Switching Voltage Regulators No Rsense, Low EMI DC/DC Controller in MSE
参数名称 | 属性值 |
Brand Name | Analog Devices Inc |
是否无铅 | 含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ADI(亚德诺半导体) |
包装说明 | LEAD FREE, PLASTIC, MSOP-10 |
针数 | 10 |
制造商包装代码 | 05-08-1664 |
Reach Compliance Code | compliant |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 9.8 V |
最小输入电压 | 2.75 V |
标称输入电压 | 4.2 V |
JESD-30 代码 | S-PDSO-G10 |
JESD-609代码 | e3 |
长度 | 3 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 10 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出电流 | 1 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
表面贴装 | YES |
切换器配置 | PUSH-PULL |
最大切换频率 | 600 kHz |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3 mm |
Base Number Matches | 1 |
LTC3809EMSE-1#TRPBF | LTC3809EMSE-1#TR | LTC3809IDD-1#TRPBF | LTC3809EMSE-1#PBF | LTC3809EDD-1#TR | |
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描述 | Switching Voltage Regulators No Rsense, Low EMI DC/DC Controller in MSE | Switching Voltage Regulators LTC3809-1 - No Rsense, Low Input Voltage, Synchronous DC/DC Controller with Output Tracking | 开关稳压器 No Rsense, Low Input Voltage, Synchronous DC/DC Controller with Output Tracking | 开关稳压器 No Rsense, Low EMI DC/DC Controller in MSE | 开关稳压器 LTC3809-1 - No Rsense, Low Input Voltage, Synchronous DC/DC Controller with Output Tracking |
是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
包装说明 | LEAD FREE, PLASTIC, MSOP-10 | TSSOP, | HVQCCN, | LEAD FREE, PLASTIC, MSOP-10 | HVQCCN, |
Reach Compliance Code | compliant | not_compliant | compliant | compliant | not_compliant |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | 9.8 V | 9.8 V | 9.8 V | 9.8 V | 9.8 V |
最小输入电压 | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V |
标称输入电压 | 4.2 V | 4.2 V | 4.2 V | 4.2 V | 4.2 V |
JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PQCC-N10 | S-PDSO-G10 | S-PQCC-N10 |
JESD-609代码 | e3 | e0 | e3 | e3 | e0 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 10 | 10 | 10 | 10 | 10 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
最大输出电流 | 1 A | 1 A | 1 A | 1 A | 1 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | HVQCCN | TSSOP | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 235 | 260 | 250 | 235 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm |
表面贴装 | YES | YES | YES | YES | YES |
切换器配置 | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL |
最大切换频率 | 600 kHz | 600 kHz | 600 kHz | 600 kHz | 600 kHz |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | MATTE TIN | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD |
处于峰值回流温度下的最长时间 | 30 | 20 | 30 | NOT SPECIFIED | 20 |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
Brand Name | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc | - |
是否无铅 | 含铅 | - | 含铅 | 含铅 | - |
针数 | 10 | - | 10 | 10 | - |
制造商包装代码 | 05-08-1664 | - | 05-08-1699 | 05-08-1664 | - |
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