
24.50
2
Requirement
Test Condition
DCR change ≤ 20 % (≤ 10 % for ≤1 A) 3 reflows at 245 °C followed by a
No mechanical damage
2 mm bend
Minimum 90 % coverage
One dip at 245 °C for 5 seconds
Test Reference
Refer to STP
document
MIL-STD-202
Method 208
MIL-STD-202
Method 210
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
MIL-STD-202
Method 107
DCR change ≤ 20 % (≤ 10 % for ≤1 A)
One dip at 260 °C for 10 seconds
New solder coverage ≤ 75 %
DCR change ≤ ±15 %
No excessive corrosion
DCR change ≤ ±10 %
No excessive corrosion
10 cycles
48 hour exposure, 5 % salt solution
0.4 inch D.A. or 30 G between
5-3000 Hz
1500 G, 0.5 ms, half-sine shocks
100 cycles between -65 °C and +125 °C
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
No electrical “opens” during testing
Voltage drop change shall be less
than ±20 % of initial value
80 % rated current (75 % for < 1 A fuses)
Refer to STP
for 2000 hours at ambient temperature
document
+25 °C
UL File Number .................................................... E198545
http://www.ul.com/ Follow link to Online Certificates Directory,
then enter UL File No. E198545, or
click here
* RoHS Directive 2015/863, Mar 31, 2015 and Annex..
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content
is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the
total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different
applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SinglFuse
™
SF-1206SxxxW Series Applications
n
LCD monitors
n
Backlight drivers
n
Set top boxes
n
DC/DC converters
n
Notebooks / ultrabooks
n
Low voltage lighting power
n
Industrial controllers
SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses
Environmental Characteristics
Operating Temperature................................................................................................................................................................ -55 °C to +125 °C
Storage Conditions
Temperature .............................................................................................................................................................................. +5 °C to +35 °C
Humidity.........................................................................................................................................................................................40 % to 75 %
Shelf Life..........................................................................................................................................................2 years from manufacturing date
ESD Classification (HBM)............................................................................................................................................................................ Class 6
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SinglFuse™
Product Designator
SF - 1206 S 150 W - 2
Construction
FR4 PCB
Cu/Ni/Sn
TERMINATION
G
RATED CURRENT (A)
G = 1.50
N = 5.00
T = 1.60
O = 6.30
I = 2.00
P = 7.00
J = 2.50
R = 8.00
K = 3.00
Q = 10.00
V = 3.15
X = 12.00
L = 3.50
Y = 15.00
M = 4.00
SMD Footprint
1206 = 3216 (EIA1206) size
Fuse Blow Type
S = Slow Blow
Rated Current
150 ~ 1500 (1.50 A ~ 15.00 A)
Structure Type
W = Wire Core
FUSE ELEMENT
(Cu or Cu alloy)
Packaging Type
- 2 = Tape & Reel
Packaging Quantity
3,500 pieces per 7-inch reel
Product Dimensions
3.20 ± 0.20
3.20 ± 0.20
(.126 ± .008)
(.126 ± .008)
Recommended Pad Layout
MM
DIMENSIONS:
(INCHES)
1.50
1.50
(.059)
(.059)
1.80
1.80
(.071)
(.071)
1.08 ± 0.15
1.08 ± 0.15
(.042 ± .006)
(.042 ± .006)
1.60 + 0.30 / - /0.20
1.60 + 0.30 - 0.20
(.063 + .012 / - /.004)
(.063 + .012 - .004)
4.40
4.40
(.173)
(.173)
0.85 ± 0.30
0.85 ± 0.30
(.033 ± .012)
(.033 ± .012)
0.85 ± 0.30
0.85 ± 0.30
(.033 ± .012)
(.033 ± .012)
0.85 ± 0.30
0.85 ± 0.30
(.033 ± .012)
(.033 ± .012)
0.85 ± 0.30
0.85 ± 0.30
(.033 ± .012)
(.033 ± .012)
Current Rating Thermal Derating Curve
105
100
95
DERATING (%)
90
85
80
75
70
65
60
55
50
-55
-35
-15
5
25
45
65
85
105
125
MAXIMUM OPERATING TEMPERATURE (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses
Solder Reflow Recommendations
Profile Feature
Preheat / Soak:
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Ramp Up Rate (T
L
to T
p
)
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Pb-Free Assembly
150 °C
200 °C
60~120 seconds
3 °C / second max.
217 °C
60~150 seconds
260 °C
Tp
TP
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
TL
Tsmax
tp
tL
tp
Tc -5 °C
MAX. RAMP DOWN RATE = 6 °C/s
PREHEAT AREA
ts
MAX. RAMP
PREHEAT AREA
UP RATE = 3 °C/s
TC -5 °C
TEMPERATURE (°C)
TL
Tsmax
T
smin
tL
TEMPERATURE (°C)
Tsmin
25
Ts
TIME 25 °C TO PEAK
Time (t
p
)* within 5 °C of the
specified classification temperature 30 seconds*
(T
c
)
Ramp Down Rate (T
p
to T
L
)
Time 25 °C to Peak Temperature
25
TIME
TIME 25 °C TO PEAK
6 °C / second max.
8 minutes max.
TIME
Recommended Temperature Profile for Wave Soldering
260
10 sec. max.
10 sec. max.
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.
TEMPERATURE (°C)
260
150
PREHEATING
Wave soldering is suitable for 1206 size models.
TEMPERATURE (°C)
150
PREHEATING
120 seconds
TIME
120 seconds
TIME
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses
3312 - 2 mm SMD Trimming Potentiometer
Average Pre-Arcing Time vs. Current Curves
4.00 A
4.00 A
3.50 A
3.50 A
3.15
3.15 A
A
3.00
3.00 A
A
2.50
2.50 A
A
2.00
2.00 A
A
1.60
1.60 A
A
1.50
1.50 A
A
5.00
5.00 A
A
6.30
6.30 A
A
7.00
7.00 A
A
8.00 A
8.00 A
10.00
10.00 A
A
12.00
12.00 A
A
15.00
15.00 A
A
Average I
2
t vs. t Curves
10
10
10000
10000
15.00
15.00 A
A
12.00
12.00 A
A
10.00 A
10.00 A
8.00 A
8.00 A
7.00 A
7.00 A
6.30 A
6.30 A
5.00 A
5.00 A
4.00 A
4.00 A
3.50 A
3.50 A
3.15 A
3.15 A
3.00 A
3.00 A
2.50 A
2.50 A
2.00 A
2.00 A
1.60 A
1.60 A
1.50 A
1.50 A
1
1
1000
1000
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)
0.01
0.01
I
2
t (A
2
s)
I
2
t (A
2
s)
1
0.1
0.1
100
100
10
10
0.001
0.001
1
0.0001
0.0001
1
1
10
10
100
100
1000
1000
0.1
0.1
0.0001
0.0001
0.001
0.001
0.01
0.01
0.1
0.1
1
1
10
10
CURRENT (A)
(A)
CURRENT
TIME (SECONDS)
TIME (SECONDS)
Asia-Pacific:
Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA:
Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
REV. A 03/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-1206SxxxW Series Tape and Reel Packaging Specifications
3312 - 2 mm SMD Trimming Potentiometer
Tape Dimensions
W
P0
P1
P2
A0
B0
F
E1
D0
K0
T
PACKAGING: Plastic tape, 3,500 pcs. per reel
0.8
0.6
0.4
0.2
SF-1206SxxxW Series
per EIA 481-2
8.10 ± 0.20
(.319 ± .008)
4.0 ± 0.10
(.157 ± .004)
4.0 ± 0.10
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
2.05 ± 0.10
(.081 ± .004)
3.50 ± 0.10
(.138 ± .004)
3.50 ± 0.05
(.138 ± .002)
1.75 ± 0.10
(.069 ± .004)
1.50 + 0.10
(.059 + .004)
1.30 ± 0.10
(.051 ± .004)
0.22 ± 0.05
(.009 ± .002)
13.40 ± 0.50
(.539 ± .020)
60.20 ± 0.50
(2.370 ± .020)
DIA.
2.20 ± 0.30
(.087 ± .012)
178.00 ± 1.00
(7.008 ± .039)
DIA.
13.20 +0.3/-0.2
(.520 +.012/-.008)
DIA.
E1
F
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
语音作为自然的人机接口，可以使车载导航系统实现更安全、更人性化的操作。通过国内外车载导航系统的功能对比可知，支持语音交互是车载导航系统的一个发展趋势。另外，市场信息服务公司J.D Power and Associates的调研数据也表明，56％的消费者更倾向于选择声控的导航系统。因此，开发车载语音导航系统是很有意义的。目前，国内已经具备开发车载语音导航系统的技术基础，特别是文语转换TTS技术...[详细]
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
