C
O
LO & MP
LI
GE
AN
N
T
FR
EE
SinglFuse
™
SF-1206SxxxM Series Features
n
Single blow fuse for overcurrent protection
n
3216 (EIA 1206) miniature footprint
n
Slow blow fuse (Fusing time ≤5 seconds at 250 % rated current)
n
UL 248-14 listed
n
Surface mount packaging for automated assembly
n
Multilayer SMD design
PL
IA
N
**
HA
*R
oH
S
T
Electrical Characteristics
F
RE
E
Model
SF-1206S050M-2
SF-1206S075M-2
SF-1206S100M-2
SF-1206S150M-2
SF-1206S175M-2
SF-1206S200M-2
SF-1206S250M-2
SF-1206S300M-2
SF-1206S400M-2
SF-1206S500M-2
SF-1206S600M-2
SF-1206S700M-2
SF-1206S800M-2
*** Resistance value measured with ≤10 % rated current at 25 °C ambient.
****Melting I
2
t calculated at 0.001 second pre-arcing time.
Rated Current
(Amps)
0.50
0.75
1.00
1.50
1.75
2.00
2.50
3.00
4.00
5.00
6.00
7.00
8.00
*R
oH
S
C
OM
LE
AD
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Reliability Testing
No.
1
2
3
4
5
6
7
8
Test
Soldering heat
resistance
Solderability
Thermal shock
Moisture resistance
Salt spray
Mechanical vibration
Mechanical shock
Life
Requirement
DCR change ≤ ±10 %
No mechanical damage
Minimum 95 % coverage
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±15 %
No excessive corrosion
DCR change ≤ ±10 %
No excessive corrosion
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
No electrical “opens” during testing.
Voltage drop change shall be less than
±20 % of initial value.
Test Condition
One dip at 260 °C for 60 seconds
One dip at 245 °C for 5 seconds
100 cycles between -65 °C and +125 °C
10 cycles
48 hour exposure, 5 % salt solution
0.4 inch D.A. or 30 G between
5-3000 Hz
1500 G, 0.5 ms, half-sine shocks
80 % rated current (75 % for ≤1 A fuses)
for 2000 hours at ambient temperature
+20 °C ~ +30 °C
Test Reference
MIL-STD-202
Method 210
MIL-STD-202
Method 208
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
Refer to STP
document
Environmental Characteristics
Operating Temperature........................................... -55 °C to +125 °C
Storage Conditions
Temperature ..........................................................+5 °C to +35 °C
Humidity.................................................................... 40 % to 75 %
Shelf Life..................................... 2 years from manufacturing date
Moisture Sensitivity Level ..................................................................1
ESD Classification (HBM)........................................................Class 6
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU
June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm
or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different
applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
D
n
RoHS compliant* and halogen free**
SF-1206SxxxM Series - Slow Blow Multilayer Surface Mount Fuses
Fusing Time
Open within 5
sec. at 250 %
rated current
Resistance
(Ω) Typ.***
0.730
0.513
0.220
0.120
0.100
0.050
0.035
0.031
0.022
0.015
0.013
0.011
0.008
Rated
Voltage
Interrupting Rating
(Ω) Typ.***
DC 63 V
DC 63 V
50 A
DC 32 V
50 A
DC 32 V
DC 32 V
45 A
Typical
I
2
t (A
2
s) ****
0.002
0.005
0.011
0.024
0.045
0.075
0.110
0.210
0.350
0.600
1.000
1.600
2.300
Agency Recognition
UL File Number .................................................... E198545
http://www.ul.com/ Follow link to Online Certificates Directory,
then enter UL File No. E198545, or
click here
Asia-Pacific:
Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA:
Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
SinglFuse
™
SF-1206SxxxM Series Applications
n
Portable memory
n
LCD monitors
n
Disk drives
n
PDAs
n
Digital cameras
n
MP3 players
n
Cell phones
n
Rechargeable battery packs
n
Battery chargers
n
Set-top boxes
n
Industrial controllers
n
Battery Management Systems (BMS)
n
LED lighting
n
Power tools
SF-1206SxxxM Series - Slow Blow Multilayer Surface Mount Fuses
Typical Part Marking
How to Order
SinglFuse™
Product Designator
Represents total content. Layout may
vary.
SF - 1206 S 100 M - 2
Construction
MASKING LAYER
MARKING
FUSE ELEMENT
CERAMIC
BODY
TERMINATION
D
RATED CURRENT (A)
K = 3.00
C = 0.50
M = 4.00
D = 0.75
N = 5.00
E = 1.00
+ = 6.00
G = 1.50
– = 7.00
H = 1.75
= = 8.00
I = 2.00
J = 2.50
SMD Footprint
1206 = 3216 (EIA 1206) size
Fuse Blow Type
S = Slow blow
MARKING
MASKING LAYER
Rated Current
050 ~ 800 (0.50 A - 8.00 A)
Structure Type
M = Multilayer
Packaging Quantity
.....................3,000 pieces per 7 inch reel
Packaging Type
- 2 = Tape & Reel
Product Dimensions
3.20 ± 0.20
(.126 ± .008)
1.60 ± 0.20
(.063 ± .008)
1.60 ± 0.20
(.063 ± .008)
0.97 ± 0.20
(.038 ± .008)
Recommended Pad Layout
1.50
(.059)
1.80
(.071)
0.51 ± 0.25
(.020 ± .010)
4.40
(.173)
MM
DIMENSIONS:
(INCHES)
Current Rating Thermal Derating Curve
105
100
95
DERATING (%)
90
85
80
75
70
65
60
55
50
-55
-35
-15
5
25
45
65
85
105
125
MAXIMUM OPERATING TEMPERATURE (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-1206SxxxM Series - Slow Blow Multilayer Surface Mount Fuses
Solder Reflow Recommendations
Tp
TP
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP UP
= 6 °C/s
MAX. RAMP DOWN RATE
RATE = 3 °C/s
tp
Tc -5 °C
TL
MAX. RAMP DOWN RATE = 6 °C/s
PREHEAT AREA
tp
TL
Tsmax
TEMPERATURE (°C)
TEMPERATURE (°C)
Tsmax
PREHEAT AREA
tL
Profile Feature
Preheat / Soak:
TC -5 °C
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Ramp Up Rate (T
L
to T
p
)
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Pb-Free Assembly
150 °C
200 °C
60~120 seconds
3 °C / second max.
217 °C
60~150 seconds
260 °C
30 seconds*
6 °C / second max.
8 minutes max.
tL
Tsmin
Tsmin
ts
Ts
25
25
TIME 25 °C TO PEAK
Time (t
p
)* within 5 °C of the
specified classification temperature
(T
c
)
Ramp Down Rate (T
p
to T
L
)
Time 25 °C to Peak Temperature
TIME 25 °C TO PEAK
TIME
TIME
*Tolerance for peak profile temperature (T
p
) is defined as a
supplier minimum and a user maximum.
Recommended Temperature Profile for Wave Soldering
260
10 sec. max.
Wave soldering is suitable for 1206 size models.
TEMPERATURE (°C)
150
PREHEATING
120 seconds
TIME
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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