SF-2410FPxxxW Series - Fast Acting Precision Wire Core Surface Mount Fuses
Model
SF-2410FP050W-2
SF-2410FP063W-2
SF-2410FP075W-2
SF-2410FP100W-2
SF-2410FP125W-2
SF-2410FP150W-2
SF-2410FP200W-2
SF-2410FP250W-2
SF-2410FP300W-2
SF-2410FP315W-2
SF-2410FP350W-2
SF-2410FP400W-2
SF-2410FP500W-2
SF-2410FP630W-2
SF-2410FP700W-2
SF-2410FP800W-2
SF-2410FP1000W-2
Rated Current
(Amps)
0.50
0.63
0.75
1.00
1.25
1.50
2.00
2.50
3.00
3.15
3.50
4.00
5.00
6.30
7.00
8.00
10.00
C
Fusing Time
Open within 5
sec. at 200 %
rated current
Resistance
(Ω) Typ.***
0.231
0.174
0.148
0.093
0.070
0.062
0.042
0.031
0.0249
0.0232
0.022
0.0172
0.0143
0.010
0.0094
0.0086
0.0066
Rated
Voltage
Interrupting
Rating
AC 250 V 100 A
DC 125 V 50 A
DC 32 V 300 A
AC 250 V
DC 125 V
AC 125 V
DC 125 V
AC 125 V 50 A
DC 125 V 50 A
DC 32 V 300 A
AC 125 V 35 A
DC 125 V 50 A
DC 32 V 300 A
Typical
I t (A
2
s) ****
0.10
0.16
0.23
0.59
0.96
1.19
2.75
1.21
1.73
2.20
2.50
4.10
5.90
12.50
14.20
20.30
2
LE
AD
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
29.20
*** Resistance value measured with ≤10 % rated current at 25 °C ambient.
**** Melting I
2
t calculated at 0.001 second pre-arcing time.
Reliability Testing
No.
1
2
3
4
5
6
7
8
9
Test
Reflow and bend
Solderability
Soldering heat
resistance
Moisture resistance
Salt spray
Mechanical vibration
Mechanical shock
Thermal Shock
Life
Requirement
Test Condition
DCR change ≤ 20 % (≤ 10 % for ≤1 A) 3 reflows at 245 °C followed by a
No mechanical damage
2 mm bend
Test Reference
Refer to STP
document
MIL-STD-202
Minimum 90 % coverage
One dip at 245 °C for 5 seconds
Method 208
DCR change ≤ 20 % (≤ 10 % for ≤1 A)
MIL-STD-202
One dip at 260 °C for 10 seconds
New solder coverage ≤ 75 %
Method 210
DCR change ≤ ±15 %
MIL-STD-202
10 cycles
No excessive corrosion
Method 106
DCR change ≤ ±10 %
MIL-STD-202
48 hour exposure, 5 % salt solution
No excessive corrosion
Method 101
DCR change ≤ ±10 %
0.4 inch D.A. or 30 G between
MIL-STD-202
No mechanical damage
5-3000 Hz
Method 204
DCR change ≤ ±10 %
MIL-STD-202
1500 G, 0.5 ms, half-sine shocks
No mechanical damage
Method 213
DCR change ≤ ±10 %
MIL-STD-202
100 cycles between -65 °C and +125 °C
No mechanical damage
Method 107
No electrical “opens” during testing
Voltage drop change shall be less
than ±20 % of initial value
80 % rated current (75 % for < 1 A fuses)
Refer to STP
for 2000 hours at ambient temperature
document
+25 °C
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in
their specific applications.
SinglFuse
™
SF-2410FPxxxW Series Applications
n
LCD / LED TVs
n
White goods
n
PC servers
n
LCD monitors
n
DC/DC converters
n
DC/AC inverters
n
Notebooks / ultrabooks
n
Telecom systems
n
Chargers
SF-2410FPxxxW Series - Fast Acting Precision Wire Core Surface Mount Fuses
Environmental Characteristics
Agency Recognition
UL File Number ............................E198545
http://www.ul.com/ Follow link to Online
Certificates Directory,
then enter UL File No.
E198545, or click
here
Operating Temperature................................................................................. -55 °C to +125 °C
Storage Conditions
Temperature ............................................................................................... +5 °C to +35 °C
Humidity.......................................................................................................... 40 % to 75 %
Shelf Life...........................................................................2 years from manufacturing date
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-2410FPxxxW Series - Fast Acting Precision Wire Core Surface Mount Fuses
Current Rating Thermal Derating Curve
110
105
100
95
90
85
80
75
70
65
60
55
50
-55
DERATING (%)
-35
-15
5
25
45
65
85
105
125
MAXIMUM OPERATING TEMPERATURE (°C)
Solder Reflow Recommendations
Profile Feature
Preheat / Soak:
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Ramp Up Rate (T
L
to T
p
)
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Pb-Free Assembly
150 °C
200 °C
60~120 seconds
3 °C / second max.
217 °C
60~150 seconds
260 °C
Tp
TP
TL
Tsmax
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
tp
Tc -5 °C
TEMPERATURE (°C)
TL
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
PREHEAT AREA
PREHEAT AREA
tL
tp
TC -5 °C
Tsmax
TEMPERATURE (°C)
Tsmin
tL
Tsmin
ts
Ts
25
TIME 25 °C TO PEAK
25
Time (t
p
)* within 5 °C of the
specified classification temperature 30 seconds*
(T
c
)
Ramp Down Rate (T
p
to T
L
)
Time 25 °C to Peak Temperature
TIME
TIME 25 °C TO PEAK
6 °C / second max.
8 minutes max.
TIME
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.
10 sec. max.
Recommended Temperature Profile for Wave Soldering
260
TEMPERATURE (°C)
260
150
PREHEATING
10 sec. max.
Wave soldering is suitable for 2410 size models.
TEMPERATURE (°C)
150
PREHEATING
120 seconds
TIME
120 seconds
TIME
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-2410FPxxxW Series - Fast Acting Precision Wire Core Surface Mount Fuses
3312 - 2 mm SMD Trimming Potentiometer
Average Pre-Arcing Time vs. Current Curves
3.00
3.00 A
A
2.50
2.50 A
A
2.00
2.00 A
A
1.50
1.50 A
A
1.25
1.25 A
A
1.00
1.00 A
A
0.75
0.75 A
A
0.63
0.63 A
A
0.50
0.50 A
A
3.15
3.15 A
A
3.50
3.50 A
A
4.00
4.00 A
A
5.00
5.00 A
A
6.30
6.30 A
A
7.00
7.00 A
A
8.00
8.00 A
A
10.00
10.00 A
A
Average I
2
t vs. t Curves
100
100
100000
100000
10.00 A
10.00 A
8.00 A
8.00 A
7.00 A
7.00 A
6.30 A
6.30 A
5.00 A
5.00 A
4.00 A
4.00 A
3.50 A
3.50 A
3.15 A
3.15 A
3.00 A
3.00 A
2.50 A
2.50 A
2.00 A
2.00 A
1.50 A
1.50 A
1.25 A
1.25 A
1.00 A
1.00 A
0.75 A
0.75 A
0.63 A
0.63 A
0.50 A
0.50 A
10000
10000
10
10
1000
1000
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)
0.1
0.1
I
2
t (A
2
s)
I
2
t (A
2
s)
1
1
1
100
100
10
10
1
0.01
0.01
0.1
0.1
0.001
0.001
0.1
0.1
1
1
10
10
100
100
1000
1000
0.01
0.01
0.001
0.001
0.01
0.01
0.1
0.1
1
1
10
10
100
100
CURRENT (A)
(A)
CURRENT
TIME (SECONDS)
TIME (SECONDS)
Asia-Pacific:
Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA:
Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
REV. A 04/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-2410FPxxxW Series Tape and Reel Packaging Specifications
3312 - 2 mm SMD Trimming Potentiometer
Tape Dimensions
W
P0
P1
P2
A0
B0
F
E
D0
D1
K0
T
PACKAGING: Plastic tape, 2,000 pcs. per reel
0.8
0.6
0.4
0.2
SF-2410FPxxxW Series
per EIA 481-2
12.00 ± 0.10
(.48 ± .004)
4.0 ± 0.10
(.157 ± .004)
4.0 ± 0.10
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
2.85 ± 0.10
(.114 ± .004)
6.40 ± 0.10
(.256 ± .004)
5.50 ± 0.10
(.220 ± .004)
1.75 ± 0.10
(.069 ± .004)
1.55 ± 0.10
(.059 ± .004)
1.55 ± 0.10
(.059 ± .004)
2.35 ± 0.10
(.094 ± .004)
0.25 ± 0.05
(.010 ± .002)
13.40 ± 0.50
(.539 ± .020)
60.20 ± 0.50
(2.370 ± .020)
DIA.
2.20 ± 0.30
(.087 ± .012)
178.00 ± 1.00
(7.008 ± .039)
DIA.
13.20 +0.3/-0.2
(.520 +.012/-.008)
DIA.
E
F
D1
P1
DIRECTION OF UNREELING
AO
KO
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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